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公开(公告)号：US20160042902A1
公开(公告)日：2016-02-11
申请号：US14456972
申请日：2014-08-11
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN , Vikram PATIL
CPC classification number: H01H59/0009 , B81C1/00333 , H01H49/00 , H03H9/1057
Abstract: A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.
Abstract translation: 用于在微细结构中形成空腔的方法包括用低温焊料密封该空腔。 该方法可以包括在衬底上形成牺牲层，在牺牲层上形成柔性膜，形成通过柔性膜到牺牲层的释放孔，通过释放孔引入蚀刻剂以去除牺牲层，然后密封 该释放孔与低温焊料。
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公开(公告)号：US20150183200A1
公开(公告)日：2015-07-02
申请号：US14142712
申请日：2013-12-27
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN , Jeffery F. SUMMERS
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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公开(公告)号：US20170283252A1
公开(公告)日：2017-10-05
申请号：US15477593
申请日：2017-04-03
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
CPC classification number: B81C1/00182 , B81B3/0018 , B81B2201/0264 , B81C2201/01 , G01L7/022 , G01L7/024 , G01L7/026 , G01L7/163 , G01L9/0001 , G01L9/0042 , G01L9/0054 , G01L9/0089
Abstract: A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.
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Patent Agency Ranking
公开(公告)号：US20160304335A1
公开(公告)日：2016-10-20
申请号：US15098353
申请日：2016-04-14
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
CPC classification number: B81B7/0067 , B81B2201/0264 , B81B2201/047 , B81B2207/115 , B81C1/00317 , B81C3/001 , B81C2201/013 , B81C2201/0197 , B81C2203/031 , H01L24/00 , H04R19/02
Abstract: A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.
Abstract translation: 具有图案化电介质阻挡层和可氧化金属层的第一富离子电介质基片阳极结合到第二富离子电介质基片上。 为了结合基板，可氧化的金属层被氧化。 电介质阻挡层可以抑制这些离子迁移到粘结线，否则可能会损害粘结强度。 因此，当接合两个基板时，在晶片之间保持牢固的结合。
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公开(公告)号：US20150183630A1
公开(公告)日：2015-07-02
申请号：US14158829
申请日：2014-01-19
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN , Jeffery F. SUMMERS
IPC: B81B1/00
CPC classification number: B81B1/00 , B32B37/0084 , B32B2037/1269 , B81B7/00 , B81C1/00269 , B81C2203/019 , Y10T428/13 , Y10T428/24851 , Y10T428/24975 , Y10T428/31536
Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Abstract translation: 公开了可以在两个光学透明基板之间形成阳极导电结合的接合技术。 阳极键可以伴随有金属合金，焊料，共晶和聚合物键。 第一阳极键可以提供诸如气密性的一个属性，而第二键可以提供另一个属性，例如导电性。
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公开(公告)号：US20180175276A1
公开(公告)日：2018-06-21
申请号：US15382606
申请日：2016-12-17
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
IPC: H01L41/083 , H01L41/047 , H01L41/27
CPC classification number: G01L1/18 , H01L41/0815 , H01L41/09
Abstract: Described herein is a method and structure for fabricating a self-sensing piezoelectric actuator. In a single device, the actuator may be formed which is capable of movement, along with a sensor that may provide a signal indicative of the speed and/or magnitude of the movement. The actuator may be fabricated on one wafer, and the sensor fabricated on a second wafer, and the two wafers bonded together to form the device. The device may be appropriate for vibration devices such as ultrasound tranducers and the like. The structure may be fabricated using well known semiconductor techniques such as depositions, etching and ion implantation.
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公开(公告)号：US20180010589A1
公开(公告)日：2018-01-11
申请号：US15712458
申请日：2017-09-22
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
CPC classification number: F04B19/006 , B81B3/0021 , B81B2201/0264 , B81B2201/032 , B81B2201/036 , B81C1/00182 , F04B17/003 , F04B43/043 , G01L9/0042 , G01L9/0054
Abstract: A microfabricated fluid pump is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied. The force may be provided by an embedded layer of piezoelectric material. Embedded strain gauges may allow self-sensing and convenient, precise operational control.
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公开(公告)号：US20170062159A1
公开(公告)日：2017-03-02
申请号：US15237120
申请日：2016-08-15
Applicant: Innovative Micro Technology
Inventor： Benedikt ZEYEN
IPC: H01H36/00
CPC classification number: H01H36/0013 , H01H2036/0093
Abstract: A MEMS device, having two flexible, permeable members which are manufactured to have sub-millimeter dimensions using MEMS fabrication procedures. The flexible, permeable members may form a reed switch, which closes an electrical connection in the presence of a magnetic field, and opens the connection otherwise. The MEMS reed switch device may be made using a three-wafer architecture of a lid wafer, a device wafer, and a lower, supporting wafer.
Abstract translation: MEMS器件具有两个柔性的可渗透构件，其制造成具有使用MEMS制造程序的亚毫米尺寸。 柔性的可渗透构件可以形成簧片开关，其在存在磁场的情况下闭合电连接，否则打开连接。 可以使用盖晶片，器件晶片和下支撑晶片的三晶片架构来制造MEMS簧片开关器件。
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