公开(公告)号：US20240363510A1

公开(公告)日：2024-10-31

申请号：US18580229

申请日：2022-11-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liuqing Li ,  Shuilang Dong ,  Xinhong Lu ,  Guoteng Li ,  Jingshang Zhou ,  Baoman Li

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L23/4985

Abstract: A chip on film includes: a flexible substrate; and a multilayer wiring structure disposed on the flexible substrate. The multilayer wiring structure includes a first wiring layer, a first insulation layer and a second wiring layer, which are sequentially arranged in a direction towards the flexible substrate the flexible substrate. The first wiring layer includes a first conductive material and the second wiring layer includes a second conductive material. The chip on film further includes: pins, at least part of which are in the first wiring layer; first via holes in the first insulation layer; and a second wire and a second wire leading portion in the second wiring layer, which are electrically connected to each other. More than one pin is electrically connected to the second wire leading portion through more than one first via hole, respectively.