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    Hermetic interconnect structure and method of manufacture
    2.
    发明授权
    Hermetic interconnect structure and method of manufacture 有权
    密封互连结构和制造方法

    公开(公告)号：US07582969B2

    公开(公告)日：2009-09-01

    申请号：US11211625

    申请日：2005-08-26

    Applicant: Gregory A. Carlson ,  Jeffery F. Summers

    Inventor： Gregory A. Carlson ,  Jeffery F. Summers

    IPC: H01L23/06 ,  H01L23/48 ,  H01L23/52 ,  H01L23/40

    CPC classification number: B81B7/007 ,  H01L23/10 ,  H01L23/49894 ,  H01L2924/16235

    Abstract: A hermetic interconnect is fabricated on a substrate by forming a stud of conductive material over a metallization layer, and then overcoating the stud of conductive material and the metallization layer with a layer of compliant dielectric material. In one embodiment, the layer of compliant dielectric material is low Young's modulus silicon dioxide, formed by sputter-deposition at low temperature, in a low pressure argon atmosphere. The interconnect may provide electrical access to a micromechanical device, which is enclosed with a capping wafer hermetically sealed to the substrate with an AuInx alloy bond.

    Abstract translation: 通过在金属化层上形成导电材料柱，然后用导电材料柱和金属化层用柔性电介质材料层覆盖，在衬底上制造气密互连。 在一个实施例中，柔性介电材料层是低杨氏模量二氧化硅，通过在低温氩气气氛中在低温下溅射沉积而形成。 互连可以提供对微机械装置的电接入，该微机械装置用与AuInx合金结合物密封到衬底的封盖晶片封闭。

    Wafer level hermetic bond using metal alloy with raised feature
    3.
    发明授权
    Wafer level hermetic bond using metal alloy with raised feature 有权
    使用具有凸起特征的金属合金的晶圆级密封

    公开(公告)号：US07960208B2

    公开(公告)日：2011-06-14

    申请号：US12459956

    申请日：2009-07-11

    Applicant: Gregory A. Carlson ,  David M. Erlach ,  Alok Paranjpye ,  Jeffery F. Summers

    Inventor： Gregory A. Carlson ,  David M. Erlach ,  Alok Paranjpye ,  Jeffery F. Summers

    IPC: H01L21/48

    CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    Abstract: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate, along with a raised feature formed on the first or the second substrate. At least one of the metal layers may be deposited conformally over the raised feature. The raised feature penetrates the molten material of the first or the second metal layers during formation of the alloy, and produces a spectrum of stoichiometries for the formation of the desired alloy, as a function of the distance from the raised feature. At some distance from the raised feature, the proper ratio of the first metal to the second metal exists to form an alloy of the preferred stoichiometry.

    Abstract translation: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件，其中之一支撑该装置。 气密密封是由两个金属层的合金形成的，一个沉积在第一基板上，另一个沉积在第二基板上，以及形成在第一或第二基板上的凸起特征。 至少一个金属层可以在凸起特征上保形地沉积。 凸起的特征​​在形成合金期间渗透第一或第二金属层的熔融材料，并且作为与凸起特征的距离的函数产生用于形成所需合金的化学计量谱。 在与凸起特征相距一定距离处，存在第一金属与第二金属的适当比率以形成优选化学计量的合金。

    Wafer level hermetic bond using metal alloy with raised feature
    4.
    发明申请
    Wafer level hermetic bond using metal alloy with raised feature 有权
    使用具有凸起特征的金属合金的晶圆级密封

    公开(公告)号：US20100003772A1

    公开(公告)日：2010-01-07

    申请号：US12459956

    申请日：2009-07-11

    Applicant: Gregory A. Carlson ,  David M. Erlach ,  Alok Paranjpye ,  Jeffery F. Summers

    Inventor： Gregory A. Carlson ,  David M. Erlach ,  Alok Paranjpye ,  Jeffery F. Summers

    IPC: H01L21/66

    CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    Abstract: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate, along with a raised feature formed on the first or the second substrate. At least one of the metal layers may be deposited conformally over the raised feature. The raised feature penetrates the molten material of the first or the second metal layers during formation of the alloy, and produces a spectrum of stoichiometries for the formation of the desired alloy, as a function of the distance from the raised feature. At some distance from the raised feature, the proper ratio of the first metal to the second metal exists to form an alloy of the preferred stoichiometry.

    Abstract translation: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件，其中之一支撑该装置。 气密密封是由两个金属层的合金形成的，一个沉积在第一基板上，另一个沉积在第二基板上，以及形成在第一或第二基板上的凸起特征。 至少一个金属层可以在凸起特征上保形地沉积。 凸起的特征​​在形成合金期间渗透第一或第二金属层的熔融材料，并且作为与凸起特征的距离的函数产生用于形成所需合金的化学计量谱。 在与凸起特征相距一定距离处，存在第一金属与第二金属的适当比率以形成优选化学计量的合金。

    Wafer level hermetic bond using metal alloy with raised feature
    5.
    发明授权
    Wafer level hermetic bond using metal alloy with raised feature 有权
    使用具有凸起特征的金属合金的晶圆级密封

    公开(公告)号：US07569926B2

    公开(公告)日：2009-08-04

    申请号：US11304601

    申请日：2005-12-16

    Applicant: Gregory A. Carlson ,  David M. Erlach ,  Alok Paranjpye ,  Jeffery F. Summers

    Inventor： Gregory A. Carlson ,  David M. Erlach ,  Alok Paranjpye ,  Jeffery F. Summers

    IPC: H01L23/12

    CPC classification number: B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    Abstract: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate, along with a raised feature formed on the first or the second substrate. At least one of the metal layers may be deposited conformally over the raised feature. The raised feature penetrates the molten material of the first or the second metal layers during formation of the alloy, and produces a spectrum of stoichiometries for the formation of the desired alloy, as a function of the distance from the raised feature. At some distance from the raised feature, the proper ratio of the first metal to the second metal exists to form an alloy of the preferred stoichiometry.

    Abstract translation: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件，其中之一支撑该装置。 气密密封是由两个金属层的合金形成的，一个沉积在第一基板上，另一个沉积在第二基板上，以及形成在第一或第二基板上的凸起特征。 至少一个金属层可以在凸起特征上保形地沉积。 凸起的特征​​在形成合金期间渗透第一或第二金属层的熔融材料，并且作为与凸起特征的距离的函数产生用于形成所需合金的化学计量谱。 在与凸起特征相距一定距离处，存在第一金属与第二金属的适当比率以形成优选化学计量的合金。

    System and method for providing access to an encapsulated device
    8.
    发明授权
    System and method for providing access to an encapsulated device 有权
    用于提供对封装设备的访问的系统和方法

    公开(公告)号：US08088651B1

    公开(公告)日：2012-01-03

    申请号：US12232298

    申请日：2008-09-15

    Applicant: Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

    Inventor： Douglas L. Thompson ,  Gregory A. Carlson ,  David M. Erlach

    IPC: H01L21/00 ,  H01L21/30 ,  H01L21/46

    CPC classification number: B81C99/004

    Abstract: A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

    Abstract translation: 描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。 该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本上均匀地移除材料，直到孔形成在 在器件晶圆上的特征之上。 通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。

    MEMS thermal actuator and method of manufacture
    9.
    发明授权
    MEMS thermal actuator and method of manufacture 有权
    MEMS热致动器及其制造方法

    公开(公告)号：US07622783B2

    公开(公告)日：2009-11-24

    申请号：US11705739

    申请日：2007-02-14

    Applicant: Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

    Inventor： Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Paul J. Rubel

    IPC: H01L29/82

    CPC classification number: H01H1/0036 ,  H01H61/04 ,  H01H2001/0047 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

    Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

    Abstract translation: 公开了一种分离的MEMS热致动器，其对热致动器的悬臂梁中的蠕变基本上不敏感。 在分离的MEMS热致动器中，嵌入的悬臂式驱动梁形成在同一平面上，但与被动梁分开，间隙小。 由于嵌入的悬臂驱动梁和被动梁不直接耦合，镶嵌悬臂驱动梁的静止位置的任何变化可能不会传递到被动梁，如果变化的幅度小于间隙的大小 。

    In-plane electromagnetic MEMS pump
    10.
    发明授权
    In-plane electromagnetic MEMS pump 有权
    平面电磁MEMS泵

    公开(公告)号：US08690830B2

    公开(公告)日：2014-04-08

    申请号：US12801162

    申请日：2010-05-26

    Applicant: Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Steven S. Hovey ,  Paul J. Rubel

    Inventor： Gregory A. Carlson ,  John S. Foster ,  Christopher S. Gudeman ,  Steven S. Hovey ,  Paul J. Rubel

    IPC: A61M1/00 ,  A61K9/22

    CPC classification number: F04B43/043

    Abstract: A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient.

    Abstract translation: 在基板表面上形成微机械泵送系统。 泵送系统使用泵送元件，该元件通过在基本上平行于衬底表面的平面中移动的阀来泵送流体。 也可以在基板的表面上制造电磁致动机构。 线圈围绕可渗透芯体产生的磁通可以耦合到固定到泵送元件的可渗透构件。 可渗透构件和泵送元件可以构造成在平行于衬底的平面中移动。 电磁致动机构使泵送系统产生大的冲击力和相当大的力，使得由泵送系统泵送的流体可以泵送通过透皮插管，以将治疗物质递送到患者皮肤下方的组织。

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