公开(公告)号：US20230187402A1

公开(公告)日：2023-06-15

申请号：US18072694

申请日：2022-11-30

申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.

发明人： Wen-Chang CHEN ,  Che-Wei HSU

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/24 ,  H01L23/3107 ,  H01L21/56 ,  H01L2224/24011

摘要： An electronic package is provided, in which a surface treatment layer is formed on parts of a surface of a functional pad, such that an electronic element is in contact with and bonded to the functional pad and the surface treatment layer via a bonding layer. Therefore, when the electronic package undergoes thermal shock, the surface treatment layer having buffering capability can improve packaging reliability of the electronic package.