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公开(公告)号:US20230064223A1
公开(公告)日:2023-03-02
申请号:US17459697
申请日:2021-08-27
发明人: Te-Hsin Chiu , Shih-Wei Peng , Wei-Cheng Lin , Jiann-Tyng Tzeng
IPC分类号: H01L23/522 , H01L23/528 , H01L27/02 , H01L21/768
摘要: An integrated circuit structure is disclosed, including a gate, a first conductive line and a pair of second conductive lines, and a first feed-through via. The gate is disposed on a front side of the integrated circuit structure and extends in a first direction on a first side of a dielectric layer. The first conductive line and a pair of second conductive lines are disposed on a second side, opposite of the first side, of the dielectric layer and on a back side, opposite of the front side, of the integrated circuit structure. The first conductive line is interposed between the pair of second conductive lines in a layout view. The first feed-through via extends through the dielectric layer in a second direction different from the first direction. The first feed-through via couples the gate to the first conductive line.
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公开(公告)号:US20230008779A1
公开(公告)日:2023-01-12
申请号:US17371321
申请日:2021-07-09
发明人: Shih-Wei Peng , Jiann-Tyng Tzeng , Ken-Hsien Hsieh
IPC分类号: H01L23/528 , H01L27/085 , H01L27/092 , H01L21/768
摘要: A semiconductor structure includes: a first gate structure and a second gate structure extending in a first direction; a first base level metal interconnect (M0) pattern extending in a second direction perpendicular to the first direction; a second M0 pattern extending in the second direction; a third M0 pattern located between the first and second gate structures and extending in the first direction, two ends of the third M0 pattern connected to the first M0 pattern and the second M0 pattern, respectively; a fourth M0 pattern and a fifth M0 pattern located between the first and second M0 patterns and extending in the second direction. A distance between the fourth M0 pattern and the first M0 pattern in the first direction is equal to a minimum M0 pattern pitch, and a distance between the fourth M0 pattern and the second M0 pattern is equal to the minimum M0 pattern pitch.
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公开(公告)号:US20220352148A1
公开(公告)日:2022-11-03
申请号:US17245757
申请日:2021-04-30
发明人: Kam-Tou Sio , Jiann-Tyng Tzeng , Shih-Wei Peng
IPC分类号: H01L27/06 , H01L23/522 , H01L23/528 , H01L21/822
摘要: A monolithic three dimensional integrated circuit is provided. The monolithic three dimensional integrated circuit includes a first cell layer having a first cell having a first active component of the monolithic three dimensional integrated circuit. A second layer having a second cell including a second active component. The second cell layer is formed vertically above the first cell layer. The first cell layer having the first active component and the second cell layer having the second active component are formed on a single die. The first cell has a smaller metal pitch than the second cell. A buried via electrically couples the first active component of the first cell of the first cell layer with the second active component of the second cell of the second cell layer.
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公开(公告)号:US11374005B2
公开(公告)日:2022-06-28
申请号:US17075578
申请日:2020-10-20
发明人: Shih-Wei Peng , Te-Hsin Chiu , Wei-Cheng Lin , Jiann-Tyng Tzeng
IPC分类号: H01L21/02 , H01L21/8238 , H01L23/528 , H01L27/092 , H01L29/06 , H01L29/423 , H01L29/66 , H01L29/786
摘要: A semiconductor device includes a first transistor of a first conductivity type and a second transistor of a second conductivity type. The first transistor is arranged in a first layer and includes a gate extending in a first direction and a first active region extending in a second direction perpendicular to the first direction. The second transistor is arranged in a second layer over the first layer and includes the gate and a second active region extending in the second direction. The semiconductor device also includes a first conductive line arranged in a third layer between the first layer and the second layer and extending in the second direction, wherein the first conductive line is configured to electrically connect a first source/drain region of the first active region to a second source/drain region of the second active region.
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公开(公告)号:US20210366844A1
公开(公告)日:2021-11-25
申请号:US17393619
申请日:2021-08-04
发明人: Kam-Tou Sio , Chih-Ming Lai , Chun-Kuang Chen , Chih-Liang Chen , Charles Chew-Yuen Young , Chi-Yeh Yu , Jiann-Tyng Tzeng , Ru-Gun Liu , Wen-Hao Chen
IPC分类号: H01L23/00 , H01L23/528 , H01L23/522 , H01L23/485
摘要: The present disclosure relates to an integrated chip. The integrated chip includes a plurality of gate structures arranged over a substrate and between adjacent ones of a plurality of source/drain regions within the substrate. A plurality of conductive contacts are electrically coupled to the plurality of source/drain regions. A first interconnect wire is arranged over the plurality of conductive contacts, and a second interconnect wire arranged over the first interconnect wire. A via rail contacts the first interconnect wire and the second interconnect wire. The via rail has an outer sidewall that faces an outermost edge of the plurality of source/drain regions and that is laterally separated from the outermost edge of the plurality of source/drain regions by a non-zero distance. The outer sidewall of the via rail continuously extends past two or more of the plurality of gate structures.
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公开(公告)号:US11048848B2
公开(公告)日:2021-06-29
申请号:US16506501
申请日:2019-07-09
发明人: Shih-Wei Peng , Chun-Hung Liou , Jiann-Tyng Tzeng
IPC分类号: G06F30/392 , G03F1/70 , G03F1/36 , G06F30/398 , G06F30/394
摘要: A method (of generating a layout diagram) includes: for a first cell which includes first and second active area patterns, a cell-boundary (CB) having first and second edge portions (EPs) substantially parallel to a vertical direction (VEPs), and first and second VEP-adjacent regions correspondingly adjacent the first and second VEPs: configuring the first VEP-adjacent region (VAR) to be a first active area (AA) continuous (AA-continuous) region in which the first active area pattern extends in a horizontal direction from an interior of the first cell to the first VEP; and configuring the second VAR to be a first AA-discontinuous region, the second active area pattern extending in the horizontal direction from the interior of the first cell towards the second VEP, and there being a first gap between a first end of the second active area pattern and the second VEP representing the first AA-discontinuous region.
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公开(公告)号:US10977421B2
公开(公告)日:2021-04-13
申请号:US16793693
申请日:2020-02-18
发明人: Wei-Cheng Lin , Chih-Liang Chen , Chih-Ming Lai , Charles Chew-Yuen Young , Jiann-Tyng Tzeng , Kam-Tou Sio , Ru-Gun Liu , Shih-Wei Peng , Wei-Chen Chien
IPC分类号: G06F30/30 , G06F30/398 , G06F30/392
摘要: A method of manufacturing an integrated circuit includes generating a first layout design based on design criteria, performing a color mapping between the first layout design and a standard cell layout design thereby generating a via color layout design, and manufacturing the integrated circuit based on the via color layout design. The first layout design has a first set of vias divided into sub-sets of vias based on a corresponding color indicating that vias of the sub-set of vias with a same color, and vias of the sub-set of vias with a different color. The standard cell layout design has a second set of vias arranged in standard cells. The via color layout design has a third set of vias including a portion of the second set of vias and corresponding locations, and color of the corresponding sub-set of vias.
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公开(公告)号:US10714485B2
公开(公告)日:2020-07-14
申请号:US16126875
申请日:2018-09-10
发明人: Chih-Liang Chen , Chih-Ming Lai , Charles Chew-Yuen Young , Chin-Yuan Tseng , Jiann-Tyng Tzeng , Kam-Tou Sio , Ru-Gun Liu , Wei-Liang Lin , L. C. Chou
IPC分类号: H01L27/11 , H01L21/8234 , H01L27/088 , H01L21/308 , H01L29/78 , H01L29/66 , H01L21/311
摘要: A semiconductor device including multiple fins. At least a first set of fins among the multiple fins is substantially parallel. At least a second set of fins among the multiple fins is substantially collinear. For any given first and second fins of the multiple fins having corresponding first and second fin-thicknesses, the second fin-thickness is less than plus or minus about 50% of the first fin-thickness.
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公开(公告)号:US09442510B2
公开(公告)日:2016-09-13
申请号:US14613817
申请日:2015-02-04
摘要: A clock gating circuit includes a first transistor, a first inverter and a second transistor. A first terminal of the first transistor receives a clock input signal. A second terminal of the first transistor is coupled to a first node. The first transistor adjusts a voltage of the first node to a first voltage based on the clock input signal. The first inverter is coupled to the first node and receives the voltage of the first node, and outputs a clock output signal. A first terminal of the second transistor receives the clock input signal. A second terminal of the second transistor is coupled to the first node and a second node. The second transistor adjusts the voltage of the first node or the second node to the second voltage, based on the clock input signal.
摘要翻译: 时钟选通电路包括第一晶体管,第一反相器和第二晶体管。 第一晶体管的第一端接收时钟输入信号。 第一晶体管的第二端子耦合到第一节点。 第一晶体管基于时钟输入信号将第一节点的电压调整到第一电压。 第一反相器耦合到第一节点并接收第一节点的电压,并输出时钟输出信号。 第二晶体管的第一端子接收时钟输入信号。 第二晶体管的第二端子耦合到第一节点和第二节点。 第二晶体管基于时钟输入信号将第一节点或第二节点的电压调整到第二电压。
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公开(公告)号:US12068305B2
公开(公告)日:2024-08-20
申请号:US17216420
申请日:2021-03-29
发明人: Wei-Cheng Lin , Hui-Ting Yang , Jiann-Tyng Tzeng , Lipen Yuan , Wei-An Lai
IPC分类号: H01L21/70 , G06F30/39 , H01L21/8234 , H01L27/02 , H01L27/088 , H01L29/10 , H01L29/78
CPC分类号: H01L27/0207 , G06F30/39 , H01L21/823431 , H01L27/0886 , H01L29/1033 , H01L29/7851
摘要: A semiconductor device includes a first transistor having a first fin, wherein a base of the first fin is surrounded by a first dielectric material, the first fin having a first fin height measured from the top surface of the first dielectric material to a top surface of the first fin; and a second transistor having a second fin, wherein a base of the second fin is surrounded by a second dielectric material, the second fin having a second fin height measured from a top surface of the second dielectric material to a top surface of the second fin, wherein the first fin height is different from the second fin height.
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