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公开(公告)号：US20240136728A1
公开(公告)日：2024-04-25
申请号：US18461497
申请日：2023-09-04
发明人： Pao-Hung CHOU , Shih-Ping HSU
CPC分类号： H01Q13/18 , H01Q1/2283
摘要： An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.
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公开(公告)号：US20240096838A1
公开(公告)日：2024-03-21
申请号：US18469450
申请日：2023-09-18
发明人： Chu-Chin HU , Shih-Ping HSU , Chih-Kuai YANG
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498 , H01L25/065 , H01L25/16
CPC分类号： H01L24/29 , H01L23/3107 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L24/08 , H01L24/32 , H01L25/0655 , H01L25/16 , H01L24/16 , H01L2224/08235 , H01L2224/08238 , H01L2224/16227 , H01L2224/16238 , H01L2224/29084 , H01L2224/29139 , H01L2224/29155 , H01L2224/29166 , H01L2224/2957 , H01L2224/32227 , H01L2224/32238 , H01L2924/35121
摘要： A component-embedded packaging structure is provided, in which a plurality of metal layers are formed on an inactive surface of a semiconductor chip so as to serve as a buffer portion, and the semiconductor chip is disposed on a carrying portion with the buffer portion via an adhesive. Then, the semiconductor chip is encapsulated by an insulating layer, and a build-up circuit structure is formed on the insulating layer and electrically connected to the semiconductor chip. Therefore, the buffer portion can prevent delamination from occurring between the semiconductor chip and the adhesive on the carrying portion if the semiconductor chip has a CTE (Coefficient of Thermal Expansion) less than a CTE of the adhesive.
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公开(公告)号：US20230187402A1
公开(公告)日：2023-06-15
申请号：US18072694
申请日：2022-11-30
发明人： Wen-Chang CHEN , Che-Wei HSU
CPC分类号： H01L24/24 , H01L23/3107 , H01L21/56 , H01L2224/24011
摘要： An electronic package is provided, in which a surface treatment layer is formed on parts of a surface of a functional pad, such that an electronic element is in contact with and bonded to the functional pad and the surface treatment layer via a bonding layer. Therefore, when the electronic package undergoes thermal shock, the surface treatment layer having buffering capability can improve packaging reliability of the electronic package.
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公开(公告)号：US11417581B2
公开(公告)日：2022-08-16
申请号：US15997845
申请日：2018-06-05
发明人： Shih-Ping Hsu , Chin-Wen Liu , Tang-I Wu , Shu-Wei Hu
IPC分类号： H01L23/31 , H01L23/498 , H01L21/48 , H01L21/56
摘要： A semiconductor package is provided and includes: an insulative layer having opposing first and second surfaces; a wiring layer embedded in the insulative layer and having a first side that is exposed from the first surface of the insulative layer and a second side opposing the first side and attached to the second surface of the insulative layer; at least one electronic component mounted on the second side of the wiring layer and electrically connected to the wiring layer; and an encapsulating layer formed on the second side of the wiring layer and the second surface of the insulative layer and encapsulating the electronic component. Therefore, the single wiring layer is allowed to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path.
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公开(公告)号：US20220254869A1
公开(公告)日：2022-08-11
申请号：US17586842
申请日：2022-01-28
发明人： Shih-Ping Hsu
IPC分类号： H01L49/02 , H01F27/28 , H01F27/32 , H01F41/04 , H01L23/00 , H01L23/31 , H01L23/498 , H01L23/64
摘要： An inductor structure is provided. A plurality of first and second conductive posts have end surfaces corresponding in profile to ends of first conductive sheets, respectively. As such, the profiles of the end surfaces of the first and second conductive posts are non-cylindrical so as to increase the contact area between the first conductive sheets and the first and second conductive posts, thereby improving the conductive quality and performance of the inductor. Further, since the first and second conductive posts are formed by stacking a plurality of post bodies on one another, the number and cross-sectional area of loops are increased so as to increase the inductance value. A method for fabricating the inductor structure, an electronic package and a fabrication method thereof, and a method for fabricating a packaging carrier are further provided.
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公开(公告)号：US20180261578A1
公开(公告)日：2018-09-13
申请号：US15975758
申请日：2018-05-09
发明人： Shih-Ping HSU , Chao-Tsung TSENG
IPC分类号： H01L25/065 , H05K1/18 , H01L21/683 , H05K3/46 , H01L25/00 , H01L23/00 , H01L25/16 , H01L23/538 , H05K3/00 , H05K1/16 , H05K1/02 , H01L23/50 , H01L23/498 , H01L21/48 , H05K3/28 , H05K3/34
CPC分类号： H01L25/0657 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/16 , H01L25/50 , H01L2221/68345 , H01L2224/13023 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16112 , H01L2224/16113 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2924/15153 , H01L2924/15331 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0231 , H05K1/162 , H05K1/183 , H05K1/185 , H05K3/0032 , H05K3/0044 , H05K3/284 , H05K3/3431 , H05K3/4682 , H05K3/4697 , H05K2201/10 , H05K2201/10007 , H05K2201/10015 , H05K2201/1003 , H05K2201/10037 , H05K2201/10545 , Y10T29/49131 , H01L2924/014 , H01L2924/00014
摘要： A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.
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公开(公告)号：US20180047662A1
公开(公告)日：2018-02-15
申请号：US15796713
申请日：2017-10-27
发明人： Che-Wei Hsu , Shih-Ping Hsu , Chih-Wen Liu
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/13 , H01L23/145 , H01L2924/0002 , H05K3/205 , H05K3/4647 , H05K3/4682 , H05K2201/09563 , H05K2201/10378 , H05K2203/0152 , H01L2924/00
摘要： A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming, on the conductive pillars a second circuit layer that is electrically connected to the conductive pillars, forming a second insulating layer on the second surface of the first insulating layer and the second circuit layer, exposing a portion of a surface of the second circuit layer from the second insulating layer, and removing the carrier. The invention further provides the interposer substrate as described above.
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公开(公告)号：US09852977B2
公开(公告)日：2017-12-26
申请号：US15351838
申请日：2016-11-15
发明人： Chun-Hsien Yu , Pao-Hung Chou
IPC分类号： H05K1/00 , H01L23/498 , H05K1/11 , H05K1/03
CPC分类号： H01L23/49894 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H05K1/0271 , H05K1/036 , H05K1/0393 , H05K1/115 , H05K3/28 , H05K2201/0376
摘要： This disclosure provides a package substrate which includes a rigid dielectric material layer, a first wiring layer having at least one first metal wire formed on the rigid dielectric material layer, and a first flexible dielectric material layer formed on the first wiring layer.
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公开(公告)号：US09711445B2
公开(公告)日：2017-07-18
申请号：US15054861
申请日：2016-02-26
发明人： Chun-Hsien Yu , Shih-Ping Hsu
IPC分类号： H01L23/02 , H01L23/498
CPC分类号： H01L23/4985 , H01L23/49822 , H01L23/49827 , H01L23/49861
摘要： This disclosure provides a package substrate, a package structure including the same and their fabrication methods. The package substrate comprises: a first wiring layer having a first metal wire and a first dielectric material layer surrounding the first metal wire; a conductive pillar layer formed on the first wiring layer and including a first metal pillar connected to the first metal wire and a molding compound layer surrounding the first metal pillar; a flexible material layer formed on the conductive pillar layer and including a first opening formed on the first metal pillar and exposing the first metal pillar; and a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the first metal pillar through the first opening, a second metal pillar formed on the second metal wire, and a protective layer surrounding the second metal wire and the second metal pillar.
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公开(公告)号：US09711444B2
公开(公告)日：2017-07-18
申请号：US15231931
申请日：2016-08-09
发明人： Wen-Hung Hu
IPC分类号： H01L21/48 , H01L21/56 , H01L23/31 , H01L23/498
CPC分类号： H01L21/565 , H01L21/4857 , H01L21/486 , H01L23/3114 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L23/50 , H01L2224/16225 , H01L2924/15311 , H01L2924/19105
摘要： A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.
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