公开(公告)号：US12066247B2

公开(公告)日：2024-08-20

申请号：US17475021

申请日：2021-09-14

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guocai Zhang ,  Junwei Yan ,  Shaodong Sun ,  Shihao Dong ,  Yingwei Liu ,  Zhanfeng Cao ,  Guangcai Yuan

IPC: F26B9/00 ,  C25D5/48 ,  F26B9/06

CPC classification number: F26B9/003 ,  C25D5/48 ,  F26B9/06

Abstract: The present disclosure provides an air drying device including: a base including opposing top and bottom portions, the top portion including at least one first bearing surface; and at least one bearing plate disposed at the top portion of the base. The bearing plate includes a second bearing surface, and the first bearing surface is inclined relative to the second bearing surface.

公开(公告)号：US11894394B2

公开(公告)日：2024-02-06

申请号：US17281015

申请日：2020-01-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhanfeng Cao ,  Yingwei Liu ,  Ke Wang ,  Guocai Zhang ,  Jianguo Wang ,  Zhiwei Liang ,  Haixu Li ,  Muxin Di

IPC: H01L27/12 ,  H01L27/15 ,  C25D7/12 ,  C25D17/00

CPC classification number: H01L27/124 ,  C25D7/123 ,  C25D17/007 ,  H01L27/127 ,  H01L27/156

Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

公开(公告)号：US11707834B2

公开(公告)日：2023-07-25

申请号：US17516269

申请日：2021-11-01

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chengfei Wang ,  Junwei Yan ,  Guangcai Yuan ,  Shaodong Sun ,  Guocai Zhang ,  Shihao Dong ,  Pengcheng Dong

IPC: B25J9/02 ,  B25J13/08 ,  B25J15/02 ,  C25D17/06

CPC classification number: B25J9/026 ,  B25J13/088 ,  B25J15/0253 ,  C25D17/06

Abstract: The present application relates to a substrate transfer device, comprising a horizontally arranged cross beam, and support beams longitudinally arranged at two ends of the cross beam, wherein a substrate carrier is suspended on the cross beam, the substrate carrier is located between the two support beams, and the substrate carrier is parallel to a plane where the two support beams are located, the substrate carrier comprises two side walls oppositely arranged in a horizontal direction, and each of the support beams is provided with an auxiliary clamping structure for clamping the substrate carrier during transferring of the substrate carrier.

公开(公告)号：US11686010B2

公开(公告)日：2023-06-27

申请号：US17516236

申请日：2021-11-01

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chengfei Wang ,  Junwei Yan ,  Guangcai Yuan ,  Shaodong Sun ,  Guocai Zhang ,  Shihao Dong ,  Pengcheng Dong

IPC: C25D17/08 ,  C25D21/10

CPC classification number: C25D17/08 ,  C25D21/10

Abstract: The present disclosure provides a carrier liquid leakage preventing device and an electrochemical deposition apparatus. The carrier liquid leakage preventing device is used for containing liquid medicine dripping from a carrier; the carrier liquid leakage preventing device comprises: a guide rail disposed along a first direction, the first direction is a vertical direction perpendicular to the horizontal plane or a direction at an angle to the horizontal plane; a leakage preventing groove provided on the guide rail and capable of performing a lifting movement along the guide rail so as to move above or below the carrier; and a driver for driving the lifting movement of the leakage preventing groove.

公开(公告)号：US12199227B2

公开(公告)日：2025-01-14

申请号：US17260778

申请日：2020-04-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhanfeng Cao ,  Ke Wang ,  Jianguo Wang ,  Guocai Zhang ,  Guangcai Yuan ,  Xue Dong

IPC: H01L33/62 ,  H01L33/12

Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a display device. The driving substrate includes: a base substrate; a stress buffer layer located on the base substrate; a plurality of first wirings located on a surface of the stress buffer layer away from the base substrate; a first insulating layer located on a surface of the first wiring away from the base substrate; a plurality of second wiring structures located on a surface of the first insulating layer away from the base substrate; a second insulating layer located on a surface of the second wiring structure away from the base substrate; an electronic element located on a surface of the second insulating layer away from the base substrate.

公开(公告)号：US12121873B2

公开(公告)日：2024-10-22

申请号：US17409013

申请日：2021-08-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shaodong Sun ,  Junwei Yan ,  Guangcai Yuan ,  Guocai Zhang ,  Shihao Dong ,  Lilei Zhang ,  Haoran Gao ,  Wenyue Fu ,  Chengfei Wang ,  Xiaojie Pan

IPC: C25D21/04 ,  B01D45/04 ,  B01F23/50 ,  B01F35/00 ,  B01F35/71 ,  C25D3/38 ,  C25D21/14 ,  B01F101/22

CPC classification number: B01F35/189 ,  B01D45/04 ,  B01F23/59 ,  B01F35/71805 ,  C25D3/38 ,  C25D21/04 ,  C25D21/14 ,  B01F23/56 ,  B01F2101/22

Abstract: The present disclosure provides a gas-solid separation structure including: a feeding pipeline including a first feeding part, a second feeding part and a first valve disposed between the first and second feeding parts; a discharge pipeline having a first opening and a second opening opposite to each other, the second feeding part extending into the discharge pipeline via the first opening; wherein an exhaust channel is formed between the second feeding part and the discharge pipeline, exhaust holes are formed in a portion of the discharge pipeline opposite to the second feeding part, and the exhaust channel is in communication with the exhaust holes. The present disclosure further provides a feeding device and an electrochemical deposition apparatus. The present disclosure can improve the problem of interference with medicine powder release caused by gases entering the discharge pipeline.

公开(公告)号：US12024787B2

公开(公告)日：2024-07-02

申请号：US17514971

申请日：2021-10-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Guocai Zhang ,  Junwei Yan ,  Shihao Dong ,  Shaodong Sun ,  Chengfei Wang

IPC: C25D21/14 ,  C25D17/00

CPC classification number: C25D21/14 ,  C25D17/00

Abstract: The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.

公开(公告)号：US11990481B2

公开(公告)日：2024-05-21

申请号：US17418945

申请日：2020-09-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhanfeng Cao ,  Ke Wang ,  Zhiwei Liang ,  Jianguo Wang ,  Guocai Zhang ,  Xinhong Lu ,  Qi Qi

IPC: H01L27/12 ,  G02F1/13357 ,  H01L25/075 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L27/124 ,  G02F1/133603 ,  H01L25/0753 ,  H01L27/127 ,  H01L27/156 ,  H01L33/62 ,  H01L2933/0066

Abstract: The present disclosure provides an array substrate and a manufacturing method thereof, a display panel and a backlight module. The manufacturing method of the array substrate includes: providing a base substrate; forming a metal wiring layer on a side of the base substrate, the metal wiring layer including a first copper metal layer; forming a planarization layer on a side of the metal wiring layer away from the base substrate; forming a drive lead layer on a side of the planarization layer away from the base substrate, the drive lead layer being electrically connected to the metal wiring layer, the drive lead layer including a second copper metal layer with a thickness larger than that of the first copper metal layer; forming a functional device layer on a side of the drive lead layer away from the base substrate.