Abstract:
A nonvolatile semiconductor storage device includes a memory cell array and a reference cell providing a reference level with which data of the memory cell array is compared with so as to determine whether the data of the memory cell array is in an over-programmed state.
Abstract:
In a non-volatile SONOS-type memory device having a charge storing layer disposed between top and bottom dielectric layers, a method of programming the memory device includes selectively storing charge in an upper portion of the charge storing layer. The method includes performing a channel hot electron injection procedure followed by a soft erase operation in which charge within a bottom portion of the first charging cell is removed. A verification procedure is performed to determine whether at least one charge storing cell is in a programmed state. The method provides a programmed cell in which the stored charge is disposed adjacent an upper portion of the cell near the top dielectric.
Abstract:
A nonvolatile semiconductor storage device includes a memory cell array and a reference cell providing a reference level with which data of the memory cell array is compared with so as to determine whether the data of the memory cell array is in an over-programmed state.
Abstract:
A method and an integrated circuit for performing a soft program after erase provides efficient convergence of over-erased floating gate memory cells disposed in bit lines. The soft program is applied to successive subject bit lines. The BLISP method includes selection of a selected bit line and applying the soft program to a subject bit line corresponding to the selected bit line. For integrated circuits having no defective bit lines, the subject bit lines comprise the selected bit lines. The BLISP method is adapted for low current consumption compared to bulk soft programming methods. In some embodiments, the integrated circuit includes defective bit lines. For these integrated circuits, the selection of the selected bit line includes indicating a bit line type corresponding to the selected bit line. The defective bit lines are logically replaced by redundant bit lines so that the soft program is applied to conforming selected bit lines and redundant bit lines corresponding to defective bit lines. The defective bit lines in the first memory array can be disabled during the soft program and replaced by corresponding redundant bit lines disposed in the second memory array, so that the soft program is not applied to the defective bit lines. By preventing application of the soft program to the defective bit lines, the BLISP method avoids consumption of excessive current that would otherwise be consumed by very low threshold voltage memory cells disposed on the defective bit lines. The excessive current would render the soft program method much less efficient.
Abstract:
After decreasing the threshold voltages of a plurality of memory cells collectively or selectively, the presence or absence of any memory cell of which the threshold voltage has dropped below a predetermined voltage verified collectively for each of memory cell groups connected to word line (low-threshold value verification) , and any memory cell of which the threshold voltage has excessively dropped is selectively written. Also, the well of each of memory cell is formed in the region of an element isolation layer for isolating it from the substrate of a memory apparatus, and a negative voltage is supplied to the memory well distributively with a positive voltage applied as a word line voltage, thus supplying them as erase operation voltages. The absolute value of the memory well voltage is set substantially equal to or lower than the word line voltage for the read operation. Sectors constituting each memory mat includes a sector (selected sector) selected for the erase operation with each word line thereof supplied with a positive voltage, a sector (non-selected sector) not selected for the erase operation with a word line voltage different from a memory well voltage, and further a sector (completely non-selected sector) not selected for the erase operation with a word line voltage equal to the voltage between a source and a drain of the memory cell.
Abstract:
The present invention provides a method for preventing sub-threshold leakage in flash EPROM cells during Vt repair, read and verify operations. The present invention prevents sub-threshold leakage by either biasing the floating gate voltage of non-selected cells to a level that is less than the sources voltage. This biasing is achieved by controlling the voltages applied to such non-selected cells bitline and wordline voltages, or by floating the non-selected sourcelines to electrically disconnect the sourcelines of the non-selected cells. This method allows fast and accurate Vt repair of cells while avoiding Vt degradation of non-erased and repaired cells due to subthreshold current leakage, as well as reduced sub-threshold leakage during read and verify operations.
Abstract:
An EEPROM includes an array of memory cell transistors, which is divided into cell blocks each including NAND cell units of series-connected cell transistors. A sense amplifier is connected to bit lines and a comparator. A data-latch circuit is connected to the comparator, for latching a write-data supplied from a data input buffer. After desired cell transistors selected for programming in a selected block are once programmed, a write-verify operation is performed. The comparator compares the actual data read from one of the programmed cell transistors with the write-data, to verify its written state. The write-verify process checks the resulting threshold voltage for variations using first and second reference voltages defining the lower-limit and upper-limit of an allowable variation range. If the comparison results under employment of the first voltage shows that an irregularly written cell transistor remains with an insufficient threshold voltage which is so low as to fail to fall within the range, the write operation continues for the same cell transistor. If the comparison results under employment of the second voltage shows that an excess-written cell transistor remains, the block is rendered "protected" at least partially.
Abstract:
A semiconductor memory device and a method of operating the same are provided. The method of operating the semiconductor memory device includes determining a target word line coupled to an over-programmed memory cell, backing up data stored in memory cells coupled to the target word line in a second memory area, wherein the se second memory area is different from a first memory area where the memory cells coupled to the target word line are disposed, and applying a stepped-up read pass voltage to the target word line when a read operation is performed on a selected memory cell in a memory block coupled to the target word line, wherein the selected memory cell is different from the over-programmed memory cell. Therefore, the operation reliability of the semiconductor memory device is improved.
Abstract:
A nonvolatile semiconductor memory device includes a control circuit configured to control a soft program operation of setting nonvolatile memory cells to a first threshold voltage distribution state of the nonvolatile memory cells. When a characteristic of the nonvolatile memory cells is in a first state, the control circuit executes the soft program operation by applying a first voltage for setting the nonvolatile memory cells to the first threshold voltage distribution state to first word lines, and applying a second voltage higher than the first voltage to a second word line. When the characteristic of the nonvolatile memory cells is in a second state, the control circuit executes the soft program operation by applying a third voltage equal to or lower than the first voltage to the first word lines and applying a fourth voltage lower than the second voltage to the second word line.
Abstract:
Methods of operating nonvolatile memory devices may include identifying one or more multi-bit nonvolatile memory cells in a nonvolatile memory device that have undergone unintentional programming from an erased state to an at least partially programmed state. Errors generated during an operation to program a first plurality of multi-bit nonvolatile memory cells may be detected by performing a plurality of reading operations to generate error detection data and then decoding the error detection data to identify specific cells having errors. A programmed first plurality of multi-bit nonvolatile memory cells and a force-bit data vector, which was modified during the program operation, may be read to support error detection. This data, along with data read from a page buffer associated with the first plurality of multi-bit nonvolatile memory cells, may then be decoded to identify which of the first plurality of multi-bit nonvolatile memory cells are unintentionally programmed cells.