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公开(公告)号：US11594389B2
公开(公告)日：2023-02-28
申请号：US17200954
申请日：2021-03-15
摘要： Systems and methods for forming a magnetostatic MEMS switch include forming a movable beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A shunt bar on the movable plate may close the switch when lowered onto the contacts. The switch may generally be closed, with the shunt bar resting on the contacts. However, a magnetically permeable material may also be inlaid into the movable plate. The switch may then be opened by placing either a permanent magnet or an electromagnet in proximity to the switch.
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公开(公告)号：US20190341211A1
公开(公告)日：2019-11-07
申请号：US16515678
申请日：2019-07-18
摘要： Systems and methods for forming an electrostatic MEMS switch that is used to hot switch a source of current or voltage. At least one surface of the MEMS switch is treated with an ion milling machine to reduce surface roughness to less than about 10 nm rms.
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公开(公告)号：US20190221607A1
公开(公告)日：2019-07-18
申请号：US16246506
申请日：2019-01-13
IPC分类号： H01L27/20 , H03H9/02 , H03H9/145 , H03H9/05 , H03H9/64 , H01L41/047 , H01L41/187 , H01L41/313 , H01L41/338 , H03H3/08 , H01H59/00
CPC分类号： H01L27/20 , H01H59/0009 , H01H2239/01 , H01L41/0477 , H01L41/1873 , H01L41/1876 , H01L41/313 , H01L41/338 , H03H3/08 , H03H9/02559 , H03H9/0542 , H03H9/145 , H03H9/64
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second piezoelectric substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The second piezoelectric substrate may include lithium tantalate (LiTaO3) or lithium niobate (LiNiO3) or lead zirconate titanate (Pb[Zr(x)Ti(1−x)]O3), or integrated circuits formed thereon.
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公开(公告)号：US20190064061A1
公开(公告)日：2019-02-28
申请号：US16105693
申请日：2018-08-20
IPC分类号： G01N21/25 , H01S5/022 , H01S5/00 , H01S5/183 , G01N21/3504
摘要： Systems and methods for forming a compact gas sensor include using a lithographically fabricated, reflective and lengthy gas channel formed in at least two substrate to make a relatively long gas channel. A VCSEL radiation source may be coupled to the channel and a photodiode detector to measure the transmitted light.
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公开(公告)号：US20180294891A1
公开(公告)日：2018-10-11
申请号：US15934450
申请日：2018-03-23
CPC分类号： H04B10/801 , G02B6/12019 , H04B10/40
摘要： A transceiver and interconnect for connecting a plurality of optical cables. In one embodiment, optical sources are joined to a plurality of fiber optic output cables. The structures may use a plurality of ball lenses to collimate the diverging light from the source and launch it down one of the plurality of fibers. Through holes in a silicon substrate may allow the radiation to pass, and these features may be made very precisely.
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公开(公告)号：US10017381B2
公开(公告)日：2018-07-10
申请号：US15477593
申请日：2017-04-03
发明人： Benedikt Zeyen
CPC分类号： B81C1/00182 , B81B3/0018 , B81B2201/0264 , B81C2201/01 , G01L7/022 , G01L7/024 , G01L7/026 , G01L7/163 , G01L9/0001 , G01L9/0042 , G01L9/0054 , G01L9/0089
摘要： A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.
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公开(公告)号：US20180155184A1
公开(公告)日：2018-06-07
申请号：US15832276
申请日：2017-12-05
CPC分类号： B81B3/0024 , B81B3/0086 , B81B2201/014 , B81B2203/0118 , B81B2207/07 , B81B2207/094 , H01L23/481 , H01L23/66 , H01L2223/6616
摘要： We describe here a method that employs through substrate vias (TSVs) to frustrate the standing waves that are formed in the metal trace. TSVs may be formed at intervals in the first substrate, electrically coupling the metal bondline to the ground plane.
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公开(公告)号：US20180144879A1
公开(公告)日：2018-05-24
申请号：US15355608
申请日：2016-11-18
CPC分类号： H01H1/0036 , B81B2201/018 , B81C1/00095 , B81C1/00166 , H01H2001/0052 , H01H2001/0057
摘要： The present application discloses a method for forming electrical contacts on a semiconductor substrate. The method includes forming a first metal layer over the substrate, and forming a layer of a second metal oxide by sputter deposition of a second metal in an oxygen environment.
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公开(公告)号：US09608731B2
公开(公告)日：2017-03-28
申请号：US14931883
申请日：2015-11-04
IPC分类号： H04B10/516 , H01S5/022 , G02B27/09 , H01S5/00 , H01S5/40
CPC分类号： H04B10/516 , B81B7/0067 , B81C1/00301 , G02B27/0955 , H01S5/0064 , H01S5/021 , H01S5/02216 , H01S5/02248 , H01S5/02288 , H01S5/02292 , H01S5/02296 , H01S5/0607 , H01S5/4025 , H01S5/4031
摘要： A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.
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10.发明申请DUAL SUBSTRATE ELECTROSTATIC MEMS SWITCH WITH MULTIPLE HINGES AND METHOD OF MANUFACTURE 有权具有多个铰链的双基板静电MEMS开关及其制造方法公开(公告)号：US20160268084A1
公开(公告)日：2016-09-15
申请号：US15060630
申请日：2016-03-04
CPC分类号： H01H59/0009 , B81B7/00 , B81B2201/012 , B81C1/00341 , H01H49/00 , H01H2001/0084
摘要： Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.
摘要翻译： 用于形成静电MEMS开关的系统和方法包括在第一基板上形成可移动的悬臂梁，在第二基板上形成电触点，并且使用气密密封来连接两个基板。 可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。 可以通过蚀刻SOI衬底的器件层中的周边形状来形成悬臂梁。 可移动梁中可能形成一个额外的空隙，使其由于附加的空隙而围绕另外的铰链线弯曲。 这可以给出光束并切换有利的运动特性。
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