公开(公告)号：US11935772B2

公开(公告)日：2024-03-19

申请号：US17381507

申请日：2021-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seohyun Kim ,  Younghoo Kim ,  Sangjine Park ,  Kuntack Lee ,  Jihoon Jeong

IPC: H01L21/677

CPC classification number: H01L21/67703 ,  H01L21/67739

Abstract: An apparatus for processing a substrate may include a wet chamber, a dry chamber, a first transfer robot and a shared shutter. The wet chamber may be configured to process the substrate using a chemical. The dry chamber may be adjacent the wet chamber and configured to dry the substrate processed by the wet chamber. The first transfer robot may be configured to transfer the substrate between the wet chamber and the dry chamber. The shared shutter may be between the wet chamber and the dry chamber. A connection opening through which the substrate may be transferred may be formed between the wet chamber and the dry chamber. The shared shutter may be configured to open and close the connection opening.

公开(公告)号：US11798801B2

公开(公告)日：2023-10-24

申请号：US18048924

申请日：2022-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hunjae Jang ,  Seungmin Shin ,  Kuntack Lee ,  Seungho Kim ,  Younghoo Kim ,  Taehong Kim ,  Sunghyun Park

IPC: H01L21/02 ,  B08B3/08 ,  B08B7/00 ,  B08B3/10

CPC classification number: H01L21/02057 ,  B08B3/08 ,  B08B3/10 ,  B08B7/0035

Abstract: A wafer-cleaning apparatus includes an inner pin that supports a wafer. The wafer-cleaning apparatus further includes a nozzle disposed above the inner pin, a light source disposed under the inner pin, a window disposed between the light source and the wafer, and a window protector disposed between the wafer and the window. The nozzle supplies a chemical liquid to the wafer and the inner pin distributes a portion of the chemical liquid on an upper surface of the wafer by rotating the wafer. The window protector receives a portion of the chemical liquid that flows out of the wafer and the light source supplies the light to the wafer through the window protector and the window.

公开(公告)号：US11654458B2

公开(公告)日：2023-05-23

申请号：US17081855

申请日：2020-10-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghee Lee ,  Byoungho Kwon ,  Kuntack Lee

IPC: B08B1/00 ,  B08B13/00 ,  B08B1/04 ,  A46B13/00 ,  A46B13/02 ,  B08B3/04 ,  B24B7/22 ,  B24B37/04 ,  B24B37/00 ,  B24B7/00

CPC classification number: B08B1/002 ,  A46B13/001 ,  A46B13/02 ,  B08B1/04 ,  B08B3/04 ,  B08B13/00 ,  A46B2200/30 ,  B24B7/00 ,  B24B7/22 ,  B24B37/00 ,  B24B37/04

Abstract: A substrate-cleaning apparatus may include a tilting arm to which a roll brush and a motor are coupled, a support arm positioned on the tilting arm, a first spring and a second spring coupling the tilting arm to the support arm, a first air bag and a second air bag mounted between the tilting arm and the support arm, and a controller configured to adjust an internal pressure of each of the first air bag and the second air bag. The controller may adjust a difference in internal pressure between the first air bag and the second air bag to control the inclination of the roll brush, and may adjust the internal pressure of each of the first air bag and the second air bag to move the roll brush vertically.

公开(公告)号：US11640115B2

公开(公告)日：2023-05-02

申请号：US17466101

申请日：2021-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihoon Jeong ,  Seohyun Kim ,  Sukhoon Kim ,  Younghoo Kim ,  Sangjine Park ,  Kuntack Lee

IPC: G03F7/20 ,  G03F7/16

Abstract: A substrate processing apparatus includes a processing chamber providing a processing space for processing a substrate and processing a substrate, a substrate support configured to support the substrate, a blocking plate below the substrate support and configured to prevent supercritical fluid from being directly sprayed onto the substrate, a first supply device configured to supply supercritical fluid under a first condition to the processing chamber, a second supply device configured to supply supercritical fluid under a second condition at a higher temperature than that of supercritical fluid under the first condition to the processing chamber, a discharge device configured to discharge supercritical fluid from the processing chamber, and a control device configured to control operations of the first supply device, the second supply device, and the discharge device. The control device is configured to direct the first supply device to supply supercritical fluid prior to the second supply device.

公开(公告)号：US11590628B2

公开(公告)日：2023-02-28

申请号：US16747034

申请日：2020-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yonghee Lee ,  Yungjun Kim ,  Hyunjoon Park ,  Taemin Earmme ,  Seungchul Han ,  Byoungho Kwon ,  Kuntack Lee

IPC: B24B37/20 ,  B24B37/005 ,  B24B37/30

Abstract: A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.

公开(公告)号：US10361100B2

公开(公告)日：2019-07-23

申请号：US15368988

申请日：2016-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyosan Lee ,  Yongsun Ko ,  Kyoungseob Kim ,  Kwangsu Kim ,  SeokHoon Kim ,  Kuntack Lee ,  Yongmyung Jun ,  Yong-Jhin Cho

IPC: H01L21/67 ,  H01L21/02 ,  F26B5/04

Abstract: A substrate treatment apparatus is provided. The apparatus may include a process chamber configured to have an internal space, a substrate supporting member disposed in the process chamber to support a substrate, a first supplying port configured to supply a supercritical fluid to a region of the internal space located below the substrate, a second supplying port configured to supply a supercritical fluid to other region of the internal space located over the substrate, and an exhaust port configured to exhaust the supercritical fluid from the process chamber to an exterior region.

公开(公告)号：US20170298507A1

公开(公告)日：2017-10-19

申请号：US15398284

申请日：2017-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung Lee ,  Hyunsu Kim ,  Kiju Sohn ,  Kuntack Lee ,  Jongwon Hong

IPC: C23C16/455 ,  H01L27/115 ,  H01L21/768 ,  H01L21/02

CPC classification number: C23C16/45525 ,  C23C16/4481 ,  H01L21/0228 ,  H01L21/76831 ,  H01L27/11556 ,  H01L27/11582

Abstract: A semiconductor fabrication apparatus can include a plurality of reaction containers that can be coupled together to provide a plurality of sequential respective stages in a process of generating a process gas for semiconductor fabrication, where each reaction container can include a respective semiconductor fabrication solid source material in a respective configuration that is different than in others of the reaction containers.

公开(公告)号：US12211716B2

公开(公告)日：2025-01-28

申请号：US17664243

申请日：2022-05-20

Applicant: Semes Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Jaeseong Lee ,  Kihoon Choi ,  Hae-Won Choi ,  Jihoon Jeong ,  Seohyun Kim ,  Young-Hoo Kim ,  Sangjine Park ,  Kuntack Lee

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.

公开(公告)号：US12057323B2

公开(公告)日：2024-08-06

申请号：US17559766

申请日：2021-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine Park ,  Seohyun Kim ,  Sukhoon Kim ,  Jihoon Jeong ,  Younghoo Kim ,  Kuntack Lee

IPC: H01L21/3213 ,  G03F7/20 ,  G03F7/30 ,  G03F7/32 ,  H01L21/308 ,  H01L21/311

CPC classification number: H01L21/32139 ,  G03F7/2004 ,  G03F7/3021 ,  G03F7/325 ,  H01L21/308 ,  H01L21/31144

Abstract: A substrate processing method includes providing a surface tension reducing agent as a gas onto a substrate, the substrate having an exposed photoresist layer and layer of developer on the exposed photoresist layer, and causing a bulk flow of the developer in order to remove the developer from the substrate.

公开(公告)号：US20240242985A1

公开(公告)日：2024-07-18

申请号：US18407631

申请日：2024-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjine Park ,  Jihwan Park ,  Kuntack Lee

IPC: H01L21/67 ,  G03F7/00 ,  H01L21/027

CPC classification number: H01L21/67225 ,  G03F7/70033 ,  H01L21/0274 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/6715

Abstract: Provided is a substrate processing apparatus including an index module including a load port in which a substrate is accommodated, a first transfer module and a second transfer module for loading and unloading the substrate, and a processing module that is connected to the index module and includes a plurality of process chambers that process the substrate, wherein one of the plurality of process chambers includes a light processing chamber configured to irradiate light to a photoresist pattern of the substrate, the first transfer module transfers the substrate between the index module and the processing module, the second transfer module transfers the substrate between the plurality of process chambers in the processing module, the first transfer module includes a first hand unit and a second hand unit, and the second transfer module includes a third hand unit and a fourth hand unit.