公开(公告)号：US12055812B2

公开(公告)日：2024-08-06

申请号：US18461652

申请日：2023-09-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haitao Huang ,  Shi Shu ,  Chuanxiang Xu ,  Liuqing Li ,  Zhao Cui ,  Renquan Gu

IPC: G02F1/1335 ,  C23C16/26 ,  C23C16/50 ,  G02F1/1333 ,  G02F1/1343 ,  G02F1/1368 ,  G03F7/00 ,  H10K59/122 ,  H10K71/00 ,  H10K59/12 ,  H10K102/00

CPC classification number: G02F1/133519 ,  C23C16/26 ,  C23C16/50 ,  G02F1/133514 ,  G02F1/133548 ,  G02F1/134345 ,  G02F1/1368 ,  G03F7/0007 ,  H10K59/122 ,  H10K71/00 ,  G02F1/133357 ,  G02F2202/36 ,  H10K59/1201 ,  H10K2102/331

Abstract: A display panel is provided. The display panel includes a base substrate; a bank layer on the base substrate, the bank layer defining a plurality of bank apertures; a quantum dots material layer on the base substrate, the quantum dots material layer comprising a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures; a barrier coating layer in a respective one of the plurality of bank apertures; and an encapsulating layer on a side of the barrier coating layer closer to the base substrate. At least a portion of the barrier coating layer is in direct contact with a portion of the encapsulating layer.

公开(公告)号：US20240136336A1

公开(公告)日：2024-04-25

申请号：US17769825

申请日：2021-06-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xinhong Lu ,  Xiaoyan Zhu ,  Chao Liu ,  Shuilang Dong ,  Jiushi Wang ,  Liuqing Li

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2933/0066

Abstract: A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.

公开(公告)号：US12278220B2

公开(公告)日：2025-04-15

申请号：US17769825

申请日：2021-06-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xinhong Lu ,  Xiaoyan Zhu ,  Chao Liu ,  Shuilang Dong ,  Jiushi Wang ,  Liuqing Li

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/62

Abstract: A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.

公开(公告)号：US12183867B2

公开(公告)日：2024-12-31

申请号：US17628926

申请日：2021-03-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xinhong Lu ,  Zhanfeng Cao ,  Jingshang Zhou ,  Liuqing Li ,  Ting Zeng ,  Yongfei Li ,  Qi Qi

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075

Abstract: The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, and d2≥2 μm and |d2−d3|≤3 μm.

公开(公告)号：US12183987B2

公开(公告)日：2024-12-31

申请号：US18024022

申请日：2022-05-10

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhao Cui ,  Zhonglan Zhao ,  Feng Zhang ,  Liwen Dong ,  Dongfei Hou ,  Yuqiao Li ,  Wenqu Liu ,  Zhijun Lv ,  Detian Meng ,  Liuqing Li ,  Yong Ma ,  Mengya Song ,  Feng Qu

IPC: H01Q3/36 ,  H01Q1/02

Abstract: Provided are a phase shifter, a method for manufacturing the same, and an electronic device. The phase shifter includes: a first substrate and a second substrate that are oppositely arranged, and heat conduction structures arranged between the first substrate and the second substrate. Orthographic projections of the heat conduction structures and orthographic projections of phase shifting units on the same substrate do not overlap each other.

公开(公告)号：US20240234381A9

公开(公告)日：2024-07-11

申请号：US17769825

申请日：2021-06-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xinhong Lu ,  Xiaoyan Zhu ,  Chao Liu ,  Shuilang Dong ,  Jiushi Wang ,  Liuqing Li

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2933/0066

Abstract: A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.

公开(公告)号：US20220317513A1

公开(公告)日：2022-10-06

申请号：US17419685

申请日：2020-09-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haitao Huang ,  Shi Shu ,  Chuanxiang Xu ,  Liuqing Li ,  Zhao Cui ,  Renquan Gu

IPC: G02F1/1335 ,  G02F1/1343 ,  G02F1/1368 ,  H01L27/32 ,  H01L51/56 ,  G03F7/00 ,  C23C16/26 ,  C23C16/50

Abstract: A display panel is provided. The display panel includes a bank layer and a quantum dots material layer on a base substrate. The bank layer defines a plurality of bank apertures. The quantum dots material layer includes a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures. At least a portion of the bank layer between two adjacent bank apertures includes a first surface, a second surface opposite to the first surface, a third surface connecting the first surface and the second surface closer to a first bank aperture, and a fourth surface connecting the first surface and the second surface closer to a second bank aperture. At least a portion of a third surface or a fourth surface of a portion of the bank layer between two adjacent bank apertures is a wavy surface including alternating convex and concave portions.

公开(公告)号：US20250023217A1

公开(公告)日：2025-01-16

申请号：US18281111

申请日：2022-03-18

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liuqing Li ,  Zhao Cui ,  Feng Qu ,  Qi Yao ,  Feng Zhang ,  Wenqu Liu ,  Liwen Dong ,  Zhijun Lv ,  Dongfei Hou ,  Detian Meng ,  Libo Wang

IPC: H01P1/18 ,  H01Q3/36

Abstract: A tunable phase shifter and a method for manufacturing the same, and a tunable phase shifting device. The phase shifter includes a first substrate, a second substrate, and a tunable dielectric layer between the first substrate and the second substrate; the first substrate includes a first base substrate and a first electrode on the first base substrate; the second substrate includes a second base substrate and a second electrode on the second base substrate; an orthographic projection of the first electrode on the first base substrate is at least partially overlapped with an orthographic projection of the second electrode on the first base substrate, and sheet resistances of materials of the first electrode and the second electrode are both less than or equal to 0.024Ω/□.

公开(公告)号：US20240363510A1

公开(公告)日：2024-10-31

申请号：US18580229

申请日：2022-11-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liuqing Li ,  Shuilang Dong ,  Xinhong Lu ,  Guoteng Li ,  Jingshang Zhou ,  Baoman Li

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L23/4985

Abstract: A chip on film includes: a flexible substrate; and a multilayer wiring structure disposed on the flexible substrate. The multilayer wiring structure includes a first wiring layer, a first insulation layer and a second wiring layer, which are sequentially arranged in a direction towards the flexible substrate the flexible substrate. The first wiring layer includes a first conductive material and the second wiring layer includes a second conductive material. The chip on film further includes: pins, at least part of which are in the first wiring layer; first via holes in the first insulation layer; and a second wire and a second wire leading portion in the second wiring layer, which are electrically connected to each other. More than one pin is electrically connected to the second wire leading portion through more than one first via hole, respectively.

公开(公告)号：US20240036386A1

公开(公告)日：2024-02-01

申请号：US18461652

申请日：2023-09-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haitao Huang ,  Shi Shu ,  Chuanxiang Xu ,  Liuqing Li ,  Zhao Cui ,  Renquan Gu

IPC: G02F1/1335 ,  G02F1/1343 ,  C23C16/26 ,  C23C16/50 ,  G02F1/1368 ,  G03F7/00 ,  H10K59/122 ,  H10K71/00

CPC classification number: G02F1/133519 ,  G02F1/133548 ,  G02F1/134345 ,  C23C16/26 ,  C23C16/50 ,  G02F1/133514 ,  G02F1/1368 ,  G03F7/0007 ,  H10K59/122 ,  H10K71/00 ,  G02F1/133357

Abstract: A display panel is provided. The display panel includes a base substrate; a bank layer on the base substrate, the bank layer defining a plurality of bank apertures; a quantum dots material layer on the base substrate, the quantum dots material layer comprising a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures; a barrier coating layer in a respective one of the plurality of bank apertures; and an encapsulating layer on a side of the barrier coating layer closer to the base substrate. At least a portion of the barrier coating layer is in direct contact with a portion of the encapsulating layer.