公开(公告)号：US11742689B2

公开(公告)日：2023-08-29

申请号：US17172117

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsu Kim ,  Hyoungseok Oh

IPC: H02J7/04 ,  H02J50/80 ,  H02J7/00

CPC classification number: H02J7/04 ,  H02J7/00032 ,  H02J50/80 ,  H02J2207/20

Abstract: An electronic device configured to operate in a plurality of power modes includes a power receiving circuit receiving wireless power from an power transmitting device; and a processor configured to control an operation of the electronic device, wherein the plurality of power modes include a power charging mode in which the wireless power is continuously provided, a power hold mode in which a state where the wireless power is provided and a state where the wireless power is cut off are periodically repeated in a ping period, and a power cutoff mode in which the wireless power is cut off, wherein the power receiving circuit generates a ping flag signal alternates between a high level and a low level with the ping period in the power hold mode, and changes the power mode based on a counting value obtained by counting particular level sections of the ping flag signal.

公开(公告)号：US12281250B2

公开(公告)日：2025-04-22

申请号：US17881861

申请日：2022-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsu Kim ,  Goeun Kim ,  Inkyu Kim ,  Hyesun Park ,  Heesung Lee ,  Youngjun Heo ,  Youngsoo Jung

IPC: C09K13/02 ,  H05K5/04

Abstract: According to an embodiment, a housing of an electronic device comprises: a metal frame, wherein a surface of the metal frame has: a gloss value of 1 gloss unit (Gu) to 10 Gu, and a maximum height of a plurality of irregularities disposed on the surface in a range between 0.1 μm to 2.3 μm, and a maximum depth of valleys between the plurality of irregularities in a range between 0.1 μm to 1.8 μm, and a number of the plurality of irregularities per unit area of 1 cm2 in a range between 90 to 200.

公开(公告)号：US20240063102A1

公开(公告)日：2024-02-22

申请号：US18191248

申请日：2023-03-28

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Hyunsu Kim

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/544 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/10 ,  H01L23/538

CPC classification number: H01L23/49822 ,  H01L21/565 ,  H01L23/544 ,  H01L24/48 ,  H01L23/3128 ,  H01L25/0657 ,  H01L24/16 ,  H01L25/105 ,  H01L24/73 ,  H01L23/5386 ,  H01L23/5389 ,  H01L2225/06513 ,  H01L2224/16225 ,  H01L2225/1058 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2223/54433

Abstract: A semiconductor package includes a first package substrate. A first semiconductor device is mounted on an upper surface of the first package substrate. A first molding is disposed on the first package substrate and covers the first semiconductor device. A second package substrate is disposed on the first molding. At least one second semiconductor device is mounted on an upper surface of the second package substrate. A second molding covers the second semiconductor device. The second molding has a marking pattern in the first region. The second molding has an uneven structure having a plurality of trenches that define a plurality of column structures protruding from a second region on the second semiconductor device.

公开(公告)号：US20170239524A1

公开(公告)日：2017-08-24

申请号：US15436613

申请日：2017-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangjo Lee ,  Hyunsu Kim ,  Jihye Son ,  Moonbae Song ,  Sanghwa Lee ,  Woosang Lee ,  Jae-Hwan Lee ,  Jaeyoun Jeong ,  Bum-Sung Cho

IPC: A63B24/00 ,  H04M1/02 ,  G01P13/00 ,  H04W4/02 ,  G01C22/02 ,  G06F3/01 ,  H04M1/725

Abstract: An electronic device includes a housing, with a display exposed through a part of the housing. The housing includes a first motion sensor to detect movement of the housing, a wireless communication circuit, a processor, and a memory that stores instructions to be executed by a processor. The instructions include generating a wireless communication channel with an external electronic device including a second motion sensor; monitoring the movement of the housing to generate first data for a first time period; receiving second data for the first time period through the wireless communication channel; calculating, as a value for the first time period, a value, smaller than the sum of a first value based on the first data and a second value based on the second data; and displaying the calculated value through a user interface displayed on the display.

公开(公告)号：US20210249891A1

公开(公告)日：2021-08-12

申请号：US17172117

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsu Kim ,  Hyoungseok Oh

IPC: H02J7/04 ,  H02J7/00 ,  H02J50/80

Abstract: An electronic device configured to operate in a plurality of power modes includes a power receiving circuit receiving wireless power from an power transmitting device; and a processor configured to control an operation of the electronic device, wherein the plurality of power modes include a power charging mode in which the wireless power is continuously provided, a power hold mode in which a state where the wireless power is provided and a state where the wireless power is cut off are periodically repeated in a ping period, and a power cutoff mode in which the wireless power is cut off, wherein the power receiving circuit generates a ping flag signal alternates between a high level and a low level with the ping period in the power hold mode, and changes the power mode based on a counting value obtained by counting particular level sections of the ping flag signal.

公开(公告)号：US10796803B2

公开(公告)日：2020-10-06

申请号：US15436613

申请日：2017-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangjo Lee ,  Hyunsu Kim ,  Jihye Son ,  Moonbae Song ,  Sanghwa Lee ,  Woosang Lee ,  Jae-Hwan Lee ,  Jaeyoun Jeong ,  Bum-Sung Cho

IPC: A63B24/00 ,  A61B5/024 ,  A61B5/11 ,  G16H50/30 ,  H04W4/029 ,  H04M1/725 ,  G16H40/63 ,  G16H20/30 ,  G01C22/02

Abstract: An electronic device includes a housing, with a display exposed through a part of the housing. The housing includes a first motion sensor to detect movement of the housing, a wireless communication circuit, a processor, and a memory that stores instructions to be executed by a processor. The instructions include generating a wireless communication channel with an external electronic device including a second motion sensor; monitoring the movement of the housing to generate first data for a first time period; receiving second data for the first time period through the wireless communication channel; calculating, as a value for the first time period, a value, smaller than the sum of a first value based on the first data and a second value based on the second data; and displaying the calculated value through a user interface displayed on the display.

公开(公告)号：US20170298507A1

公开(公告)日：2017-10-19

申请号：US15398284

申请日：2017-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung Lee ,  Hyunsu Kim ,  Kiju Sohn ,  Kuntack Lee ,  Jongwon Hong

IPC: C23C16/455 ,  H01L27/115 ,  H01L21/768 ,  H01L21/02

CPC classification number: C23C16/45525 ,  C23C16/4481 ,  H01L21/0228 ,  H01L21/76831 ,  H01L27/11556 ,  H01L27/11582

Abstract: A semiconductor fabrication apparatus can include a plurality of reaction containers that can be coupled together to provide a plurality of sequential respective stages in a process of generating a process gas for semiconductor fabrication, where each reaction container can include a respective semiconductor fabrication solid source material in a respective configuration that is different than in others of the reaction containers.

公开(公告)号：US09793158B2

公开(公告)日：2017-10-17

申请号：US15176187

申请日：2016-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Kong Siew ,  Hyunsu Kim

IPC: H01L21/4763 ,  H01L21/768

CPC classification number: H01L21/76871 ,  H01L21/76802 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76858 ,  H01L21/76865 ,  H01L21/76877 ,  H01L21/76885 ,  H01L21/76897 ,  H01L23/53238 ,  H01L23/53295

Abstract: A method of fabricating a semiconductor device, the method including forming at least one interconnection structure that includes a metal interconnection and a first insulating pattern sequentially stacked on a substrate; forming barrier patterns covering sidewalls of the interconnection structure; forming second insulating patterns at sides of the interconnection structure, the second insulating patterns being spaced apart from the interconnection structure with the barrier patterns interposed therebetween; forming a via hole in the first insulating pattern by etching a portion of the first insulating pattern, the via hole exposing a top surface of the metal interconnection and sidewalls of the barrier patterns; and forming a via in the via hole.

公开(公告)号：US12016665B2

公开(公告)日：2024-06-25

申请号：US16967970

申请日：2019-01-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonkyu Lee ,  Hwan Shim ,  Hyunsu Kim ,  Yongjin Lee ,  Dawoon Jung ,  Seounghun Kim ,  Taeho Kim

IPC: A61B5/00 ,  A61B5/024 ,  G16H40/67 ,  G16H50/30 ,  G16H50/70

CPC classification number: A61B5/02405 ,  A61B5/721 ,  A61B5/7246 ,  A61B5/725 ,  G16H40/67 ,  G16H50/30 ,  G16H50/70 ,  A61B5/02416

Abstract: An example electronic device may include a detection circuit and a processor operatively connected to the detection circuit. The processor may be configured to obtain a first signal associated with an external object through the detection circuit; obtain a first HR, using a first filter having an attribute of a first frequency band; obtain a second HR, using a second filter having an attribute of a second frequency band, based at least on the first signal; change at least some attributes associated with the second filter, based at least on the first HR and the second HR; obtain a second signal associated with the external object through the detection circuit; and generate heart rate variability (HRV) information, using the second filter, in which the at least some attributes are changed, based on the second signal.

公开(公告)号：US11998346B2

公开(公告)日：2024-06-04

申请号：US16614472

申请日：2018-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonkyu Lee ,  Hwan Shim ,  Hyunsu Kim ,  Seounghun Kim ,  Taeho Kim ,  Sun-Kee Lee

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/0507 ,  A61B5/08 ,  A61B5/11 ,  A61B5/113 ,  A61M21/00 ,  A61M21/02 ,  G01S13/50 ,  G01S13/88 ,  H05B47/105

CPC classification number: A61B5/4809 ,  A61B5/0082 ,  A61B5/0205 ,  A61B5/0507 ,  A61B5/1126 ,  A61B5/113 ,  A61M21/02 ,  G01S13/50 ,  G01S13/88 ,  H05B47/105 ,  A61B5/0022 ,  A61B5/02444 ,  A61B5/0816 ,  A61B2560/0242 ,  A61M2021/0027 ,  A61M2021/0044

Abstract: An electronic device according to various embodiments comprises: a bio-signal detection sensor configured to acquire first and second biometric information on an object outside the electronic device; and a processor, wherein the processor can be configured to: acquire the first and second biometric information by using the bio-signal detection sensor; configure a first variance, in which the first biometric information is changed, and a second variance, in which the second biometric information is changed; determining a state of the object related to the sleep on the basis of at least a part of the first variance and the second variance; and estimate a sleep latency related to the object on the basis of at least a part of the state.