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公开(公告)号：US20220075268A1
公开(公告)日：2022-03-10
申请号：US17466101
申请日：2021-09-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jihoon Jeong , Seohyun Kim , Sukhoon Kim , Younghoo Kim , Sangjine Park , Kuntack Lee
Abstract: A substrate processing apparatus includes a processing chamber providing a processing space for processing a substrate and processing a substrate, a substrate support configured to support the substrate, a blocking plate below the substrate support and configured to prevent supercritical fluid from being directly sprayed onto the substrate, a first supply device configured to supply supercritical fluid under a first condition to the processing chamber, a second supply device configured to supply supercritical fluid under a second condition at a higher temperature than that of supercritical fluid under the first condition to the processing chamber, a discharge device configured to discharge supercritical fluid from the processing chamber, and a control device configured to control operations of the first supply device, the second supply device, and the discharge device. The control device is configured to direct the first supply device to supply supercritical fluid prior to the second supply device.
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公开(公告)号：US12211716B2
公开(公告)日：2025-01-28
申请号：US17664243
申请日：2022-05-20
Applicant: Semes Co., Ltd. , Samsung Electronics Co., Ltd.
Inventor： Jaeseong Lee , Kihoon Choi , Hae-Won Choi , Jihoon Jeong , Seohyun Kim , Young-Hoo Kim , Sangjine Park , Kuntack Lee
IPC: H01L21/67 , H01L21/687
Abstract: A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.
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3.发明授权公开(公告)号：US12057323B2
公开(公告)日：2024-08-06
申请号：US17559766
申请日：2021-12-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangjine Park , Seohyun Kim , Sukhoon Kim , Jihoon Jeong , Younghoo Kim , Kuntack Lee
IPC: H01L21/3213 , G03F7/20 , G03F7/30 , G03F7/32 , H01L21/308 , H01L21/311
CPC classification number: H01L21/32139 , G03F7/2004 , G03F7/3021 , G03F7/325 , H01L21/308 , H01L21/31144
Abstract: A substrate processing method includes providing a surface tension reducing agent as a gas onto a substrate, the substrate having an exposed photoresist layer and layer of developer on the exposed photoresist layer, and causing a bulk flow of the developer in order to remove the developer from the substrate.
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公开(公告)号：US20220199440A1
公开(公告)日：2022-06-23
申请号：US17381507
申请日：2021-07-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seohyun Kim , Younghoo Kim , Sangjine Park , Kuntack Lee , Jihoon Jeong
IPC: H01L21/677 , G03F7/20
Abstract: An apparatus for processing a substrate may include a wet chamber, a dry chamber, a first transfer robot and a shared shutter. The wet chamber may be configured to process the substrate using a chemical. The dry chamber may be adjacent the wet chamber and configured to dry the substrate processed by the wet chamber. The first transfer robot may be configured to transfer the substrate between the wet chamber and the dry chamber. The shared shutter may be between the wet chamber and the dry chamber. A connection opening through which the substrate may be transferred may be formed between the wet chamber and the dry chamber. The shared shutter may be configured to open and close the connection opening.
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公开(公告)号：US10775234B2
公开(公告)日：2020-09-15
申请号：US15915835
申请日：2018-03-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungtaek Oh , Namsu Kim , Myunggon Kim , Seohyun Kim
Abstract: An electronic device is disclosed and includes an optical sensor module, a window, a first shield-printed layer, and a second shield-printed layer. The optical sensor module includes a first optical sensor and a second optical sensor. The window covers the optical sensor module. The first shield-printed layer is printed in a first region for transmitting a sensor light from the first optical sensor on a lower surface of the window facing the optical sensor module. The second shield-printed layer is printed in a second region for transmitting a sensor light from the second optical sensor on the lower surface of the window. The first and second shield-printed layers are printed using a same coloring material.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20230244150A1
公开(公告)日：2023-08-03
申请号：US18186359
申请日：2023-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jihoon Jeong , Seohyun Kim , Sukhoon Kim , Younghoo Kim , Sangjine Park , Kuntack Lee
CPC classification number: G03F7/16 , G03F7/70033
Abstract: A substrate processing apparatus includes a processing chamber providing a processing space for processing a substrate and processing a substrate, a substrate support configured to support the substrate, a blocking plate below the substrate support and configured to prevent supercritical fluid from being directly sprayed onto the substrate, a first supply device configured to supply supercritical fluid under a first condition to the processing chamber, a second supply device configured to supply supercritical fluid under a second condition at a higher temperature than that of supercritical fluid under the first condition to the processing chamber, a discharge device configured to discharge supercritical fluid from the processing chamber, and a control device configured to control operations of the first supply device, the second supply device, and the discharge device. The control device is configured to direct the first supply device to supply supercritical fluid prior to the second supply device.
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公开(公告)号：US12191190B2
公开(公告)日：2025-01-07
申请号：US17737490
申请日：2022-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongmyung Jun , Hyunjin Ko , Seohyun Kim , Jae Seong Ryu , Inkwang Bae , Seungbu Baek
IPC: H01L21/687 , H01L21/67
Abstract: A substrate processing chamber includes a housing providing a process space; a spin apparatus provided in the housing; and a fluid spraying nozzle configured to spray fluid into the process space, wherein the spin apparatus includes: a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck; and a weight sensor configured to measure a weight of the substrate supported on the spin chuck.
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公开(公告)号：US10302824B2
公开(公告)日：2019-05-28
申请号：US15109804
申请日：2015-01-02
Inventor： Seohyun Kim , Gunsang Yoon , Yunyoung Kwon , Kyungwook Park
Abstract: Provided is a method of preparing a light scattering layer including voids as a light scattering enhancer instead of metal oxide particles. Provided is also a light scattering layer including voids as a light scattering enhancer instead of metal oxide particles. Provided is also an organic electroluminescent device including the light scattering layer that includes voids as the light scattering enhancer instead of metal oxide particles.
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公开(公告)号：US12198923B2
公开(公告)日：2025-01-14
申请号：US17660449
申请日：2022-04-25
Applicant: Semes Co., Ltd. , Samsung Electronics Co., Ltd.
Inventor： Hae-Won Choi , Anton Koriakin , Sangjine Park Park , Keonyoung Kim , Sukhoon Kim , Seohyun Kim , Young-Hoo Kim , Kuntack Lee , Jihoon Jeong
Abstract: In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.
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公开(公告)号：US11935772B2
公开(公告)日：2024-03-19
申请号：US17381507
申请日：2021-07-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seohyun Kim , Younghoo Kim , Sangjine Park , Kuntack Lee , Jihoon Jeong
IPC: H01L21/677
CPC classification number: H01L21/67703 , H01L21/67739
Abstract: An apparatus for processing a substrate may include a wet chamber, a dry chamber, a first transfer robot and a shared shutter. The wet chamber may be configured to process the substrate using a chemical. The dry chamber may be adjacent the wet chamber and configured to dry the substrate processed by the wet chamber. The first transfer robot may be configured to transfer the substrate between the wet chamber and the dry chamber. The shared shutter may be between the wet chamber and the dry chamber. A connection opening through which the substrate may be transferred may be formed between the wet chamber and the dry chamber. The shared shutter may be configured to open and close the connection opening.
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