公开(公告)号：US20240321702A1

公开(公告)日：2024-09-26

申请号：US18474166

申请日：2023-09-25

Applicant: Advanced Micro Devices, Inc. ,  Xilinx, Inc.

Inventor： Yan Wang ,  Kevin Gillespie ,  Samuel Naffziger ,  Richard Schultz ,  Raja Swaminathan ,  Omar Zia ,  John Wuu

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/367 ,  H01L25/065

CPC classification number: H01L23/49822 ,  H01L23/3675 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/32 ,  H01L25/0652 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/32146 ,  H01L2224/32165 ,  H01L2924/1431 ,  H01L2924/1437 ,  H01L2924/351

Abstract: A method for providing backside power can include providing a first circuit die having a first metal stack. The method can also include connecting a second metal stack of a second circuit die to the first metal stack of the first circuit die, wherein a backside power delivery network is located in a passivation layer of at least one of the first circuit die or the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US20240321827A1

公开(公告)日：2024-09-26

申请号：US18474158

申请日：2023-09-25

Applicant: Advanced Micro Devices, Inc. ,  Xilinx, Inc.

Inventor： Omar Zia ,  Thomas D Burd ,  Kevin Gillespie ,  Samuel Naffziger ,  Richard Schultz ,  Raja Swaminathan ,  Srividhya Venkataraman ,  Yan Wang ,  John Wuu

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/36 ,  H01L23/48 ,  H10B80/00

CPC classification number: H01L25/0657 ,  H01L23/36 ,  H01L23/481 ,  H01L24/08 ,  H01L24/16 ,  H01L24/80 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: A method for circuit die stacking can include providing a first circuit die having a first metal stack, wherein the first circuit die corresponds to a primary thermal source of an integrated circuit including the first circuit die. The method can additionally include providing a second circuit die of the integrated circuit, wherein the second circuit die has a second metal stack and is configured for connection to at least one of a package substrate or an additional die. The method can also include connecting the first metal stack to the second metal stack. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US20240321668A1

公开(公告)日：2024-09-26

申请号：US18474138

申请日：2023-09-25

Applicant: Advanced Micro Devices, Inc. ,  Xilinx, Inc.

Inventor： Thomas D. Burd ,  Gabriel H. Loh ,  John Wuu ,  Kevin Gillespie ,  Raja Swaminathan ,  Richard Schultz ,  Samuel Naffziger ,  Srividhya Venkataraman ,  Yan Wang

IPC: H01L23/34 ,  H01L23/00 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L23/34 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/80 ,  H01L25/0652 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2224/16225 ,  H01L2224/32221 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2924/1437

Abstract: A method for die pair partitioning can include providing a first circuit die having a first metal stack. The method can additionally include positioning a second circuit die having a second metal stack in a manner that places a temperature sensor in a transistor layer of the second circuit die in planar proximity to at least one hot spot located in an additional transistor layer of the first circuit die. The method can also include connecting the first metal stack of the first circuit die to the second metal stack of the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US12073806B2

公开(公告)日：2024-08-27

申请号：US17134770

申请日：2020-12-28

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： Ashish Jain ,  Dhirendra Partap Singh Rana ,  Samuel Naffziger ,  Gia Tung Phan ,  Benjamin Tsien

IPC: G09G3/36 ,  G06F1/3234 ,  G06F12/0811 ,  G06F12/0895 ,  G09G3/20

CPC classification number: G09G3/3618 ,  G06F1/3265 ,  G06F12/0811 ,  G06F12/0895 ,  G09G3/2092 ,  G09G2330/021

Abstract: Refreshing displays using on-die cache, including: determining that a static display condition has been met; storing, in cache memory of a processor, first display data; and displaying the first display data from the cache memory.

公开(公告)号：US11960340B2

公开(公告)日：2024-04-16

申请号：US17521578

申请日：2021-11-08

Applicant: Advanced Micro Devices, Inc.

Inventor： Eric J. Chapman ,  Stephen Victor Kosonocky ,  Kaushik Mazumdar ,  Vydhyanathan Kalyanasundharam ,  Samuel Naffziger ,  Eric M. Scott

IPC: G06F1/30

CPC classification number: G06F1/30

Abstract: A method for controlling a data processing system includes detecting a droop in a power supply voltage of a functional circuit of the data processing system greater than a programmable droop threshold. An operation of the data processing system is throttled according to a programmable step size, a programmable assertion time, and a programmable de-assertion time in response to detecting the droop.

公开(公告)号：US11462294B2

公开(公告)日：2022-10-04

申请号：US17121110

申请日：2020-12-14

Applicant: Advanced Micro Devices, Inc.

Inventor： Ashish Jain ,  Sriram Sundaram ,  Samuel Naffziger

IPC: G11C7/10 ,  G11C29/50 ,  G11C7/22 ,  H03K3/03

Abstract: The low end operating voltage of an integrated circuit is adjusted. Oscillations are counted at a ring oscillator on the integrated circuit over a designated period of clock cycles. Based on the number of oscillations, a prediction model associated with a first set of device degradation data and a second set of static random-access memory (SRAM) low end operating voltage data is used to select a low end operating voltage limit for a processor on the integrated circuit. The low end operating voltage of the processor is set based on the selected low end operating voltage limit. These steps are repeated multiple times during operation of the processor. A method of testing integrated circuits to provide the data employed to produce the prediction model is also provided.

公开(公告)号：US10303398B2

公开(公告)日：2019-05-28

申请号：US15794457

申请日：2017-10-26

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： John Wuu ,  Michael K. Ciraula ,  Russell Schreiber ,  Samuel Naffziger

IPC: G11C5/06 ,  G06F3/06 ,  G06F12/1009

Abstract: A processing system includes a compute die and a stacked memory stacked with the compute die. The stacked memory includes a first memory die and a second memory die stacked on top of the first memory die. A parallel access using a single memory address is directed towards different memory banks of the first memory die and the second memory die. The single memory address of the parallel access is swizzled to access the first memory die and the second memory die at different physical locations.

公开(公告)号：US20150241955A1

公开(公告)日：2015-08-27

申请号：US14190803

申请日：2014-02-26

Applicant: Advanced Micro Devices, Inc.

Inventor： Stephen Kosonocky ,  Samuel Naffziger

IPC: G06F1/32 ,  G06F1/20

CPC classification number: G06F1/3296 ,  G06F1/206 ,  G06F1/3206 ,  Y02D10/16 ,  Y02D10/172

Abstract: Some embodiments of a processing device include one or more power supply monitors to provide one or more counts representative of one or more operating frequencies of one or more circuit blocks based on a voltage supplied to the circuit block(s). Some embodiments of the processing device also include a system management unit to determine an initial voltage supplied to the circuit block(s) based on a target count and to reduce the voltage supplied to the circuit block(s) from the initial voltage in response to the count(s) generated by the power supply monitor(s) exceeding the target count.

Abstract translation: 处理装置的一些实施例包括一个或多个电源监视器，以基于提供给电路块的电压来提供表示一个或多个电路块的一个或多个工作频率的一个或多个计数。 处理装置的一些实施例还包括系统管理单元，用于基于目标计数确定提供给电路块的初始电压，并且响应于初始电压减小提供给电路块的电压与初始电压 电源监视器产生的计数超过目标计数。

公开(公告)号：US20250167050A1

公开(公告)日：2025-05-22

申请号：US18751812

申请日：2024-06-24

Applicant: Advanced Micro Devices, Inc.

Inventor： Srividhya Venkataraman ,  Ravinder Reddy Rachala ,  Samuel Naffziger ,  Thomas D. Burd ,  Phong T. Phan

IPC: H01L21/66

Abstract: A network of thermal sensors can be integrated within a semiconductor chip in a manner effective to provide local temperature monitoring and dynamic control of an associated device or system. The thermal sensors can include small area thermal ring oscillators located proximate to the core of a central processing unit (CPU), for example, and can be disposed on the chip at locations based on a designed output power density and attendant thermal gradients encountered during operation. In certain implementations, the presently-disclosed sensor configuration can be used to measure deviation from set threshold temperatures. Closed-loop control can be implemented to mitigate performance loss while adjusting the clock speed of the CPU independent of the system management unit.

公开(公告)号：US20190393124A1

公开(公告)日：2019-12-26

申请号：US16563138

申请日：2019-09-06

Applicant: Advanced Micro Devices, Inc.

Inventor： John Wuu ,  Samuel Naffziger ,  Patrick J. Shyvers ,  Milind S. Bhagavat ,  Kaushik Mysore ,  Brett P. Wilkerson

IPC: H01L23/367 ,  H01L25/00 ,  H01L25/065

Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.