Invention Application
- Patent Title: BONDLINE FOR MM-WAVE APPLICATIONS
-
Application No.: US15832276Application Date: 2017-12-05
-
Publication No.: US20180155184A1Publication Date: 2018-06-07
- Inventor: Christopher S. GUDEMAN , Marin SIGURDSON
- Applicant: Innovative Micro Technology
- Applicant Address: US CA Goleta
- Assignee: Innovative Micro Technology
- Current Assignee: Innovative Micro Technology
- Current Assignee Address: US CA Goleta
- Main IPC: B81B3/00
- IPC: B81B3/00 ; H01L23/48 ; H01L23/66
Abstract:
We describe here a method that employs through substrate vias (TSVs) to frustrate the standing waves that are formed in the metal trace. TSVs may be formed at intervals in the first substrate, electrically coupling the metal bondline to the ground plane.
Information query
