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公开(公告)号:US11782897B2
公开(公告)日:2023-10-10
申请号:US17721748
申请日:2022-04-15
Applicant: Advanced Micro Devices, Inc.
Inventor: Steven R. Havlir , Patrick J. Shyvers
CPC classification number: G06F16/2264 , G06F16/2246 , G06F16/2255 , G06F9/3844
Abstract: Described herein is a system and method for multiplexer tree (muxtree) indexing. Muxtree indexing performs hashing and row reduction in parallel by use of at least one bit in a lookup address at least once in a particular path of the muxtree. The muxtree indexing generates a different final index as compared to conventional hashed indexing but still results in a fair hash, where all table entries get used with equal distribution with uniformly random selects.
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公开(公告)号:US20220237164A1
公开(公告)日:2022-07-28
申请号:US17721748
申请日:2022-04-15
Applicant: Advanced Micro Devices, Inc.
Inventor: Steven R. Havlir , Patrick J. Shyvers
IPC: G06F16/22
Abstract: Described herein is a system and method for multiplexer tree (muxtree) indexing. Muxtree indexing performs hashing and row reduction in parallel by use of at least one bit in a lookup address at least once in a particular path of the muxtree. The muxtree indexing generates a different final index as compared to conventional hashed indexing but still results in a fair hash, where all table entries get used with equal distribution with uniformly random selects.
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公开(公告)号:US11164807B2
公开(公告)日:2021-11-02
申请号:US16563077
申请日:2019-09-06
Applicant: Advanced Micro Devices, Inc.
Inventor: John Wuu , Samuel Naffziger , Patrick J. Shyvers , Milind S. Bhagavat , Kaushik Mysore , Brett P. Wilkerson
IPC: H01L23/367 , H01L25/00 , H01L25/065 , H01L23/36 , H01L23/373
Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.
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公开(公告)号:US20180210994A1
公开(公告)日:2018-07-26
申请号:US15416731
申请日:2017-01-26
Applicant: Advanced Micro Devices, Inc.
Inventor: John J. Wuu , Patrick J. Shyvers , Ryan Alan Selby
CPC classification number: G06F17/5077 , G06F17/5072 , G06F17/5081 , G11C5/025 , G11C7/06 , G11C7/20
Abstract: A system and method for floorplanning a memory. A computing system includes a processing unit which generates memory access requests and a memory. The size of each memory line in the memory includes M bits. A memory macro block includes at least a primary array and a sidecar array. The primary array stores a first portion of a memory line and the sidecar array stores a second smaller portion of the memory line being accessed. The primary array and the sidecar array have different heights. The height of the sidecar array is based on a notch height in at least one corner of the memory macro block. The notch creates on-die space for s reserved area on the die. The notches result in cross-shaped, T-shaped, and/or L-shaped memory macro blocks.
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公开(公告)号:US12266585B2
公开(公告)日:2025-04-01
申请号:US17516988
申请日:2021-11-02
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: John Wuu , Samuel Naffziger , Patrick J. Shyvers , Milind S. Bhagavat , Kaushik Mysore , Brett P. Wilkerson
IPC: H01L23/367 , H01L23/36 , H01L25/00 , H01L25/065 , H01L23/373
Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.
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公开(公告)号:US11308057B2
公开(公告)日:2022-04-19
申请号:US15824771
申请日:2017-11-28
Applicant: Advanced Micro Devices, Inc.
Inventor: Steven R. Havlir , Patrick J. Shyvers
Abstract: Described herein is a system and method for multiplexer tree (muxtree) indexing. Muxtree indexing performs hashing and row reduction in parallel by use of each select bit only once in a particular path of the muxtree. The muxtree indexing generates a different final index as compared to conventional hashed indexing but still results in a fair hash, where all table entries get used with equal distribution with uniformly random selects.
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公开(公告)号:US11189540B2
公开(公告)日:2021-11-30
申请号:US16563138
申请日:2019-09-06
Applicant: Advanced Micro Devices, Inc.
Inventor: John Wuu , Samuel Naffziger , Patrick J. Shyvers , Milind S. Bhagavat , Kaushik Mysore , Brett P. Wilkerson
IPC: H01L23/367 , H01L25/00 , H01L25/065 , H01L23/36 , H01L23/373
Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.
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公开(公告)号:US11776599B2
公开(公告)日:2023-10-03
申请号:US17485178
申请日:2021-09-24
Applicant: Advanced Micro Devices, Inc.
Inventor: Patrick J. Shyvers
CPC classification number: G11C7/222 , G11C7/106 , G11C7/1039 , G11C7/1087
Abstract: A processing device is provided which includes a processor and a data storage structure. The data storage structure comprises a data storage array comprising a plurality of lines. Each line comprises at least one A latch configured to store a data bit and a clock gater. The data storage structure also comprises a write data B latch configured to store, over different clock cycles, a different data bit, each to be written to the at least one A latch of one of the plurality of lines. The data storage structure also comprises a plurality of write index B latches shared by the clock gaters of the lines. The write index B latches are configured to store, over the different clock cycles, combinations of index bits having values which index one of the lines to which a corresponding data bit is to be stored.
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公开(公告)号:US20230101038A1
公开(公告)日:2023-03-30
申请号:US17489741
申请日:2021-09-29
Applicant: Advanced Micro Devices, Inc.
Inventor: Patrick J. Shyvers
IPC: G06F12/0891 , G06F12/02 , G06F3/06 , G06F1/08
Abstract: A method and processing device for accessing data is provided. The processing device comprises a cache and a processor. The cache comprises a first data section having a first cache hit latency and a second data section having a second cache hit latency that is different from the first cache hit latency of the first data section. The processor is configured to request access to data in memory, the data corresponding to a memory address which includes an identifier that identifies the first data section of the cache. The processor is also configured to load the requested data, determined to be located in the first data section of the cache, according to the first cache hit latency of the first data section of the cache.
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公开(公告)号:US20190393123A1
公开(公告)日:2019-12-26
申请号:US16563077
申请日:2019-09-06
Applicant: Advanced Micro Devices, Inc.
Inventor: John Wuu , Samuel Naffziger , Patrick J. Shyvers , Milind S. Bhagavat , Kaushik Mysore , Brett P. Wilkerson
IPC: H01L23/367 , H01L25/00 , H01L25/065
Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.
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