Invention Application
- Patent Title: METHOD USING GLASS SUBSTRATE ANODIC BONDING
- Patent Title (中): 使用玻璃基板阳极结合的方法
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Application No.: US14142712Application Date: 2013-12-27
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Publication No.: US20150183200A1Publication Date: 2015-07-02
- Inventor: Benedikt ZEYEN , Jeffery F. SUMMERS
- Applicant: Innovative Micro Technology
- Applicant Address: US CA Goleta
- Assignee: Innovative Micro Technology
- Current Assignee: Innovative Micro Technology
- Current Assignee Address: US CA Goleta
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B38/00 ; B32B37/18
Abstract:
A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.
Public/Granted literature
- US09315375B2 Method using glass substrate anodic bonding Public/Granted day:2016-04-19
Information query
