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公开(公告)号:US09721801B2
公开(公告)日:2017-08-01
申请号:US14972505
申请日:2015-12-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hongjin Kim , Kyoungseob Kim , Sungho Shin , Kuntack Lee , Kihong Cho
IPC: H01L21/306 , H01L21/465 , H01L21/02 , H01L21/67 , B24C1/08
CPC classification number: H01L21/30625 , B24C1/08 , H01L21/02021 , H01L21/02057 , H01L21/465 , H01L21/67219
Abstract: A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.