公开(公告)号：US09335340B2

公开(公告)日：2016-05-10

申请号：US13948775

申请日：2013-07-23

申请人： Raimondo P. Sessego ,  Tehmoor M. Dar ,  Bruno J. Debeurre

发明人： Raimondo P. Sessego ,  Tehmoor M. Dar ,  Bruno J. Debeurre

IPC分类号： G01P21/00 ,  G01P15/125 ,  G01P15/08

CPC分类号： B81B3/0021 ,  G01P15/125 ,  G01P21/00 ,  G01P2015/0834

摘要： A sensor system includes a microelectromechanical systems (MEMS) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a MEMS sensor. The MEMS sensor is configured to provide a modulated output signal that is a function of the combined signal. The system is configured to demodulate and filter the modulated output signal, compare the demodulated, filtered signal with the input signal to determine amplitude and phase differences, and determine, based on the amplitude and phase differences, various parameters of the MEMS sensor. A method for determining MEMS sensor parameters is also provided.

摘要翻译： 传感器系统包括微机电系统（MEMS）传感器，控制电路，信号评估电路，数模转换器，信号滤波器，放大器，解调电路和存储器。 该系统被配置为产生高和低频信号，组合它们，并将组合的输入信号提供给MEMS传感器。 MEMS传感器被配置为提供作为组合信号的函数的调制输出信号。 该系统被配置为对调制的输出信号进行解调和滤波，将经解调的滤波信号与输入信号进行比较以确定幅度和相位差，并且基于振幅和相位差来确定MEMS传感器的各种参数。 还提供了一种用于确定MEMS传感器参数的方法。

公开(公告)号：US20130168141A1

公开(公告)日：2013-07-04

申请号：US13820758

申请日：2012-01-24

申请人： Junichi Hozumi ,  Takumi Taura ,  Shin Okumura ,  Tomohiro Nakatani ,  Ryo Tomoida

发明人： Junichi Hozumi ,  Takumi Taura ,  Shin Okumura ,  Tomohiro Nakatani ,  Ryo Tomoida

IPC分类号： H01L21/762 ,  H05K1/03

CPC分类号： H01L21/76251 ,  B81C1/00095 ,  B81C1/00301 ,  C03C15/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0834 ,  H01L21/486 ,  H01L23/057 ,  H01L23/10 ,  H01L23/15 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing a substrate with through-electrode includes the steps of: forming recesses or through-holes in either one of a silicon substrate and a glass substrate; forming protrusions in the other substrate; laying the silicon substrate and glass substrate on each other so that the protrusions are inserted in the respective recesses or through-holes; and bonding the silicon substrate and the glass substrate to each other.

摘要翻译： 用于制造具有贯通电极的基板的方法包括以下步骤：在硅基板和玻璃基板中的任一个中形成凹部或通孔; 在另一基板上形成突起; 将硅基板和玻璃基板彼此铺设，使得突起插入相应的凹部或通孔中; 并将硅衬底和玻璃衬底彼此接合。

公开(公告)号：US20120216616A1

公开(公告)日：2012-08-30

申请号：US13033854

申请日：2011-02-24

申请人： Peter S. Schultz

发明人： Peter S. Schultz

IPC分类号： G01P15/02

CPC分类号： G01P15/125 ,  G01P2015/0834 ,  G01P2015/0871

摘要： A MEMS device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (46) extends from the movable element (22). The secondary structure (46) includes a secondary mass (54) and a spring (56) interconnected between the movable element (22) and the mass (54). The spring (56) is sufficiently stiff to prevent movement of the mass (54) when the movable element (22) is subjected to force within a sensing range of the device (20). When the device (20) is subjected to mechanical shock (66), the spring (56) deflects so that the mass (54) moves counter to the motion of the movable element (22). Movement of the mass (54) causes the movable element (22) to vibrate to mitigate stiction between the movable element (22) and other structures of the device (20) and/or to prevent breakage of components within the device (22).

摘要翻译： MEMS器件（20）包括适于相对于衬底（24）运动的衬底（24）和可移动元件（22）。 二级结构（46）从可移动元件（22）延伸。 二次结构（46）包括互连在可移动元件（22）和质量块（54）之间的二次质量块（54）和弹簧（56）。 当可移动元件（22）在设备（20）的感测范围内受到力时，弹簧（56）足够坚固以防止质量块（54）的移动。 当装置（20）经受机械冲击（66）时，弹簧（56）偏转，使得质量块（54）相对于可移动元件（22）的运动而移动。 质量块（54）的移动导致可移动元件（22）振动以减轻可移动元件（22）和设备（20）的其他结构之间的静摩擦和/或防止元件（22）内的部件损坏。

公开(公告)号：US20060021436A1

公开(公告)日：2006-02-02

申请号：US10517808

申请日：2003-06-10

申请人： Konrad Kapser ,  Ulrich Prechtel ,  Helmut Seidel

发明人： Konrad Kapser ,  Ulrich Prechtel ,  Helmut Seidel

IPC分类号： G01P15/18 ,  G01P15/02

CPC分类号： G01P15/18 ,  G01P15/125 ,  G01P2015/0831 ,  G01P2015/0834 ,  G01P2015/0845 ,  G01P2015/086

摘要： A multi-axial monolithic acceleration sensor has the following features. The acceleration sensor consists of plural individual sensors with respectively a main sensitivity axis arranged on a common substrate. Each individual sensor is rotatably moveably suspended on two torsion spring elements and has a seismic mass with a center of gravity. Each individual sensor has components that measure the deflection of the seismic mass. The acceleration sensor preferably consists of at least three identical individual sensors. Each individual sensor is suspended eccentrically relative to its center of gravity and is rotated by 90°, 180° or 270° relative to the other individual sensors.

摘要翻译： 多轴单片加速度传感器具有以下特点。 加速度传感器由多个单独的传感器组成，分别具有布置在公共基板上的主灵敏度轴。 每个单独的传感器可旋转地可移动地悬挂在两个扭转弹簧元件上并且具有重心的地震质量。 每个单独的传感器具有测量地震质量的偏转的组件。 加速度传感器优选地由至少三个相同的单独传感器组成。 每个传感器相对于其重心偏心悬挂，并相对于其他单独的传感器旋转90°，180°或270°。

公开(公告)号：US20170003313A1

公开(公告)日：2017-01-05

申请号：US15196897

申请日：2016-06-29

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Takahiro OMORI ,  Kazuo WATABE ,  Osamu NISHIMURA ,  Akihiro KASAHARA

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81B2203/053 ,  G01P2015/0828 ,  G01P2015/0834

摘要： According to one embodiment, a sensor includes a structure body, a first flexible unit, and a first sensing unit. The structure body includes a first portion and a second portion. The second portion is linked to the first portion. The first portion is displaced along a first direction intersecting a direction connecting the first portion and the second portion. The second portion is displaced along a second direction according to the displacement of the first portion. The second direction intersects the first direction. The first flexible unit deforms along the second direction according to the displacement of the second portion along the second direction. The first sensing unit senses the deformation of the first flexible unit.

摘要翻译： 根据一个实施例，传感器包括结构体，第一柔性单元和第一感测单元。 结构体包括第一部分和第二部分。 第二部分连接到第一部分。 第一部分沿着与连接第一部分和第二部分的方向交叉的第一方向移位。 第二部分根据第一部分的位移沿第二方向移位。 第二个方向与第一个方向相交。 第一柔性单元根据第二部分沿着第二方向的位移沿第二方向变形。 第一感测单元感测第一柔性单元的变形。

公开(公告)号：US09227840B2

公开(公告)日：2016-01-05

申请号：US14487104

申请日：2014-09-16

申请人： Industrial Technology Research Institute

发明人： Chung-Yuan Su ,  Chin-Fu Kuo ,  Chih-Yuan Chen ,  Chao-Ta Huang

IPC分类号： H01L43/06 ,  B81B7/00 ,  G01P15/00 ,  G01R33/00 ,  G01R33/028

CPC分类号： B81B7/008 ,  B81B2201/0228 ,  B81B2201/025 ,  B81B2203/0109 ,  G01P15/00 ,  G01P15/124 ,  G01P15/125 ,  G01P2015/0831 ,  G01P2015/0834 ,  G01R33/00 ,  G01R33/0286

摘要： A micro-electro mechanical apparatus having a PN-junction is provided. The micro-electro mechanical apparatus includes a movable mass, a conductive layer, and an electrode. The movable mass includes a P-type semiconductor layer and an N-type semiconductor layer. The PN-junction is formed between the P-type semiconductor layer and the N-type semiconductor layer. The micro-electro mechanical apparatus is capable of eliminating abnormal voltage signal when an alternating current passes through the conductive layer. The micro-electro mechanical apparatus is adapted to measure acceleration and magnetic field. The micro-electro mechanical apparatus can be other types of micro-electro mechanical apparatus such as micro-electro mechanical scanning micro-mirror.

摘要翻译： 提供具有PN结的微机电装置。 微机电装置包括可移动质量块，导电层和电极。 可移动块包括P型半导体层和N型半导体层。 在P型半导体层和N型半导体层之间形成PN结。 微电子机械装置能够在交流电流通过导电层时消除异常电压信号。 微机电装置适用于测量加速度和磁场。 微电机械装置可以是其他类型的微电机械装置，例如微机电扫描微镜。

公开(公告)号：US20150183632A1

公开(公告)日：2015-07-02

申请号：US14487104

申请日：2014-09-16

申请人： Industrial Technology Research Institute

发明人： Chung-Yuan Su ,  Chin-Fu Kuo ,  Chih-Yuan Chen ,  Chao-Ta Huang

IPC分类号： B81B3/00

CPC分类号： B81B7/008 ,  B81B2201/0228 ,  B81B2201/025 ,  B81B2203/0109 ,  G01P15/00 ,  G01P15/124 ,  G01P15/125 ,  G01P2015/0831 ,  G01P2015/0834 ,  G01R33/00 ,  G01R33/0286

摘要： A micro-electro mechanical apparatus having a PN-junction is provided. The micro-electro mechanical apparatus includes a movable mass, a conductive layer, and an electrode. The movable mass includes a P-type semiconductor layer and an N-type semiconductor layer. The PN-junction is formed between the P-type semiconductor layer and the N-type semiconductor layer. The micro-electro mechanical apparatus is capable of eliminating abnormal voltage signal when an alternating current passes through the conductive layer. The micro-electro mechanical apparatus is adapted to measure acceleration and magnetic field. The micro-electro mechanical apparatus can be other types of micro-electro mechanical apparatus such as micro-electro mechanical scanning micro-mirror.

摘要翻译： 提供具有PN结的微机电装置。 微机电装置包括可移动质量块，导电层和电极。 可移动块包括P型半导体层和N型半导体层。 在P型半导体层和N型半导体层之间形成PN结。 微电子机械装置能够在交流电流通过导电层时消除异常电压信号。 微机电装置适用于测量加速度和磁场。 微电机械装置可以是其他类型的微电机械装置，例如微机电扫描微镜。

公开(公告)号：US20100024552A1

公开(公告)日：2010-02-04

申请号：US12183678

申请日：2008-07-31

申请人： Michael J. Foster

发明人： Michael J. Foster

IPC分类号： G01P15/10 ,  G01P15/125

CPC分类号： G01P15/125 ,  G01P15/131 ,  G01P2015/0831 ,  G01P2015/0834 ,  G01P2015/0882

摘要： Systems and methods sense out-of-plane linear accelerations. In an exemplary embodiment, the out-of plane linear accelerometer is accelerated in an out-of-plane direction, wherein the acceleration generates a rotational torque to an unbalanced proof mass. A rebalancing force is applied to at least one plurality of interleaved rotor comb tines and stator comb tines, wherein the rebalancing force opposes the rotational torque, wherein the rotor comb tines are disposed at an end of the unbalanced proof mass, and wherein the stator comb tines are disposed on a stator adjacent to the end of the unbalanced proof mass. An amount of acceleration is then determined based upon the applied rebalancing force.

摘要翻译： 系统和方法感知到平面外的线性加速度。 在示例性实施例中，面外线性加速度计在面外方向加速，其中加速度产生到不平衡证明质量块的旋转扭矩。 重新平衡力被施加到至少一个交错的转子梳齿和定子梳齿上，其中重新平衡力与旋转扭矩相反，其中转子梳齿设置在不平衡证明块的端部，并且其中定子梳 尖齿设置在与不平衡证明块的端部相邻的定子上。 然后基于所应用的重新平衡力来确定加速度。

公开(公告)号：US5148604A

公开(公告)日：1992-09-22

申请号：US701781

申请日：1991-05-17

申请人： Frank Bantien

发明人： Frank Bantien

IPC分类号： G01C9/06 ,  G01P15/08 ,  G01P15/125

CPC分类号： G01C9/06 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0834 ,  G01P2015/086

摘要： A sensor for measurement of tilt or inclination angle features a sensor element made from a monocrystalline silicon wafer, from which is etched at least one movable silicon mass. The silicon mass is freed from the surrounding wafer by an etch groove which completely penetrates the silicon wafer, and is connected to the silicon wafer by two bars lying in a common axis, so that, upon flexing or torsioning of the bars, the silicon mass is movable or rotatable about the axis of the bars. The sensor element is connected with an upper and/or a lower cover. On at least one of the covers, adjacent the silicon mass, at least two electrodes are placed. The silicon mass and the two electrodes form a pair of capacitances, and the movement or excursion of the silicon mass is detected by evaluation of the difference between the capacitances.

摘要翻译： 用于测量倾斜或倾斜角度的传感器具有由单晶硅晶片制成的传感器元件，从该晶片上蚀刻至少一个可移动硅质量块。 硅质量块通过完全穿透硅晶片的蚀刻槽与周围的晶片脱离，并且通过位于公共轴线上的两个棒连接到硅晶片，使得在棒的弯曲或扭转时，硅质量块 可以围绕杆的轴线移动或旋转。 传感器元件与上盖和/或下盖连接。 在与硅质块相邻的盖中的至少一个上放置至少两个电极。 硅质量和两个电极形成一对电容，并且通过评估电容之间的差异来检测硅质量的移动或偏移。

公开(公告)号：US09995762B2

公开(公告)日：2018-06-12

申请号：US15129963

申请日：2015-03-25

申请人： Hitachi Automotive Systems, Ltd.

发明人： Masahide Hayashi ,  Heewon Jeong

IPC分类号： G01P15/125 ,  G01P15/08

CPC分类号： G01P15/125 ,  G01P2015/0834

摘要： Provided is a highly reliable acceleration sensor that keeps production costs low and has low zero point drift initially and over time even when used in a poor installation environment. In this acceleration sensor, a weight that rotates when acceleration is applied in the z-direction is disposed in a cavity surrounded by a support substrate and a cap layer. The cap layer is formed such that both sides thereof across the axis of rotation of the weight have different masses per unit area.