公开(公告)号：US10361100B2

公开(公告)日：2019-07-23

申请号：US15368988

申请日：2016-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyosan Lee ,  Yongsun Ko ,  Kyoungseob Kim ,  Kwangsu Kim ,  SeokHoon Kim ,  Kuntack Lee ,  Yongmyung Jun ,  Yong-Jhin Cho

IPC: H01L21/67 ,  H01L21/02 ,  F26B5/04

Abstract: A substrate treatment apparatus is provided. The apparatus may include a process chamber configured to have an internal space, a substrate supporting member disposed in the process chamber to support a substrate, a first supplying port configured to supply a supercritical fluid to a region of the internal space located below the substrate, a second supplying port configured to supply a supercritical fluid to other region of the internal space located over the substrate, and an exhaust port configured to exhaust the supercritical fluid from the process chamber to an exterior region.

公开(公告)号：US20140291421A1

公开(公告)日：2014-10-02

申请号：US14187556

申请日：2014-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： SeokHoon Kim ,  Yongmyung Jun ,  Yongsun Ko ,  Kyoungseob Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Jihoon Jeong ,  Yong-Jhin Cho

IPC: B05B1/14

CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67051

Abstract: Provided is a substrate treating apparatus including a housing; a plurality of opening-and-closing members configured to provide a driving force for opening and closing the housing; a fluid storing member supplying a fluid to the opening-and-closing members; and a fluid distribution unit connected to the fluid storing member via a supply conduit to distribute the fluid supplied from the fluid storing member to the opening-and-closing members. The fluid distribution unit includes a distribution conduit diverging from the supply conduit and connected to a corresponding one of the opening-and-closing members; and a fluid distribution member provided at a junction between the supply conduit and the distribution conduit.

Abstract translation: 提供一种基板处理装置，包括壳体; 多个打开和关闭构件，其构造成提供用于打开和关闭壳体的驱动力; 向开闭部件供给流体的流体存储部件; 以及流体分配单元，其经由供应管道连接到流体存储构件，以将从流体存储构件供应的流体分配到打开和关闭构件。 流体分配单元包括从供应导管分支并连接到相应的一个打开和关闭构件的分配管道; 以及设置在供应管道和分配管道之间的接合处的流体分配构件。

公开(公告)号：US20170084469A1

公开(公告)日：2017-03-23

申请号：US15368988

申请日：2016-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyosan Lee ,  Yongsun Ko ,  Kyoungseob Kim ,  Kwangsu Kim ,  SeokHoon Kim ,  Kuntack Lee ,  Yongmyung Jun ,  Yong-Jhin Cho

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67034 ,  F26B5/04 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/6715

Abstract: A substrate treatment apparatus is provided. The apparatus may include a process chamber configured to have an internal space, a substrate supporting member disposed in the process chamber to support a substrate, a first supplying port configured to supply a supercritical fluid to a region of the internal space located below the substrate, a second supplying port configured to supply a supercritical fluid to other region of the internal space located over the substrate, and an exhaust port configured to exhaust the supercritical fluid from the process chamber to an exterior region.

公开(公告)号：US09293336B2

公开(公告)日：2016-03-22

申请号：US14258107

申请日：2014-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangryol Yang ,  Soonwook Jung ,  Kyoungseob Kim ,  Youngsub You ,  Byunghong Chung ,  Hanmei Choi

IPC: H01L29/40 ,  H01L21/283 ,  H01L21/768

CPC classification number: H01L21/283 ,  H01L21/76805 ,  H01L29/401

Abstract: A semiconductor device includes a storage node contact on a substrate, and a lower electrode on the storage node contact, a lower sidewall of the lower electrode being covered by a contact residue of a same material as the storage node contact.

Abstract translation: 半导体器件包括在衬底上的存储节点接触和存储节点接触件上的下电极，下电极的下侧壁由与存储节点接触件相同的材料的接触残余物覆盖。

公开(公告)号：US09721801B2

公开(公告)日：2017-08-01

申请号：US14972505

申请日：2015-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongjin Kim ,  Kyoungseob Kim ,  Sungho Shin ,  Kuntack Lee ,  Kihong Cho

IPC: H01L21/306 ,  H01L21/465 ,  H01L21/02 ,  H01L21/67 ,  B24C1/08

CPC classification number: H01L21/30625 ,  B24C1/08 ,  H01L21/02021 ,  H01L21/02057 ,  H01L21/465 ,  H01L21/67219

Abstract: A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.

公开(公告)号：US09595434B2

公开(公告)日：2017-03-14

申请号：US14704912

申请日：2015-05-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungseob Kim ,  Yongsun Ko ,  Kyoung Hwan Kim ,  SeokHoon Kim ,  Kuntack Lee ,  Hyosan Lee

IPC: H01L21/00 ,  H01L21/02 ,  H01L21/78 ,  H01L21/67

CPC classification number: H01L21/02068 ,  H01L21/67051 ,  H01L21/78

Abstract: A method of manufacturing a semiconductor device includes: forming a pattern on a surface of a semiconductor substrate; placing the substrate on a platform of a substrate treatment apparatus; rotating the wafer while applying a cleaning liquid from a first nozzle and a wetting liquid from a second nozzle to treat a first region on the surface of the substrate; vertically changing the distance of the second nozzle together with the first nozzle with respect to the platform; after the vertical change, rotating the wafer while applying the cleaning liquid from the first nozzle and the wetting liquid from the second nozzle to treat a second region on the surface of the substrate; and forming a semiconductor device from the treated substrate.

Abstract translation: 一种制造半导体器件的方法包括：在半导体衬底的表面上形成图案; 将基板放置在基板处理装置的平台上; 在从第一喷嘴施加清洁液体和来自第二喷嘴的润湿液体的同时旋转晶片以处理基板表面上的第一区域; 与第一喷嘴相对于平台垂直地改变第二喷嘴的距离; 在垂直变化之后，在从第一喷嘴施加清洁液体和来自第二喷嘴的润湿液体的同时转动晶片以处理基板表面上的第二区域; 以及从处理过的衬底形成半导体器件。

公开(公告)号：US09627233B2

公开(公告)日：2017-04-18

申请号：US14187556

申请日：2014-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： SeokHoon Kim ,  Yongmyung Jun ,  Yongsun Ko ,  Kyoungseob Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Jihoon Jeong ,  Yong-Jhin Cho

IPC: B05B1/14 ,  H01L21/67

CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67051

Abstract: Provided is a substrate treating apparatus including a housing; a plurality of opening-and-closing members configured to provide a driving force for opening and closing the housing; a fluid storing member supplying a fluid to the opening-and-closing members; and a fluid distribution unit connected to the fluid storing member via a supply conduit to distribute the fluid supplied from the fluid storing member to the opening-and-closing members. The fluid distribution unit includes a distribution conduit diverging from the supply conduit and connected to a corresponding one of the opening-and-closing members; and a fluid distribution member provided at a junction between the supply conduit and the distribution conduit.