-
公开(公告)号：US12301913B2
公开(公告)日：2025-05-13
申请号：US18538286
申请日：2023-12-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kihyun Song , Kwanyoung Kim , Minsup Kim , Sukhoon Yoon , Wonjae Lee , Jongkeun Lee
IPC: H04N21/422 , H04W76/19
Abstract: A display device comprises a display unit, a communication unit and a processor, which identifies, based on an IR signal received through the communication unit, whether there is a pairing history of a remote controller and the display device, identifies whether there is a Bluetooth connection between the display device and the remote controller, counts a number of times the Bluetooth connection had been cut off between the display device and the remote controller, and controls, based on the counted number of times the Bluetooth connection had been cut off, the display unit so that a user interface (UI) for pairing with the remote controller is displayed.
-
公开(公告)号：US12301717B2
公开(公告)日：2025-05-13
申请号：US18172747
申请日：2023-02-22
Inventor： Dongwook Shim , Donghoon Lee
Abstract: An electronic device is provided. The electronic device includes a memory and a processor, the processor allocates first and second address spaces (AS) to the memory in rich execution environment (REE) when detecting a request to write data, writes the data to the first AS and detect access to the second address space in the REE, configures access permission of a first user virtual memory AS (VMAS), mapped to the first address space, in the REE so that write access is deactivated by a trusted environment manager when detecting access to the second AS, configures access permission of a second user VMAS, mapped to the second AS, in the REE so that read access is activated and write access is deactivated, and configures access permission of a first kernel VMAS, mapped to the first AS, in the REE so that write access is deactivated by the trusted environment manager.
-
公开(公告)号：US12301696B2
公开(公告)日：2025-05-13
申请号：US18163559
申请日：2023-02-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byungsub Kim , Jaeyoung Seo
Abstract: A data transmitter includes a transmitting circuit configured to transmit data, the data including alternating odd-numbered data and even-numbered data. The transmitting circuit includes a first flip flop configured to receive the odd-numbered data and generate retimed odd-numbered data, and a second flip flop configured to receive the even-numbered data and generate retimed even-numbered data. The data transmitter includes a clock transmitting circuit configured to supply a clock signal to the transmitting circuit, the clock transmitting circuit including a clock driver configured to transmit the clock signal to a receiver that receives the data.
-
公开(公告)号：US12301488B2
公开(公告)日：2025-05-13
申请号：US17448679
申请日：2021-09-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Carmela Cozzo , Aristides Papasakellariou , Emad N. Farag
IPC: H04W74/0833 , H04B17/318 , H04L5/00 , H04W74/00 , H04W74/0836
Abstract: Methods and apparatus for random access procedures with spatial settings. A method of operating a user equipment includes receiving a system information block (SIB). The SIB indicates a set of channel state information reference signals (CSI-RS) resources for CSI-RSs, a set of random access occasions (ROs), and a mapping between the set of ROs and the set of CSI-RS resources. The method further includes determining a first RO from the set of ROs for transmission of a first physical random access channel (PRACH), determining a first spatial setting for the first PRACH transmission based on a first CSI-RS resource from the set of CSI-RS resources that is mapped to the first RO, and transmitting the first PRACH in the first RO using the first spatial setting.
-
公开(公告)号：US12301444B2
公开(公告)日：2025-05-13
申请号：US18426248
申请日：2024-01-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Lalith Kumar , Nitesh Pushpak Shah , Shweta Madhurapantula
IPC: H04L12/759 , H04L45/00 , H04L45/028 , H04W8/02 , H04W8/08 , H04W24/04 , H04W36/00 , H04W60/00 , H04W60/04 , H04W60/06 , H04W76/27 , H04W88/06 , H04W8/10 , H04W8/12 , H04W8/24
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Embodiments herein provide a method for performing a routing ID (RID) update in user equipment (UE) in a wireless communication network.
-
Patent Agency Ranking
126.发明授权公开(公告)号：US12301336B2
公开(公告)日：2025-05-13
申请号：US17504834
申请日：2021-10-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwonyeol Park , Hwanmin Kang , Daecheol Kwon , Hyungjong Kim , Haejoon Kim
IPC: H04J11/00 , H04W72/541
Abstract: An operating method of a wireless communication device performing an interference whitening operation includes obtaining first channel state information of the wireless communication device, selecting a selected mode from among a plurality of modes related to the interference whitening operation, the selected mode corresponding to the first channel state information, obtaining channel performance information according to the selected mode, and updating a value function expected value based on the first channel state information, the selected mode, and the channel performance information.
-
公开(公告)号：US12301300B2
公开(公告)日：2025-05-13
申请号：US18401876
申请日：2024-01-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwangbok Park , Yongsang Yun
Abstract: An electronic device includes an antenna module including an antenna array, a radio frequency integrated circuit (RFIC) connected with the antenna array and a flexible printed circuit board connected with the RFIC, a connector disposed on the flexible printed circuit board, a communication processor disposed on a first printed circuit board, a coaxial cable electrically connecting the flexible printed circuit board and the communication processor through the connector, and a second printed circuit board configured to electrically connect the communication processor and the flexible printed circuit board. The communication processor provides a data signal to be transmitted to an external electronic device to the RFIC along a first path in the flexible printed circuit board through the coaxial cable and the connector, and provide a control signal to the RFIC along a second path in the flexible printed circuit board through the second printed circuit board.
-
公开(公告)号：US12301175B2
公开(公告)日：2025-05-13
申请号：US17963693
申请日：2022-10-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kihyun Kim , Sangho Lee , Jinhyun Kim , Hyunchul Park
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). A transformer is provided. The transformer includes a first primary inductor, a second primary inductor, and a secondary inductor. The secondary inductor may be disposed between the first primary inductor and the second primary inductor. The secondary inductor may be disposed spaced apart from the first primary inductor and the second primary inductor.
-
公开(公告)号：US12300675B2
公开(公告)日：2025-05-13
申请号：US17725163
申请日：2022-04-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiyoung Park
Abstract: Provided is a semiconductor package including a redistribution substrate, a semiconductor chip on a top surface of the redistribution substrate, a first passive device and a second passive device on a bottom surface of the redistribution substrate and spaced apart, connection terminals on the bottom surface of the redistribution substrate, and an underfill layer between the first passive device and the redistribution substrate and between the second passive device and the redistribution substrate, the underfill layer intersecting a region between the first passive device and the second passive device and extending in the first direction, wherein the bottom surface of the redistribution substrate is exposed between the first passive device and a first connection terminal closest to the first passive device in the first direction, and between the second passive device and a second connection terminal closest to the second passive device in an opposite direction to the first direction.
-
公开(公告)号：US12300671B2
公开(公告)日：2025-05-13
申请号：US18487247
申请日：2023-10-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Eunsuk Jung , Hyoukyung Cho , Jinnam Kim , Hyungjun Jeon , Kwangjin Moon , Hoonjoo Na , Hakseung Lee
IPC: H01L25/065 , H01L23/00 , H01L23/31
Abstract: A semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. A backside of a third substrate of the third semiconductor chip may be arranged to face a backside surface of a second substrate of the second semiconductor chip such that the third substrate and a second backside insulation layer provided on the backside surface of the second substrate are bonded directly to each other, or the backside of the third substrate may be arranged to face a front surface of the second substrate such that the third substrate and a second front insulation layer provided on the front surface of the second substrate are bonded directly to each other.
-
-
-
-
-
-
-
-
-
Search Results
151746
records
(took 0.112 seconds)
