公开(公告)号：US11289442B2

公开(公告)日：2022-03-29

申请号：US16869694

申请日：2020-05-08

申请人： Tanaka Denshi Kogyo K.K.

发明人： Yuki Antoku ,  Shota Kawano ,  Yusuke Sakita

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

摘要： A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.

公开(公告)号：US09972595B2

公开(公告)日：2018-05-15

申请号：US14142152

申请日：2013-12-27

申请人： TANAKA DENSHI KOGYO K.K.

发明人： Yuki Antoku ,  Kazuhiko Yasuhara ,  Jun Chiba ,  Wei Chen ,  Junichi Okazaki ,  Nanako Maeda

IPC分类号： H01L23/00

CPC分类号： H01L24/45 ,  H01L24/05 ,  H01L24/43 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2924/00011 ,  Y10T428/2958 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01204 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01044 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01012 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01004 ,  H01L2924/01083 ,  H01L2924/01034 ,  H01L2924/01058 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2924/01022 ,  H01L2924/01052 ,  H01L2224/45644 ,  H01L2924/00015 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/01048

摘要： A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.

公开(公告)号：US09362249B2

公开(公告)日：2016-06-07

申请号：US14619736

申请日：2015-02-11

申请人： TANAKA DENSHI KOGYO K.K.

发明人： Kazuhiko Yasuhara ,  Nanako Maeda ,  Junichi Okazaki ,  Jun Chiba ,  Wei Chen ,  Yuki Antoku

IPC分类号： H01L23/00

CPC分类号： H01L24/45 ,  H01L24/43 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/456 ,  H01L2224/48247 ,  H01L2224/78601 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/01079 ,  H01L2924/01204 ,  H01L2924/01008 ,  H01L2924/00015 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2924/20105 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01004

摘要： The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.

摘要翻译： 本发明的银 - 金合金接合线包括由金（Au）的10％以上且30％以下且不低于30ppm且不高于90ppm的钙（Ca）组成的合金， 相对于除元素Au和Ca之外的金属元素的银（Ag）的剩余部分为99.99％以上，以质量％计; 在合金表面上形成有作为表面层的氧（O）和钙（Ca）的富集层; 以及形成在表面层正下方的金富集层。

公开(公告)号：US07857189B2

公开(公告)日：2010-12-28

申请号：US11917233

申请日：2006-06-08

申请人： Kazunari Maki ,  Yuji Nakata

发明人： Kazunari Maki ,  Yuji Nakata

IPC分类号： B23K35/14 ,  C22C5/02

CPC分类号： B23K35/3013 ,  C22C5/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/01004 ,  H01L2924/01202 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/01006

摘要： There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

摘要翻译： 提供了具有高初始粘合能力，高粘合可靠性，高压缩球圆度，高直线性和高树脂流动性的接合线用金合金丝。 用于接合线的金合金线包括总共1000至小于5000ppm的一种或两种Pt和Pd，Ir：1至200ppm，Ca：20至100ppm，Eu：10至100ppm，Be 如果需要，为0.1〜20ppm，如果需要，La为10〜100ppm。 Ca，Eu，Be和La中的至少两种的总量在50〜250ppm的范围内。

公开(公告)号：US20100226816A1

公开(公告)日：2010-09-09

申请号：US12224212

申请日：2008-06-23

申请人： Mitsuo Takada ,  Satoshi Teshima ,  Takeshi Kuwahara

发明人： Mitsuo Takada ,  Satoshi Teshima ,  Takeshi Kuwahara

IPC分类号： C22C5/02

CPC分类号： H01L24/85 ,  B23K35/3013 ,  B23K2101/36 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20106 ,  H01L2924/20752 ,  Y10T428/12 ,  H01L2924/01012 ,  H01L2924/01063 ,  H01L2924/0105 ,  H01L2924/0102 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2924/01048 ,  H01L2924/00013 ,  H01L2924/01049 ,  H01L2924/01006

摘要： There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).

摘要翻译： 提供了一种用于球接的金合金线。 金合金由10〜50质量ppm的镁（Mg）构成。 5〜20质量ppm的铕（Eu）; 2〜9质量ppm的钙（Ca）; 剩余部分为纯度为99.998质量％以下的金（Au）。 在用于球接合的金合金丝中，钙（Ca）的添加量最多为铕（Eu）的一半。

公开(公告)号：US07678999B2

公开(公告)日：2010-03-16

申请号：US11917241

申请日：2006-06-08

申请人： Kazunari Maki ,  Yuji Nakata

发明人： Kazunari Maki ,  Yuji Nakata

IPC分类号： H01B5/00

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01B1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05144 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/01004 ,  H01L2924/01026 ,  H01L2924/01039 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/01006

摘要： A gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to 2% by mass in total, Ir: 1 to 200 ppm, Ca: 20 to 200 ppm, Eu: 10 to 200 ppm, Be: 0.1 to 30 ppm, if necessary, and La: 10 to 200 ppm, if necessary. At least two kinds of Ca, Eu, Be, and La are in a range of 50 to 250 ppm in total.

摘要翻译： 用于接合线的金合金线包含总共为5000ppm至2质量％的Ir或1ppm至200ppm，Ca：20至200ppm，Eu：10至200ppm的Pt或Pd的一种或两种， 如果需要，为0.1〜30ppm，如果需要，La为10〜200ppm。 Ca，Eu，Be和La中的至少两种总共在50〜250ppm的范围内。

公开(公告)号：US11456271B2

公开(公告)日：2022-09-27

申请号：US16969357

申请日：2018-04-19

申请人： TANAKA DENSHI KOGYO K.K.

发明人： Jun Chiba ,  Yuki Antoku ,  Shota Kawano

IPC分类号： H01L23/00

摘要： A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.

公开(公告)号：US11251153B2

公开(公告)日：2022-02-15

申请号：US16975218

申请日：2018-04-19

申请人： TANAKA DENSHI KOGYO K.K.

发明人： Jun Chiba ,  Yuki Antoku ,  Shota Kawano

IPC分类号： H01L23/00 ,  H01L23/495

摘要： A noble metal-coated silver bonding wire for ball bonding wire includes a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes at least one palladium layer, the total palladium content relative to the entire wire is not less than 0.01 mass % and not more than 5.0 mass %, and the total sulfur group element content relative to the entire wire is not less than 0.1 mass ppm and not more than 100 mass ppm.

公开(公告)号：US20130164559A1

公开(公告)日：2013-06-27

申请号：US13392754

申请日：2010-09-09

申请人： Michitaka Mikami ,  Teruo Kikuchi ,  Shinichiro Nakashima ,  Yuichi Hirata ,  Masaharu Nakamura ,  Keisuke Kimura

发明人： Michitaka Mikami ,  Teruo Kikuchi ,  Shinichiro Nakashima ,  Yuichi Hirata ,  Masaharu Nakamura ,  Keisuke Kimura

IPC分类号： C22C21/00

CPC分类号： H01L24/45 ,  H01L24/43 ,  H01L2224/43847 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T428/12993 ,  H01L2924/01202 ,  H01L2924/01028 ,  H01L2924/01014 ,  H01L2924/01003 ,  H01L2924/01004 ,  H01L2924/01039 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/12 ,  H01L2924/14 ,  H01L2924/00013 ,  H01L2924/206

摘要： [Problem to be Solved]The invention providesa bonding ribbon which can guarantee a uniform fusing over the entire joint area throughout hundreds of thousands of continuous ultrasonic bonding cycles and which can realize an improved bonding strength and which also can avoid being broken while it is looped.[Solution]The aluminum ribbon for ultrasonic bonding is formed of an aluminum alloy with aluminum content of 99 mass % or higher, and this ribbon is characterized in that it is in a shape of an extremely thin tape which is obtained by rolling a wire taken from a multi-stage wire drawing, that an average grain size within the cross section of this ribbon is 5-200 micrometers (μm), that the surface(s) of this extremely thin tape is mirror-finished to an extent that the surface roughness Rz is 2 micrometers (μm) or smaller, and that the ribbon has been subjected to an immersion treatment or a gas-exposure treatment wherein the liquid or gas comprises a substance having a vapor pressure higher than water such as a water-soluble hydrocarbons solvent, an alcoholic solvent, a ketone solvent, or an ether type solvent.

摘要翻译： [待解决的问题]本发明提供了一种粘结带，其能够在数十万次连续超声波接合循环中保证在整个接合区域上的均匀熔合，并且可以实现改进的接合强度，并且还可以避免在环路时破坏 。 [解决方案]超声波接合用铝带由铝含量为99质量％以上的铝合金形成，该带的特征在于，其是通过卷绕所获得的线而获得的极薄的带状 从多级拉丝中，该带的横截面内的平均晶粒尺寸为5-200微米（mum），这种非常薄的带的表面被镜面加工到表面 粗糙度Rz为2微米（小时）以下，并且已对带进行了浸渍处理或气体暴露处理，其中液体或气体包括蒸汽压高于水的物质，例如水溶性烃 溶剂，醇溶剂，酮溶剂或醚类溶剂。

公开(公告)号：US08440137B2

公开(公告)日：2013-05-14

申请号：US11791329

申请日：2005-11-22

申请人： Satoshi Teshima ,  Michitaka Mikami

发明人： Satoshi Teshima ,  Michitaka Mikami

IPC分类号： C22C5/02 ,  H01L21/60

CPC分类号： C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4845 ,  H01L2224/48624 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01205 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  Y10T428/12431 ,  H01L2924/01004 ,  H01L2924/01204 ,  H01L2924/01039 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/013 ,  H01L2924/01062 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2924/01006

摘要： An Au bonding wire for semiconductor device, comprising a wire-shaped Au alloy material consisting of: 3-15 mass ppm of Be, 3-40 mass ppm of Ca, 3-20 mass ppm of La, 3-20 mass ppm of at least one functional element selected from the group of Ce, Eu, Mg, and Si, and the remainder of Au, wherein the diameter of said Au alloy bonding wire is less than 23 microns, wherein said bonding wire has improved roundness of compressed bonded ball and improved fracture stress.

摘要翻译： 一种用于半导体器件的Au接合线，包括线状Au合金材料，其由以下组成：3-15质量ppm的Be，3-40质量ppm的Ca，3-20质量ppm的La，3-20质量ppm的 选自Ce，Eu，Mg和Si中的至少一种功能元素，余量为Au，其中所述Au合金接合线的直径小于23微米，其中所述接合线具有改善的压缩粘结球的圆度 并提高骨折应力。