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    Process Chamber and Substrate Processing Apparatus Including the Same
    1.
    发明申请
    Process Chamber and Substrate Processing Apparatus Including the Same 有权

    公开(公告)号：US20210217636A1

    公开(公告)日：2021-07-15

    申请号：US17217417

    申请日：2021-03-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

    IPC: H01L21/67 ,  H01L21/02

    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

    Rotary body module and chemical mechanical polishing apparatus having the same
    2.
    发明授权
    Rotary body module and chemical mechanical polishing apparatus having the same 有权

    公开(公告)号：US11590628B2

    公开(公告)日：2023-02-28

    申请号：US16747034

    申请日：2020-01-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yonghee Lee ,  Yungjun Kim ,  Hyunjoon Park ,  Taemin Earmme ,  Seungchul Han ,  Byoungho Kwon ,  Kuntack Lee

    IPC: B24B37/20 ,  B24B37/005 ,  B24B37/30

    Abstract: A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.

    WAFER CLEANING EQUIPMENT
    6.
    发明公开
    WAFER CLEANING EQUIPMENT 审中-公开

    公开(公告)号：US20240006195A1

    公开(公告)日：2024-01-04

    申请号：US18296336

    申请日：2023-04-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： YUNSEOK Choi ,  Eunseok Lee ,  Seungri Ju ,  Yungjun Kim ,  Jaehyun Sung ,  Yongkyu Lee

    IPC: H01L21/67 ,  H01L21/02

    CPC classification number: H01L21/67051 ,  H01L21/02057

    Abstract: A wafer cleaning equipment includes a vessel that includes a first inner wall, a second inner wall that faces the first inner wall, and a bottom connected to the first and second inner walls, a plurality of first nozzles disposed on the first inner wall, a plurality of second nozzles disposed on the second inner wall, a support structure disposed between the plurality of first nozzles and the plurality of second nozzles, where the support structure supports a wafer, and a megasonic cleaner disposed between the bottom of the vessel and the wafer supported by the support structure. The megasonic cleaner includes a rack and at least one vibrator disposed below the rack.

    Process Chamber and Substrate Processing Apparatus Including the Same
    7.
    发明申请
    Process Chamber and Substrate Processing Apparatus Including the Same 审中-公开

    公开(公告)号：US20180366349A1

    公开(公告)日：2018-12-20

    申请号：US15848481

    申请日：2017-12-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

    IPC: H01L21/67 ,  H01L21/02

    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

    Process chamber and substrate processing apparatus including the same
    9.
    发明授权
    Process chamber and substrate processing apparatus including the same 有权

    公开(公告)号：US11610788B2

    公开(公告)日：2023-03-21

    申请号：US17217417

    申请日：2021-03-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

    IPC: H01L21/67 ,  H01L21/02

    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

    Process chamber and substrate processing apparatus including the same
    10.
    发明授权
    Process chamber and substrate processing apparatus including the same 有权

    公开(公告)号：US10991600B2

    公开(公告)日：2021-04-27

    申请号：US15848481

    申请日：2017-12-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

    IPC: H01L21/67 ,  H01L21/02

    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

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