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    GANG CLIP WITH MOUNT COMPOUND ARRESTER
    2.
    发明公开
    GANG CLIP WITH MOUNT COMPOUND ARRESTER 审中-公开

    公开(公告)号：US20230170322A1

    公开(公告)日：2023-06-01

    申请号：US17536498

    申请日：2021-11-29

    申请人： Texas Instruments Incorporated

    发明人： Ernesto Pentecostes Rafael, JR. ,  Kristina Dianne Hernandez Sazon ,  Dior Yñigo Medina Gadia

    IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/495

    CPC分类号： H01L24/37 ,  H01L24/32 ,  H01L24/38 ,  H01L25/0657 ,  H01L23/49575 ,  H01L2224/32245 ,  H01L2224/3702 ,  H01L2924/38

    摘要： An integrated circuit package includes a lead frame, a first die adhered to the lead frame on a first side of the first die, and a first clip having a clip foot adhered to the lead frame. The first clip has a first side and a second side. A first die attachment region is defined by a first group of four notches in the first side of the first clip. The first clip extends from the lead frame and contacts a second side of the first die at the first die attachment region via a first layer of solder paste. The integrated circuit package further has a second die adhered to the second side of the first clip on a first side of the second die, and a second clip having a clip foot adhered to the lead frame. The second clip has a first side and a second side. A second die attachment region is defined by a second group of four notches in the first side of the second clip. The second clip extends from the lead frame and contacts a second side of the second die at the second die attachment region via a second layer of solder paste.

    Fixture design for pre-attachment package on package component assembly
    4.
    发明授权
    Fixture design for pre-attachment package on package component assembly 有权
    夹具组件装配前套件的夹具设计

    公开(公告)号：US09397065B1

    公开(公告)日：2016-07-19

    申请号：US14468216

    申请日：2014-08-25

    申请人： Flextronics AP, LLC

    发明人： Jennifer Nguyen ,  David Geiger ,  Ranilo Aranda ,  Jonas Sjoberg ,  Anwar Mohammed ,  Murad Kurwa

    IPC分类号： H01L23/544 ,  H01L23/00 ,  H01L25/00 ,  H01L23/538

    CPC分类号： H05K3/244 ,  G06K19/07754 ,  H01L23/5386 ,  H01L24/65 ,  H01L25/00 ,  H01L2924/38 ,  H01M6/40 ,  H04B1/3816 ,  H05K1/097 ,  H05K1/111 ,  H05K3/30 ,  H05K3/40

    摘要： Embodiments of the present invention relate to a fixture design for pre-attachment package on package component assembly. The fixture design includes a plurality of pockets arranged in a N×M array. The plurality of pockets is sized to receive bottom packages. The fixture design includes global fiducials that are used to locate positions of the pockets on the fixture, and sets of local fiducials, with each set being specific to one of the pockets and used to refine the position of the location of a corresponding pocket. Each of the pockets can include one or more ear cuts for easy component placement and component removal. The fixture design can include a vacuum port for coupling with a vacuum source for drawing a vacuum to hold the bottom packages down. The fixture design can also include a cover that is used with the fixture to keep the components from being disturbed.

    摘要翻译： 本发明的实施例涉及一种用于包装部件组件上的预附接包装的夹具设计。 夹具设计包括以N×M阵列排列的多个口袋。 多个口袋的尺寸适于接纳底部包装。 夹具设计包括用于定位夹具上的凹穴的位置的全局基准和局部基准的集合，其中每一组特定于其中一个凹穴并且用于细化相应凹穴的位置的位置。 每个口袋可以包括一个或多个耳朵切口，便于元件放置和元件移除。 夹具设计可以包括用于与真空源耦合的真空端口，用于抽真空以将底部包装件向下保持。 夹具设计还可以包括与夹具一起使用以防止部件受到干扰的盖子。

    Printed RFID circuit
    7.
    发明授权
    Printed RFID circuit 有权
    打印RFID电路

    公开(公告)号：US09053405B1

    公开(公告)日：2015-06-09

    申请号：US14162483

    申请日：2014-01-23

    申请人： Flextronics AP, LLC

    发明人： Weifeng Liu ,  Anwar Mohammed ,  Murad Kurwa

    IPC分类号： G06K19/07 ,  G06K19/077 ,  H01M6/40

    CPC分类号： H05K3/244 ,  G06K19/07754 ,  H01L23/5386 ,  H01L24/65 ,  H01L25/00 ,  H01L2924/38 ,  H01M6/40 ,  H04B1/3816 ,  H05K1/097 ,  H05K1/111 ,  H05K3/30 ,  H05K3/40

    摘要： A printed circuit including a non-conductive substrate, a first conductive layer printed on the non-conductive substrate and one or more additional layers printed on the substrate. The first conductive layer is able to have one or more antennas each forming a predetermined pattern, a first conductive sheet and one or more conductive traces. The one or more additional layers include a first electrode printed on the top of the first conductive sheet, a buffer printed on top of the first electrode, a second electrode printed on top of the buffer and a second conductive sheet printed on top of the second electrode. The printed circuit is further able to include an RFID chip electrically coupled with the antennas and at least one of the first and second conductive sheets via the conductive traces, wherein the first and second conductive sheets, the buffer and the first and second electrodes form a power source that provides electrical power to the RFID chip.

    摘要翻译： 一种印刷电路，包括非导电衬底，印刷在非导电衬底上的第一导电层和印刷在衬底上的一个或多个附加层。 第一导电层能够具有各自形成预定图案的一个或多个天线，第一导电片和一个或多个导电迹线。 所述一个或多个附加层包括印刷在第一导电片的顶部上的第一电极，印刷在第一电极顶部上的缓冲器，印刷在缓冲器顶部的第二电极和印刷在第二导电片的第二个顶部上的第二导电片 电极。 印刷电路还能够包括通过导电迹线与天线以及第一和第二导电片中的至少一个电耦合的RFID芯片，其中第一和第二导电片，缓冲器和第一和第二电极形成 向RFID芯片提供电力的电源。