公开(公告)号：US10409936B2

公开(公告)日：2019-09-10

申请号：US14420303

申请日：2013-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihwan Park

IPC: G06F17/50 ,  G06F1/3237 ,  G06F17/10

Abstract: A method of modeling power consumption of an integrated circuit and an apparatus for supporting the same are provided. The method of modeling power consumption of an integrated circuit includes: grasping information about a clock gating enable signal of the integrated circuit; determining a modeling level using a change rate of the number of the clock enable signal; and extracting a power state according to the modeling level and the number of the clock gating enable signal and modeling power consumption in the power state. Thereby, because a power state can be defined with only the number of a clock gating enable signal, a dynamic power consumption amount can be quickly and accurately estimated.

公开(公告)号：US12278133B2

公开(公告)日：2025-04-15

申请号：US18545644

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine Park ,  Kuntack Lee ,  Jihwan Park ,  Seungmin Shin

IPC: H01L21/687 ,  G03F7/40 ,  G03F7/20

Abstract: A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.

公开(公告)号：US20240149312A1

公开(公告)日：2024-05-09

申请号：US18379851

申请日：2023-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjine Park ,  Jihwan Park ,  Kuntack Lee

IPC: B08B7/00 ,  B05B1/18 ,  H01L21/02 ,  H01L21/67

CPC classification number: B08B7/0021 ,  B05B1/18 ,  H01L21/02101 ,  H01L21/67034

Abstract: A substrate processing apparatus including a processing container including a processing space, a substrate support extending in a first direction and a second direction perpendicular to the second direction, and configured to support a substrate in the processing container, a fluid supply device configured to supply a processing fluid in a supercritical state to the processing space through a container supply pipe, and a shower head assembly configured to diffuse the processing fluid supplied from the fluid supply device into the processing space. The shower head assembly includes a first shower head having a first diameter, and a second shower head arranged between the first shower head and the substrate and having a second diameter. The processing container is separated from the shower head assembly in a third direction perpendicular to the first direction and the second direction, such that a flow path is formed between the processing container and the shower head assembly.

公开(公告)号：US20240120232A1

公开(公告)日：2024-04-11

申请号：US18545644

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine PARK ,  Kuntack Lee ,  Jihwan Park ,  Seungmin Shin

IPC: H01L21/687 ,  G03F7/40

CPC classification number: H01L21/68707 ,  G03F7/40 ,  G03F7/2004

Abstract: A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.

公开(公告)号：US20240242985A1

公开(公告)日：2024-07-18

申请号：US18407631

申请日：2024-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjine Park ,  Jihwan Park ,  Kuntack Lee

IPC: H01L21/67 ,  G03F7/00 ,  H01L21/027

CPC classification number: H01L21/67225 ,  G03F7/70033 ,  H01L21/0274 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/6715

Abstract: Provided is a substrate processing apparatus including an index module including a load port in which a substrate is accommodated, a first transfer module and a second transfer module for loading and unloading the substrate, and a processing module that is connected to the index module and includes a plurality of process chambers that process the substrate, wherein one of the plurality of process chambers includes a light processing chamber configured to irradiate light to a photoresist pattern of the substrate, the first transfer module transfers the substrate between the index module and the processing module, the second transfer module transfers the substrate between the plurality of process chambers in the processing module, the first transfer module includes a first hand unit and a second hand unit, and the second transfer module includes a third hand unit and a fourth hand unit.

公开(公告)号：US20240192071A1

公开(公告)日：2024-06-13

申请号：US18529598

申请日：2023-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine PARK ,  Jihwan Park ,  Kuntack Lee

IPC: G01L9/12

CPC classification number: G01L9/12 ,  H01L21/67051

Abstract: A baffle inspection apparatus is provided and includes: a baffle including a spray surface configured to receive and spray fluid; an upper vessel coupled to the baffle such that the spray surface of the baffle faces downwards; an upper plate above the upper vessel and supporting the upper vessel; a lower vessel below the upper vessel and apart from the upper vessel and the upper plate; a pressure measurement sensor on an upper surface of the lower vessel; a lower plate on a lower surface of the lower vessel and supporting the lower vessel; and a support that supports the upper plate and the lower plate. The upper vessel includes a flow path pipe that is configured to supply the fluid to the baffle so that the fluid is sprayed from the spray surface of the baffle.

公开(公告)号：US20240178024A1

公开(公告)日：2024-05-30

申请号：US18520047

申请日：2023-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjine Park ,  Jihwan Park ,  Kuntack Lee

IPC: H01L21/67

CPC classification number: H01L21/67259 ,  H01L21/67017 ,  H01L21/67098 ,  H01L21/67253 ,  H01L21/0274

Abstract: Provided is a substrate processing apparatus including a processing container having a processing space, a substrate support configured to support a substrate, a fluid supplier configured to supply a processing fluid in a supercritical state to the processing space, a shower head assembly configured to diffuse the processing fluid, a first laser portion configured to measure a horizontal alignment between the processing container and the shower head assembly, a second laser portion configured to measure a vertical alignment between the processing container and the shower head assembly, and a controller configured to correct the position of one of the substrate, the shower head assembly, and the processing container, based on the measured horizontal and vertical alignments, wherein the first and second laser portions are configured to be positioned within the processing container and to move above the substrate.

公开(公告)号：US11601590B2

公开(公告)日：2023-03-07

申请号：US16965132

申请日：2019-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihwan Park

IPC: H04N5/225 ,  H04N5/232 ,  G06F15/163 ,  H04N5/33

Abstract: An electronic device, according to various embodiments, comprises: one or more image sensors; a first processor electrically connected to at least one of the one or more sensors via a first interface and including a first functional processing circuit and a second functional processing circuit capable of processing first output information of the first functional processing circuit; a second processor electrically connected to at least one of the one or more image sensors via a second interface; a third interface for connecting the first functional processing circuit and the second processor to transfer the first output information of the first functional processing circuit to the second processor; and a fourth interface for connecting the second functional processing circuit and the second processor to transfer second output information of the second processor to the second functional processing circuit. Various other embodiments are possible.

公开(公告)号：US20230062447A1

公开(公告)日：2023-03-02

申请号：US17735723

申请日：2022-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine Park ,  Kuntack Lee ,  Jihwan Park ,  Seungmin Shin

IPC: H01L21/687 ,  G03F7/40

Abstract: A substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.

公开(公告)号：US10255175B2

公开(公告)日：2019-04-09

申请号：US15570047

申请日：2016-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwonsik Kim ,  Jihwan Park ,  Kibeom Kim ,  Hyojeong Lee

IPC: G06F9/52 ,  G06F12/02 ,  G06F12/08 ,  G06F1/32 ,  G06F3/06

Abstract: An electronic device according to an embodiment of the present disclosure comprises: a memory including a plurality of pages; and a controller selecting a page area having no non-movable page from a plurality of page areas in the memory based on page state information on the plurality of page areas if a memory defragmentation request occurs when a memory allocation request is made, moving a movable page in the selected page area, and allocating the selected page area in response to the memory allocation request after the movable page has been moved. However, the present disclosure is not limited to the above embodiment, and other embodiments are possible.