公开(公告)号：US20240038732A1

公开(公告)日：2024-02-01

申请号：US18487247

申请日：2023-10-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsuk Jung ,  Hyoukyung Cho ,  Jinnam Kim ,  Hyungjun Jeon ,  Kwangjin Moon ,  Hoonjoo Na ,  Hakseung Lee

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/08 ,  H01L2224/08146

Abstract: A semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. A backside of a third substrate of the third semiconductor chip may be arranged to face a backside surface of a second substrate of the second semiconductor chip such that the third substrate and a second backside insulation layer provided on the backside surface of the second substrate are bonded directly to each other, or the backside of the third substrate may be arranged to face a front surface of the second substrate such that the third substrate and a second front insulation layer provided on the front surface of the second substrate are bonded directly to each other.

公开(公告)号：US20220013503A1

公开(公告)日：2022-01-13

申请号：US17209801

申请日：2021-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsuk Jung ,  Hyoukyung Cho ,  Jinnam Kim ,  Hyungjun Jeon ,  Kwangjin Moon ,  Hoonjoo Na ,  Hakseung Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. A backside of a third substrate of the third semiconductor chip may be arranged to face a backside surface of a second substrate of the second semiconductor chip such that the third substrate and a second backside insulation layer provided on the backside surface of the second substrate are bonded directly to each other, or the backside of the third substrate may be arranged to face a front surface of the second substrate such that the third substrate and a second front insulation layer provided on the front surface of the second substrate are bonded directly to each other.

公开(公告)号：US12300671B2

公开(公告)日：2025-05-13

申请号：US18487247

申请日：2023-10-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsuk Jung ,  Hyoukyung Cho ,  Jinnam Kim ,  Hyungjun Jeon ,  Kwangjin Moon ,  Hoonjoo Na ,  Hakseung Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. A backside of a third substrate of the third semiconductor chip may be arranged to face a backside surface of a second substrate of the second semiconductor chip such that the third substrate and a second backside insulation layer provided on the backside surface of the second substrate are bonded directly to each other, or the backside of the third substrate may be arranged to face a front surface of the second substrate such that the third substrate and a second front insulation layer provided on the front surface of the second substrate are bonded directly to each other.

公开(公告)号：US11810900B2

公开(公告)日：2023-11-07

申请号：US17209801

申请日：2021-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsuk Jung ,  Hyoukyung Cho ,  Jinnam Kim ,  Hyungjun Jeon ,  Kwangjin Moon ,  Hoonjoo Na ,  Hakseung Lee

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/08 ,  H01L2224/08146

Abstract: A semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. A backside of a third substrate of the third semiconductor chip may be arranged to face a backside surface of a second substrate of the second semiconductor chip such that the third substrate and a second backside insulation layer provided on the backside surface of the second substrate are bonded directly to each other, or the backside of the third substrate may be arranged to face a front surface of the second substrate such that the third substrate and a second front insulation layer provided on the front surface of the second substrate are bonded directly to each other.