公开(公告)号：US09234876B2

公开(公告)日：2016-01-12

申请号：US13853805

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: G01N27/74

CPC classification number: H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/065 ,  H01L43/10 ,  Y10T29/4913

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

Abstract translation: 微型氧传感器利用氧气的顺磁特性提供快速的响应时间，低功耗，提高的精度和灵敏度以及优异的耐久性。 所公开的微型氧传感器在半导体衬底中形成的微通道内保持环境空气样品。 O 2分子响应于施加的磁场而分离，从而建立可测量的霍尔电压。 环境空气样品中存在的氧气可以从施加磁场变化的霍尔电压变化推导出来。 磁场可以由外部磁体或集成到微通道内的气体感测腔中的薄膜磁体施加。 差分传感器还包括含有非磁化控制样品的参考元件。 微型氧传感器适用于智能手机等消费类产品中的实时空气质量监控。

公开(公告)号：US20150332995A1

公开(公告)日：2015-11-19

申请号：US14278458

申请日：2014-05-15

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong GOH ,  Wing Shenq Wong

IPC: H01L23/498 ,  H01L23/31 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/10757 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic device may include a surface mount integrated circuit (IC) package to be attached to a printed circuit board (PCB). The surface mount IC package may include at least one IC and an encapsulating material surrounding the at least one IC and having a component receiving cavity defined therein on a bottom surface thereof to be positioned adjacent the PCB. The surface mount IC package may also include electrical leads coupled to the at least one IC and extending outwardly from the encapsulating material to be coupled to the PCB. The electronic device may also include at least one electronic component carried within the component receiving cavity and that includes electrical contacts to be coupled to the PCB.

Abstract translation: 电子设备可以包括要附着到印刷电路板（PCB）的表面贴装集成电路（IC）封装。 表面安装IC封装可以包括至少一个IC和围绕至少一个IC的封装材料，并且在其底表面上具有限定在其中的部件容纳腔，以邻近PCB定位。 表面贴装IC封装还可以包括耦合到至少一个IC并从封装材料向外延伸以耦合到PCB的电引线。 电子设备还可以包括在部件接收腔内承载的至少一个电子部件，并且包括要联接到PCB的电触点。

公开(公告)号：US20150253276A1

公开(公告)日：2015-09-10

申请号：US14200828

申请日：2014-03-07

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian ,  Calvin Leung

IPC: G01N27/327 ,  A61B5/1473

CPC classification number: A61B5/1473 ,  A61B5/14532 ,  A61B5/1468 ,  G01N27/3272

Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.

Abstract translation: 通用电化学微传感器可用作生物传感器或环境传感器。 由于其微小的尺寸和灵活性，微型传感器适用于连续使用，以监测活体内的流体，或作为环境监测器。 微传感器可以形成在可重复使用的玻璃载体基板上。 柔性聚合物背衬与一组电极一起形成包含电解液化学试剂的储存器。 在制造过程中，玻璃载体衬底保护流体化学试剂不被降解。 导电微胶粒还含有试剂，同时允许部分暴露于环境生物或大气环境。 可以改变微孔密度以适应具有不同粘度的流体试剂。 柔性通过附加厚的聚合物带并将微传感器从玻璃载体基底上剥离来实现。 由此将最终结构转移到聚合物带上，提供柔性产品。

公开(公告)号：US20150212881A1

公开(公告)日：2015-07-30

申请号：US14597845

申请日：2015-01-15

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics Pte Ltd

Inventor： Antonino CONTE ,  Kailash KHAIRNAR

IPC: G06F11/10 ,  G11C29/52

CPC classification number: G06F11/1068 ,  G06F11/08 ,  G06F11/1048 ,  G11C13/0004 ,  G11C13/004 ,  G11C29/52 ,  G11C2013/0054

Abstract: A memory device may include memory cells. The method may include receiving a request of reading a selected data word associated with a selected code word stored with an error correction code, and reading a first code word representing a first version of the selected code word by comparing a state of each selected memory cell with a first reference. The method may include verifying the first code word, setting the selected code word according to the first code word in response to a positive verification, reading at least one second code word representing a second version of the selected code word, verifying the second code word, and setting the selected code word according to the second code word in response to a negative verification of the first code word and to a positive verification of the second code word.

Abstract translation: 存储器件可以包括存储器单元。 该方法可以包括：接收读取与通过纠错码存储的所选码字相关联的所选择的数据字的请求，以及通过比较所选择的存储单元的状态来读取表示所选码字的第一版本的第一代码字 第一个参考。 该方法可以包括验证第一代码字，响应于正验证，根据第一代码字设置所选择的代码字，读取表示所选代码字的第二版本的至少一个第二代码字，验证第二代码字 并且响应于第一代码字的否定验证和第二代码字的肯定验证，根据第二代码字设置所选择的代码字。

公开(公告)号：US20150137148A1

公开(公告)日：2015-05-21

申请号：US14083102

申请日：2013-11-18

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H01L25/16

CPC classification number: H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material.

Abstract translation: 一个或多个实施例涉及用于光学装置的包装系统（SiP），包括接近传感器封装。 一个实施例涉及一种光学封装，其包括具有布置在耦合到第一衬底的图像传感器处理器裸片上的多个光学器件的堆叠布置。 在两个光学器件和图像传感器处理器管芯之间提供至少第二衬底。 在一个实施例中，光学封装是接近传感器封装，并且光学器件包括发光二极管管芯和光接收二极管管芯。 在一个实施例中，发光二极管管芯固定到第二衬底的表面，并且光接收二极管管芯固定到第三衬底的表面。 第二和第三基板可以固定到图像传感器处理器管芯的表面或者封装材料的表面。

公开(公告)号：US09018753B2

公开(公告)日：2015-04-28

申请号：US13958146

申请日：2013-08-02

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H01L23/12 ,  H01L23/22 ,  H01L23/24 ,  H01L23/04 ,  H01L21/82 ,  H01L23/00 ,  H01L21/10

CPC classification number: H01L23/04 ,  H01L21/10 ,  H01L21/82 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A method is described for making electronic modules includes molding onto a substrate panel a matrix panel defining a plurality of cavities, attaching semiconductor die to the substrate panel in respective cavities of the molded matrix panel, electrically connecting the semiconductor die to the substrate panel, affixing a cover to the molded matrix panel to form an electronic module assembly, mounting the electronic module assembly on a carrier tape, and separating the electronic module assembly into individual electronic modules. An electronic module is described which includes a substrate, a wall member molded onto the substrate, the molded wall member defining a cavity, at least one semiconductor die attached to the substrate in the cavity and electrically connected to the substrate, and a cover affixed to the molded wall member over the cavity.

Abstract translation: 描述了一种用于制造电子模块的方法，包括将限定多个空腔的矩阵面板模制到基板上，将半导体管芯附着到模制矩阵面板的相应空腔中的基板面板，将半导体管芯电连接到基板面板， 模制矩阵面板的盖子以形成电子模块组件，将电子模块组件安装在载带上，以及将电子模块组件分离成各个电子模块。 描述了一种电子模块，其包括衬底，模制在衬底上的壁构件，限定空腔的模制壁构件，至少一个连接到空腔中的衬底并电连接到衬底的半导体管芯，以及固定到 模制的壁构件在空腔上。

公开(公告)号：US09018723B2

公开(公告)日：2015-04-28

申请号：US13929610

申请日：2013-06-27

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Tien Choy Loh

IPC: H01L31/0232 ,  H01L29/84 ,  H01L27/14 ,  H01L27/146

CPC classification number: H01L27/14629 ,  H01L27/14634 ,  H01L27/1467 ,  H01L27/14685 ,  H01L27/1469 ,  H01L2924/1461

Abstract: The present disclosure is directed to an infrared sensor that includes a plurality of pairs of support structures positioned on the substrate, each pair including a first support structure adjacent to a second support structure. The sensor includes plurality of pixels, where each pixel is associated with one of the pairs of support structures. Each pixel includes a first infrared reflector layer on the substrate between the first and the second support structures, a membrane formed on the first and second support structures, a thermally conductive resistive layer on the membrane and positioned above the first infrared reflector layer, a second infrared reflector layer on the resistive layer, and an infrared absorption layer on the second infrared reflector layer.

Abstract translation: 本公开涉及一种红外传感器，其包括定位在基板上的多对支撑结构，每对包括邻近第二支撑结构的第一支撑结构。 传感器包括多个像素，其中每个像素与一对支撑结构中的一个相关联。 每个像素包括在第一和第二支撑结构之间的衬底上的第一红外反射器层，形成在第一和第二支撑结构上的膜，膜上的导热电阻层并且位于第一红外反射层之上，第二 电阻层上的红外线反射层，以及第二红外线反射层上的红外线吸收层。

公开(公告)号：US09018645B2

公开(公告)日：2015-04-28

申请号：US14013507

申请日：2013-08-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Yonggang Jin

IPC: H01L31/173 ,  H01L23/00

CPC classification number: H01L31/173 ,  H01L21/568 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L24/96 ,  H01L27/14678 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00

Abstract: An electronics assembly includes a semiconductor die assembly, an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly, and first and second optical elements mounted in the first and second chambers, respectively. The semiconductor die assembly includes a semiconductor die encapsulated in a molded material, an encapsulation layer located on the top surface of the semiconductor die, and at least one patterned metal layer and at least one dielectric layer over the encapsulation layer. Conductive pillars extend through the encapsulation layer for electrical connection to the semiconductor die. The encapsulation layer blocks optical crosstalk between the first and second chambers. A method is provided for making the electronics assembly.

Abstract translation: 电子组件包括半导体管芯组件，固定到半导体管芯组件的外壳，在半导体管芯组件上限定第一和第二腔室的外壳，以及安装在第一和第二腔室中的第一和第二光学元件。 半导体管芯组件包括封装在模制材料中的半导体管芯，位于半导体管芯的顶表面上的封装层，以及至少一个图案化金属层和封装层上的至少一个介电层。 导电柱延伸穿过封装层，以与半导体管芯电连接。 封装层阻止第一和第二腔室之间的光学串扰。 提供了一种用于制造电子组件的方法。

公开(公告)号：US20150001071A1

公开(公告)日：2015-01-01

申请号：US13929515

申请日：2013-06-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian

IPC: G01N27/327

CPC classification number: G01N27/3274 ,  G01N27/327

Abstract: A bio-fluid test strip includes a fluid receiving area and a contact pad area for interfacing with a fluid sensing device. The test strip includes a fluid sensing electrodes and a first temperature sensing resistor in the fluid receiving area. The test strip further includes a second temperature sensing resistor in the contact pad area. The first and second temperature sensing resistors together provide an indication of the temperature difference between the fluid sensing area and ambience.

Abstract translation: 生物流体测试条包括用于与流体感测装置接口的流体接收区域和接触焊盘区域。 测试条在流体接收区域中包括流体感测电极和第一温度感测电阻器。 测试条还包括接触焊盘区域中的第二温度感测电阻器。 第一和第二温度感测电阻器一起提供流体感测区域和环境之间的温度差的指示。

公开(公告)号：US08860207B2

公开(公告)日：2014-10-14

申请号：US14177146

申请日：2014-02-10

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics Grenoble 2 SAS

Inventor： Yonggang Jin ,  Romain Coffy ,  Jerome Teysseyre

IPC: H01L23/34 ,  H01L21/00 ,  H01R43/16 ,  H01L23/498 ,  H01L23/36 ,  H01L23/31 ,  H01L21/768

CPC classification number: H01L23/498 ,  H01L21/561 ,  H01L21/76283 ,  H01L21/76802 ,  H01L21/76838 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49174 ,  Y10T29/49204 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A fan-out wafer level package is provided with a semiconductor die embedded in a reconstituted wafer. A redistribution layer is positioned over the semiconductor die, and includes a land grid array on a face of the package. A copper heat spreader is formed in the redistribution layer over the die in a same layer as a plurality of electrical traces configured to couple circuit pads of the semiconductor die to respective contact lands of the land grid array. In operation, the heat spreader improves efficiency of heat transfer from the die to the circuit board.