摘要:
The embodiment of the present application relates to the field of Li-ion battery and, in particular, to a secondary battery. The secondary battery includes a cell, a safety component fixed on the cell and thermal conductive adhesive provided between the cell and the safety component, the thermal conductive adhesive contains at least one of hot melt adhesive, silica gel binder or epoxy resin binder, and thermal conductive filling material. The thermal conductive adhesive in the secondary battery performs good thermal conductivity and adhering property, which can stably adhere the safety component with the cell, meanwhile transferring, via the thermal conductive adhesive, heat of the cell to the safety component rapidly, so that the safety component cuts off the circuit to protect the cell during overcharge, thereby avoid situations that the thermal conductive adhesive is separated from the cell due to cell inflation and deformation.
摘要:
An anchoring adhesive includes effective amounts of an isocyanurate compound and a vinyl ester compound that react and cure to form a composition having high compressive strength, high tensile strength and low shrinkage. The anchoring adhesive can be used to firmly bond anchor pins to boreholes in concrete, steel, wood, and other substrates.
摘要:
New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.
摘要:
A liquid resin, which is the Michael addition product of an amine-terminated aminoamide thermoplastic polymer with one or more polyol ester compounds having at least one (meth)acrylate group, wherein the amine-terminated aminoamide thermoplastic polymer contains a bisphenol or novolac segment to provide increased hardness and improved flow of radiation-curable compositions incorporating such resins, methods of printing using such compositions and articles printed with such compositions.
摘要:
The use of a polyester-amide in a hot melt adhesive formulation, wherein the polyester-amide includes a short aliphatic dicarboxylic acid functionality and a short symmetrical, crystallizing amid diol functionality.
摘要:
A polyesteramide copolymer having a glass transition temperature (Tg) of less than or equal to 0° C., contains at least one hard segment containing at least one amide bond, and at least one soft segment containing at least one ester bond. The soft segment is formed from at least one dimer fatty acid and/or dimer fatty diol and/or equivalent thereof. The copolymer is particularly suitable for use as a hot melt adhesive on low energy surfaces.
摘要:
Disclosed is a water-dissipatable or dispersible adhesive composition that is useful in forming paper articles and other products that can be recycled through repulping in both neutral and alkaline media. The water-dispersible adhesive composition is preferably a hot melt adhesive that is a low molecular weight, branched copolyester containing a sulfomonomer. Additional utility for the invention resides in the manufacture of recyclable articles where insolubility in body fluids combined with solubility in tap water are required.
摘要:
Crystallizable hot melt adhesive compositions comprising block copolyesteramides and alkali metal carboxylates. The block copolyesteramides comprise hard or crystalline polyester blocks and soft or amorphous polyamide blocks in the weight ratio of 2:3 to 4:1. The alkali metal carboxylates provide a concentration of alkali metal cation in the range of 0.1 to 6 meq per 100 parts by weight of copolyesteramide. The hot melt adhesive compositions are useful for bonding plastic parts to form plastic structures which are relatively free of bond line distortion.
摘要:
Thermoplastic esteramide heterophase copolymer resin including saturated copolyester soft segments chemically joined to copolyamide hard segments, in proportions and copolymerized to an extent to give a melt viscosity, extended tack after melt application and room temperature hardness for use as a hot melt adhesive in the manufacture of shoes.
摘要:
An anchoring adhesive includes effective amounts of an isocyanurate compound and a vinyl ester compound that react and cure to form a composition having high compressive strength, high tensile strength and low shrinkage. The anchoring adhesive can be used to firmly bond anchor pins to boreholes in concrete, steel, wood, and other substrates.