公开(公告)号：US20130279074A1

公开(公告)日：2013-10-24

申请号：US13538533

申请日：2012-06-29

申请人： Jin Woo LEE ,  Tae Hyeong KIM ,  Eung Soo KIM ,  Chi Hyoun RO ,  Hang Kyu CHO

发明人： Jin Woo LEE ,  Tae Hyeong KIM ,  Eung Soo KIM ,  Chi Hyoun RO ,  Hang Kyu CHO

IPC分类号： H01G4/12

CPC分类号： H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/12 ,  Y10T29/435

摘要： There is provided a multilayer ceramic electronic component. The multilayer ceramic electronic component includes a ceramic main body including a dielectric layer, and first and second internal electrodes disposed to face each other within the ceramic main body and having the dielectric layer interposed therebetween. When an average roughness of center lines of the first and second internal electrodes is Ra, a maximum distance from a virtual line corresponding to Ra to a bottom of a pit (d) formed below the virtual line is 0.1 μm to 13 μm. The surface roughness of the internal electrode printed surface is improved to decrease the occurrence of electrical shorts.

摘要翻译： 提供了多层陶瓷电子部件。 多层陶瓷电子部件包括：陶瓷主体，其包括电介质层，以及第一和第二内部电极，其设置成在陶瓷主体内彼此相对并且介于其间。 当第一和第二内部电极的中心线的平均粗糙度为Ra时，从对应于Ra的虚拟线到在虚拟线下方形成的凹坑（d）的底部的最大距离为0.1μm至13μm。 改善了内部电极印刷表面的表面粗糙度，以减少电气短路的发生。

公开(公告)号：US20120301605A1

公开(公告)日：2012-11-29

申请号：US13474192

申请日：2012-05-17

申请人： Tae Hyeong KIM ,  Gee Lyong KIM ,  Young Ha JUN ,  Gi Woo LEE ,  Ki Ho YEO ,  Jai Moo YOO

发明人： Tae Hyeong KIM ,  Gee Lyong KIM ,  Young Ha JUN ,  Gi Woo LEE ,  Ki Ho YEO ,  Jai Moo YOO

IPC分类号： B05C1/00 ,  H01G13/00 ,  B05D5/00

CPC分类号： H01G13/00 ,  B05C1/0808 ,  B41N1/20 ,  B41N3/038

摘要： There are provided a gravure printing engraving roll and a manufacturing method thereof. The gravure printing engraving roll includes: a base layer provided with gravure printing patterns; and a reinforcement coating layer applied to the base layer in order to reinforce strength of the base layer, the reinforcement coating layer including a first reinforcement layer formed on the base layer by a wet plating method, a second reinforcement layer forming an outer surface of the reinforcement coating layer, a first adhesive layer disposed between the first and second reinforcement layers and providing adhesive strength to a surface of the first reinforcement layer, and a second adhesive layer providing adhesive strength between the first adhesive layer and the second reinforcement layer.

摘要翻译： 提供凹版印刷雕刻辊及其制造方法。 凹版印刷雕刻辊包括：具有凹版印刷图案的基层; 以及加强涂层，以加强所述基底层的强度，所述加强涂层包括通过湿法镀覆法形成在所述基底层上的第一加强层，形成所述基底层的外表面的第二加强层 加强涂层，设置在第一和第二加强层之间并为第一加强层的表面提供粘合强度的第一粘合剂层和在第一粘合剂层和第二加强层之间提供粘合强度的第二粘合剂层。

公开(公告)号：US20110200724A1

公开(公告)日：2011-08-18

申请号：US12745338

申请日：2008-11-27

申请人： Hyo-Young Jeong ,  Chang Yong Lee ,  Tae Hyeong Kim ,  Jun Bong Choi ,  Hye-Won Shin ,  Min-Soo Kim

发明人： Hyo-Young Jeong ,  Chang Yong Lee ,  Tae Hyeong Kim ,  Jun Bong Choi ,  Hye-Won Shin ,  Min-Soo Kim

IPC分类号： A23L1/182

CPC分类号： A23L7/196

摘要： A method is provided for preparing an instant embryo bud-retaining white rice product. The rice is polished like white rice using a low-speed, uniform pressure method to keep embryo buds and is rich in nutrients and has white rice's flavor. Its lipid oxidation is similar to that of white rice. The immersion time period of the embryo bud-retaining white rice is controlled so as not to generate sticky materials after the immersion, thus allowing effective sterilization of the rice. Therefore, the instant embryo bud-retaining white rice can be stored at room temperature for 6 months or longer.

摘要翻译： 提供了一种制备即时胚芽保留白米制品的方法。 使用低速，均匀的压力方法将米饭像白米抛光，以保持胚芽，营养丰富，并具有白米的味道。 其脂质氧化与白米相似。 控制胚芽保留白米的浸泡时间，以便在浸渍后不产生粘性物质，从而允许米的有效灭菌。 因此，即时胚芽保留白米可以在室温下储存6个月以上。

公开(公告)号：US5932923A

公开(公告)日：1999-08-03

申请号：US943129

申请日：1997-10-03

申请人： Tae Hyeong Kim ,  Hee Sun Rho ,  In Sik Cho ,  Gi Su Yoo ,  Sang Hyeop Lee

发明人： Tae Hyeong Kim ,  Hee Sun Rho ,  In Sik Cho ,  Gi Su Yoo ,  Sang Hyeop Lee

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/12 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L21/565 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/181

摘要： A semiconductor device package is equipped with devices for preventing the formulation of air traps in its encapsulated package body. These devices include dummy block leads formed on the outermost inner lead of each row of inner leads, and extended portions formed on each tie bar. Each dummy block lead extends from the end of an outermost inner lead and is integrally formed therewith. The tie bar extended portions are separated into several parts defined by spaces between the parts, and the several parts are formed integral with each other and with the tie bar. The dummy block leads and the tie bar extended portions may be formed so as to be inclined relative to horizontal and with jagged edges at their side surfaces. The dummy block leads and tie bar extended portions serve to reduce the velocity of the potting resin which forms the encapsulate, as it enters the die cavity for encapsulation, but before the resin actually contacts the chip or the inner leads. Thereby, the flow velocity at various points within the mold cavity is uniform, and formation of air traps is prevented.

摘要翻译： 半导体器件封装配备有用于防止其封装的封装主体中的空气阱的配制的装置。 这些装置包括形成在每排内引线的最外侧的内引线上的虚拟块引线和形成在每个连杆上的延伸部分。 每个虚拟块引线从最外侧的内部引线的端部延伸并与其一体地形成。 拉杆延伸部分被分成由部件之间的空间限定的几个部分，并且多个部分彼此成一体并且与连接杆形成。 虚拟块引导件和拉杆延伸部分可以形成为相对于水平面倾斜并且在其侧表面具有锯齿状边缘。 虚拟块引线和连接杆延伸部分用于当其进入用于封装的模腔时，但在树脂实际接触芯片或内引线之前，会降低形成封装的灌封树脂的速度。 因此，模腔内的各点的流速是均匀的，并且防止了空气阱的形成。

公开(公告)号：US09893018B2

公开(公告)日：2018-02-13

申请号：US14712382

申请日：2015-05-14

申请人： Yeong-Kwon Ko ,  Tae-Hyeong Kim ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

发明人： Yeong-Kwon Ko ,  Tae-Hyeong Kim ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

IPC分类号： H01L23/544 ,  H01L25/065 ,  B23K26/00 ,  H01L21/768

CPC分类号： H01L23/544 ,  B23K26/53 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/5448 ,  H01L2224/16225 ,  H01L2225/06541 ,  H01L2225/06593

摘要： Semiconductor devices and methods for manufacturing a semiconductor device include a first semiconductor substrate in which a first scribe line region and a first chip region are defined, a first alignment mark inside the first semiconductor substrate and in the first scribe line region so as to be spaced apart from an upper side of the first semiconductor substrate, a second semiconductor substrate on the first semiconductor substrate and in which a second scribe line region and a second chip region are defined, and a second alignment mark inside the second semiconductor substrate and in the second scribe line region so as to be spaced apart from an upper side of the second semiconductor substrate, wherein the second semiconductor substrate is on the first semiconductor substrate so that positions of the first alignment mark and the second alignment mark correspond to each other.

公开(公告)号：US09449930B2

公开(公告)日：2016-09-20

申请号：US14813084

申请日：2015-07-29

申请人： Tae-Hyeong Kim ,  Yeong-Kwon Ko ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

发明人： Tae-Hyeong Kim ,  Yeong-Kwon Ko ,  Ji-Hwang Kim ,  Sun-Kyoung Seo ,  Tae-Je Cho

IPC分类号： H01L23/04 ,  H01L23/48 ,  H01L23/52 ,  H01L21/44 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00

CPC分类号： H01L24/06 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/034 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06 ,  H01L2224/0605 ,  H01L2224/06181 ,  H01L2224/065 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/119 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1405 ,  H01L2224/14181 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2224/05624 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/0347 ,  H01L2224/113 ,  H01L2924/00

摘要： A semiconductor device, a semiconductor package, and a package stack structure include a semiconductor substrate, a first bonding pad disposed on a first surface of the semiconductor substrate, and a first pillar disposed on the first bonding pad. An upper surface of the first pillar has a concave shape. Side surfaces of the first pillar are substantially planar.

摘要翻译： 半导体器件，半导体封装和封装堆叠结构包括半导体衬底，设置在半导体衬底的第一表面上的第一焊盘和设置在第一焊盘上的第一柱。 第一支柱的上表面具有凹形。 第一柱的侧表面基本上是平面的。

公开(公告)号：US08847893B2

公开(公告)日：2014-09-30

申请号：US12543421

申请日：2009-08-18

申请人： Jung-Mok Park ,  Sun-Haeng Cho ,  Chang-Yong Lee ,  Jin-Yeol Kim ,  Seong-Je Huang ,  In-Won Jang ,  Dong-Wook Kang ,  Tae-Hyeong Kim

发明人： Jung-Mok Park ,  Sun-Haeng Cho ,  Chang-Yong Lee ,  Jin-Yeol Kim ,  Seong-Je Huang ,  In-Won Jang ,  Dong-Wook Kang ,  Tae-Hyeong Kim

IPC分类号： G06F3/041 ,  G09G5/00 ,  G06F3/044

CPC分类号： G06F3/044 ,  G06F2203/04103 ,  Y10T29/49155 ,  Y10T29/49895

摘要： A touch screen panel for an image display device and a method of fabricating the same. The touch screen panel includes first and second substrates facing each other, the first and second substrates being joined together by a sealant; a plurality of first sensing patterns coupled to one another along a first direction on a side of the first substrate facing the second substrate; a plurality of second sensing patterns coupled to one another along a second direction on a side of the second substrate facing the first substrate; a plurality of first dummy patterns between the first sensing patterns corresponding to the second sensing patterns; a plurality of second dummy patterns between the second sensing patterns corresponding to the first sensing patterns; and an insulating layer between the first and second substrates.

摘要翻译： 一种用于图像显示装置的触摸屏面板及其制造方法。 触摸屏面板包括彼此面对的第一和第二基板，第一和第二基板通过密封剂接合在一起; 多个第一感测图案沿着第一方向在与第二基板相对的第一基板的一侧上彼此耦合; 多个第二感测图案，其沿着第二方向在第二衬底的与第一衬底相对的一侧上彼此耦合; 在与第二感测图案对应的第一感测图案之间的多个第一伪图案; 在对应于第一感测图案的第二感测图案之间的多个第二虚拟图案; 以及第一和第二基板之间的绝缘层。

公开(公告)号：US20050115277A1

公开(公告)日：2005-06-02

申请号：US10835660

申请日：2004-04-30

申请人： Tae-Hyeong Kim ,  Hak-Seon Kim ,  Yeong-Seop Lee

发明人： Tae-Hyeong Kim ,  Hak-Seon Kim ,  Yeong-Seop Lee

IPC分类号： C03B37/018

CPC分类号： C03B37/01846 ,  Y02P40/57

摘要： A method and an apparatus for manufacturing an optical fiber preform. The method manufactures the optical fiber preform by depositing soot created through a chemical reaction on an inside wall of a reaction tube. The created soot is charged with a first predetermined charge to adhere soot, which is not deposited on the inside wall of the tube, to an electrified body charged with a second predetermined charge opposite to the first predetermined charge. The electrified body is adapted for movement to transport the unused soot to an exterior of the reaction tube. The electrified body is energized with a charge identical to the first predetermined charge of soot, thereby exhausting soot adhering to the electrified body to an exterior of the reaction tube.

摘要翻译： 一种用于制造光纤预制棒的方法和装置。 该方法通过将通过化学反应产生的烟灰沉积在反应管的内壁上来制造光纤预制件。 所产生的烟灰以第一预定电荷充电，以将未沉积在管的内壁上的烟灰附着到充电与第一预定电荷相反的第二预定电荷的带电体。 带电体适于移动以将未使用的烟灰输送到反应管的外部。 带电体以与第一预定烟灰量相同的电荷通电，从而将附着在电气体上的烟灰排出到反应管的外部。