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    Thin film transistor, method for manufacturing the same and display device
    11.
    发明授权
    Thin film transistor, method for manufacturing the same and display device 有权

    公开(公告)号：US10510857B2

    公开(公告)日：2019-12-17

    申请号：US15865793

    申请日：2018-01-09

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Xinhong Lu ,  Ke Wang ,  Wei Yang

    IPC: H01L29/49 ,  H01L29/417 ,  H01L21/02 ,  H01L21/311 ,  H01L29/423 ,  H01L29/786

    Abstract: A method for manufacturing a thin film transistor includes: forming a source electrode and a first insulation pattern, where an orthographic projection of the first insulation pattern at a substrate is within an orthographic projection of the source electrode at the substrate; forming an active layer, a second insulation pattern and a gate electrode on the substrate, an exposed portion of the source electrode not covered by the first insulation pattern and the first insulation pattern; exposing a first portion of the action layer on the first insulation pattern by removing parts of the gate electrode and the second insulation pattern; and performing a plasma treatment to the exposed first portion, thereby forming a drain electrode.

    Folding device and folding method
    12.
    发明授权
    Folding device and folding method 有权

    公开(公告)号：US12269201B2

    公开(公告)日：2025-04-08

    申请号：US17761039

    申请日：2021-05-18

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Shuqi Liu ,  Wenyue Fu ,  Xinhong Lu ,  Qi Qi ,  Xiaojie Pan

    IPC: B65H45/12 ,  B29C53/04 ,  B29C53/80 ,  B29C65/00 ,  B29C65/48 ,  H01L25/16 ,  B29K79/00 ,  B29L31/34

    Abstract: A folding device and a folding method are provided. The folding device includes a bearing and fixing mechanism configured to bear and fix a main body portion of a to-be-folded device; a folding mechanism disposed on at least one lateral side of the bearing and fixing mechanism, the folding mechanism being configured to bear a to-be-folded portion of the to-be-folded device and fold the to-be-folded portion to one side in a thickness direction of the main body portion; a first driving mechanism configured to drive the folding mechanism to move along a direction perpendicular to a bearing surface, which bears the main body portion, of the bearing and fixing mechanism; and a second driving mechanism configured to drive the folding mechanism to move close to or away from the bearing and fixing mechanism along a direction parallel to the bearing surface.

    Manufacturing method of array substrate
    14.
    发明授权
    Manufacturing method of array substrate 有权

    公开(公告)号：US11798959B2

    公开(公告)日：2023-10-24

    申请号：US16965495

    申请日：2019-07-22

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Wei Yang ,  Guangcai Yuan ,  Ce Ning ,  Xinhong Lu ,  Tianmin Zhou ,  Lizhong Wang

    IPC: H01L27/00 ,  H01L27/12

    CPC classification number: H01L27/1288 ,  H01L27/1248

    Abstract: Provided are an array substrate and a manufacturing method thereof, the manufacturing method includes: forming a first active layer on a base substrate; forming a second active layer; forming a second gate on the second active layer; forming a first insulating layer covering the first active layer on the second gate; patterning the first insulating layer to form first via holes at both sides of the second gate to expose the second active layer; depositing a first metal layer in the first via holes and on the first insulating layer; patterning the first metal layer, removing a part of the first metal layer above the first active layer to expose the first insulating layer; etching the first insulating layer using the patterned first metal layer as a mask, forming second via holes above the first active layer to expose the first active layer; cleaning the exposed first active layer.

    Semiconductor Apparatus, Pixel Circuit and Control Method Thereof
    16.
    发明申请
    Semiconductor Apparatus, Pixel Circuit and Control Method Thereof 有权

    公开(公告)号：US20210233467A1

    公开(公告)日：2021-07-29

    申请号：US16767351

    申请日：2019-12-18

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Qingzhao Liu ,  Guoqiang Wang ,  Rui Huang ,  Lizhong Wang ,  Shuilang Dong ,  Xinhong Lu

    IPC: G09G3/3233 ,  H01L31/12 ,  H01L29/78 ,  H01L27/12 ,  G09G3/3266

    Abstract: The present application discloses a semiconductor apparatus, a pixel circuit and a control method thereof. The semiconductor apparatus comprises: an active layer; a first insulating layer; a first gate and a second gate overlapping with a portion of the active layer with the first insulating layer interposed therebetween, respectively; a first electrode, a second electrode and a third electrode, the first electrode and the second electrode are electrically connected with a first portion and a second portion of the active layer, respectively, the third electrode is used to be electrically connected with a photosensitive device, wherein the third electrode is electrically connected with the first gate or the second gate; or the third electrode is electrically connected with a third portion of the active layer.

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