公开(公告)号：US09972595B2

公开(公告)日：2018-05-15

申请号：US14142152

申请日：2013-12-27

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Yuki Antoku ,  Kazuhiko Yasuhara ,  Jun Chiba ,  Wei Chen ,  Junichi Okazaki ,  Nanako Maeda

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/05 ,  H01L24/43 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2924/00011 ,  Y10T428/2958 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01204 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01044 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01012 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01004 ,  H01L2924/01083 ,  H01L2924/01034 ,  H01L2924/01058 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2924/01022 ,  H01L2924/01052 ,  H01L2224/45644 ,  H01L2924/00015 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/01048

Abstract: A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.

公开(公告)号：US09362249B2

公开(公告)日：2016-06-07

申请号：US14619736

申请日：2015-02-11

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Kazuhiko Yasuhara ,  Nanako Maeda ,  Junichi Okazaki ,  Jun Chiba ,  Wei Chen ,  Yuki Antoku

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/43 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/456 ,  H01L2224/48247 ,  H01L2224/78601 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/01079 ,  H01L2924/01204 ,  H01L2924/01008 ,  H01L2924/00015 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2924/20105 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01004

Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.

Abstract translation: 本发明的银 - 金合金接合线包括由金（Au）的10％以上且30％以下且不低于30ppm且不高于90ppm的钙（Ca）组成的合金， 相对于除元素Au和Ca之外的金属元素的银（Ag）的剩余部分为99.99％以上，以质量％计; 在合金表面上形成有作为表面层的氧（O）和钙（Ca）的富集层; 以及形成在表面层正下方的金富集层。