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    Method for forming through substrate vias with tethers
    11.
    发明授权
    Method for forming through substrate vias with tethers 有权
    通过带有系绳的衬底通孔形成的方法

    公开(公告)号：US09324613B2

    公开(公告)日：2016-04-26

    申请号：US14619068

    申请日：2015-02-11

    Applicant: Innovative Micro Technology

    Inventor： John C Harley ,  Zhimin J. Yao

    IPC: H01L21/768 ,  H01L21/84 ,  B81C1/00 ,  H01L21/288 ,  H01L21/02 ,  H01L21/321

    CPC classification number: H01L21/76898 ,  B81C1/00301 ,  H01L21/7682 ,  H01L2224/02372 ,  H01L2224/05548

    Abstract: A method for forming through silicon vias (TSVs) in a silicon substrate is disclosed. The method involves forming a silicon post as an substantially continuous annulus in a first side of a silicon substrate, removing material from an opposite side to the level of the substantially continuous annulus, removing the silicon post and replacing it with a metal material to form a metal via extending through the thickness of the substrate. The substantially continuous annulus may be interrupted by at least one tether which connects the silicon post to the silicon substrate. The tether may be formed of a thing isthmus of silicon, or some suitable insulating material.

    Abstract translation: 公开了一种在硅衬底中形成硅通孔（TSV）的方法。 该方法包括在硅衬底的第一侧中形成硅柱作为基本上连续的环状空间，从与基本上连续的环的水平面相反的一侧去除材料，去除硅柱并用金属材料代替它，以形成 金属通过延伸穿过衬底的厚度。 基本上连续的环可被至少一个将硅柱连接到硅衬底的系绳中断。 系绳可以由硅的地峡或一些合适的绝缘材料形成。

    SOLDER BUMP SEALING METHOD AND DEVICE
    13.
    发明申请
    SOLDER BUMP SEALING METHOD AND DEVICE 有权
    焊膏密封方法和装置

    公开(公告)号：US20160042902A1

    公开(公告)日：2016-02-11

    申请号：US14456972

    申请日：2014-08-11

    Applicant: Innovative Micro Technology

    Inventor： Benedikt ZEYEN ,  Vikram PATIL

    IPC: H01H59/00 ,  H01H49/00

    CPC classification number: H01H59/0009 ,  B81C1/00333 ,  H01H49/00 ,  H03H9/1057

    Abstract: A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.

    Abstract translation: 用于在微细结构中形成空腔的方法包括用低温焊料密封该空腔。 该方法可以包括在衬底上形成牺牲层，在牺牲层上形成柔性膜，形成通过柔性膜到牺牲层的释放孔，通过释放孔引入蚀刻剂以去除牺牲层，然后密封 该释放孔与低温焊料。

    Inductive getter activation for high vacuum packaging
    16.
    发明授权
    Inductive getter activation for high vacuum packaging 有权
    感应吸气剂激活高真空包装

    公开(公告)号：US08558364B2

    公开(公告)日：2013-10-15

    申请号：US13137883

    申请日：2011-09-20

    Applicant: Jeffery F. Summers

    Inventor： Jeffery F. Summers

    IPC: H01L23/20

    CPC classification number: H01L23/26 ,  B81C1/00285 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: An approach to activating a getter within a sealed vacuum cavity is disclosed. The approach uses inductive coupling from an external coil to a magnetically permeable material deposited in the vacuum cavity. The getter material is formed over this magnetically permeable material, and heated specifically thereby, leaving the rest of the device cavity and microdevice relatively cool. Using this inductive coupling technique, the getter material can be activated after encapsulation, and delicate structures and low temperature wafer bonding mechanisms may be used.

    Abstract translation: 公开了一种在密封真空腔内激活吸气剂的方法。 该方法使用从外部线圈到沉积在真空腔中的导磁材料的电感耦合。 吸气材料形成在这种导磁材料之上，并由此特别加热，使装置空腔和微型装置的其余部分相对冷却。 使用这种电感耦合技术，吸收材料可以在封装之后被激活，并且可以使用精细的结构和低温晶片接合机制。

    Microfabricated electromagnetic actuator with push-pull motion
    17.
    发明申请
    Microfabricated electromagnetic actuator with push-pull motion 有权
    具有推拉动作的微型电磁执行器

    公开(公告)号：US20120302946A1

    公开(公告)日：2012-11-29

    申请号：US13067325

    申请日：2011-05-25

    Applicant: Paul J. Rubel

    Inventor： Paul J. Rubel

    IPC: A61M5/142 ,  A61M5/168 ,  H02K15/00 ,  H01F7/08 ,  F04B43/00

    CPC classification number: F04B43/043 ,  A61M5/14216 ,  A61M5/14224 ,  A61M2005/1726 ,  A61M2205/0244 ,  F04B19/006 ,  H01F7/17 ,  H02K33/12 ,  Y10T29/49009

    Abstract: A micromechanical electromagnetic actuator may have two separate components: a flux-generating portion and a separate movable structure. The flux-generating portion may have a plurality of conductive coils wound around a magnetically permeable material. Each coil generates a magnetic field along its axis, which is different for each of the coils. The adjacent movable structure may include magnetically permeable features, one inlaid in the movable structure and other stationary features which focus the flux produced by the flux-generating mechanism across a gap between the stationary features. By energizing each coil sequentially, a push-pull motion in the actuator may result from the force of the magnetically permeable features. This push-pull actuator may be particularly effective when used as a pumping element in a drug delivery system, or other fluidic pumping system.

    Abstract translation: 微机电电磁致动器可以具有两个单独的部件：磁通发生部分和单独的可移动结构。 磁通产生部分可以具有绕导磁材料缠绕的多个导电线圈。 每个线圈沿其轴线产生一个磁场，这对于每个线圈是不同的。 相邻的可移动结构可以包括导磁特征，一个嵌入在可移动结构中，以及其它固定特征，其将由通量产生机构产生的通量聚焦在固定特征之间的间隙。 通过依次激励每个线圈，致动器中的推挽动作可以由导磁特征的力产生。 当在药物递送系统或其它流体泵送系统中用作泵送元件时，该推拉致动器可能是特别有效的。

    Inductive getter activation for high vacuum packaging
    18.
    发明申请
    Inductive getter activation for high vacuum packaging 有权
    感应吸气剂激活高真空包装

    公开(公告)号：US20120068300A1

    公开(公告)日：2012-03-22

    申请号：US13137883

    申请日：2011-09-20

    Applicant: Jeffery F. Summers

    Inventor： Jeffery F. Summers

    IPC: H01L27/06 ,  H01L21/268

    CPC classification number: H01L23/26 ,  B81C1/00285 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: An approach to activating a getter within a sealed vacuum cavity is disclosed. The approach uses inductive coupling from an external coil to a magnetically permeable material deposited in the vacuum cavity. The getter material is formed over this magnetically permeable material, and heated specifically thereby, leaving the rest of the device cavity and microdevice relatively cool. Using this inductive coupling technique, the getter material can be activated after encapsulation, and delicate structures and low temperature wafer bonding mechanisms may be used.

    Abstract translation: 公开了一种在密封真空腔内激活吸气剂的方法。 该方法使用从外部线圈到沉积在真空腔中的导磁材料的电感耦合。 吸气材料形成在这种导磁材料之上，并由此特别加热，使装置空腔和微型装置的其余部分相对冷却。 使用这种电感耦合技术，吸收材料可以在封装之后被激活，并且可以使用精细的结构和低温晶片接合机制。

    SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE
    19.
    发明申请
    SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE 有权
    用于提供访问封装设备的系统和方法

    公开(公告)号：US20120015456A1

    公开(公告)日：2012-01-19

    申请号：US12232298

    申请日：2008-09-15

    Applicant: Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

    Inventor： Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

    IPC: H01L21/56 ,  H01L21/66

    CPC classification number: B81C99/004

    Abstract: A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

    Abstract translation: 描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。 该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本上均匀地移除材料，直到孔形成在 在器件晶圆上的特征之上。 通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。

    Hermetic interconnect structure and method of manufacture
    20.
    发明授权
    Hermetic interconnect structure and method of manufacture 有权
    密封互连结构和制造方法

    公开(公告)号：US07582969B2

    公开(公告)日：2009-09-01

    申请号：US11211625

    申请日：2005-08-26

    Applicant: Gregory A. Carlson ,  Jeffery F. Summers

    Inventor： Gregory A. Carlson ,  Jeffery F. Summers

    IPC: H01L23/06 ,  H01L23/48 ,  H01L23/52 ,  H01L23/40

    CPC classification number: B81B7/007 ,  H01L23/10 ,  H01L23/49894 ,  H01L2924/16235

    Abstract: A hermetic interconnect is fabricated on a substrate by forming a stud of conductive material over a metallization layer, and then overcoating the stud of conductive material and the metallization layer with a layer of compliant dielectric material. In one embodiment, the layer of compliant dielectric material is low Young's modulus silicon dioxide, formed by sputter-deposition at low temperature, in a low pressure argon atmosphere. The interconnect may provide electrical access to a micromechanical device, which is enclosed with a capping wafer hermetically sealed to the substrate with an AuInx alloy bond.

    Abstract translation: 通过在金属化层上形成导电材料柱，然后用导电材料柱和金属化层用柔性电介质材料层覆盖，在衬底上制造气密互连。 在一个实施例中，柔性介电材料层是低杨氏模量二氧化硅，通过在低温氩气气氛中在低温下溅射沉积而形成。 互连可以提供对微机械装置的电接入，该微机械装置用与AuInx合金结合物密封到衬底的封盖晶片封闭。

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