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公开(公告)号：US11289442B2
公开(公告)日：2022-03-29
申请号：US16869694
申请日：2020-05-08
发明人： Yuki Antoku , Shota Kawano , Yusuke Sakita
IPC分类号： H01L23/00 , H01L23/495 , H01L23/31 , H01L25/065 , H01L25/00
摘要： A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.
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公开(公告)号：US09972595B2
公开(公告)日：2018-05-15
申请号：US14142152
申请日：2013-12-27
发明人： Yuki Antoku , Kazuhiko Yasuhara , Jun Chiba , Wei Chen , Junichi Okazaki , Nanako Maeda
IPC分类号： H01L23/00
CPC分类号： H01L24/45 , H01L24/05 , H01L24/43 , H01L24/48 , H01L2223/6611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45565 , H01L2224/45639 , H01L2224/48511 , H01L2224/48624 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2924/00011 , Y10T428/2958 , H01L2924/01046 , H01L2924/01078 , H01L2924/01204 , H01L2924/01045 , H01L2924/01077 , H01L2924/01044 , H01L2924/01029 , H01L2924/01028 , H01L2924/01026 , H01L2924/01012 , H01L2924/0103 , H01L2924/01013 , H01L2924/01049 , H01L2924/01014 , H01L2924/01032 , H01L2924/01004 , H01L2924/01083 , H01L2924/01034 , H01L2924/01058 , H01L2924/01039 , H01L2924/01057 , H01L2924/0102 , H01L2924/01063 , H01L2924/01203 , H01L2924/00 , H01L2924/013 , H01L2924/00014 , H01L2924/01025 , H01L2924/00013 , H01L2924/01079 , H01L2924/0105 , H01L2924/01022 , H01L2924/01052 , H01L2224/45644 , H01L2924/00015 , H01L2224/45664 , H01L2224/45669 , H01L2924/01048
摘要： A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.
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公开(公告)号：US09362249B2
公开(公告)日：2016-06-07
申请号：US14619736
申请日：2015-02-11
发明人： Kazuhiko Yasuhara , Nanako Maeda , Junichi Okazaki , Jun Chiba , Wei Chen , Yuki Antoku
IPC分类号： H01L23/00
CPC分类号： H01L24/45 , H01L24/43 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/456 , H01L2224/48247 , H01L2224/78601 , H01L2224/85045 , H01L2224/85203 , H01L2224/85207 , H01L2224/85439 , H01L2924/00011 , H01L2924/01006 , H01L2924/0102 , H01L2924/013 , H01L2924/12041 , H01L2924/181 , H01L2924/2064 , H01L2924/01079 , H01L2924/01204 , H01L2924/01008 , H01L2924/00015 , H01L2924/20752 , H01L2924/00012 , H01L2924/20753 , H01L2924/00014 , H01L2924/20105 , H01L2924/00 , H01L2924/01049 , H01L2924/01004
摘要： The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.
摘要翻译： 本发明的银 - 金合金接合线包括由金（Au）的10％以上且30％以下且不低于30ppm且不高于90ppm的钙（Ca）组成的合金， 相对于除元素Au和Ca之外的金属元素的银（Ag）的剩余部分为99.99％以上，以质量％计; 在合金表面上形成有作为表面层的氧（O）和钙（Ca）的富集层; 以及形成在表面层正下方的金富集层。
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公开(公告)号：US20160093586A1
公开(公告)日：2016-03-31
申请号：US14619736
申请日：2015-02-11
发明人： Kazuhiko YASUHARA , Nanako MAEDA , Junichi OKAZAKI , Jun CHIBA , Wei CHEN , Yuki ANTOKU
IPC分类号： H01L23/00
CPC分类号： H01L24/45 , H01L24/43 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/43 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/456 , H01L2224/48247 , H01L2224/78601 , H01L2224/85045 , H01L2224/85203 , H01L2224/85207 , H01L2224/85439 , H01L2924/00011 , H01L2924/01006 , H01L2924/0102 , H01L2924/013 , H01L2924/12041 , H01L2924/181 , H01L2924/2064 , H01L2924/01079 , H01L2924/01204 , H01L2924/01008 , H01L2924/00015 , H01L2924/20752 , H01L2924/00012 , H01L2924/20753 , H01L2924/00014 , H01L2924/20105 , H01L2924/00 , H01L2924/01049 , H01L2924/01004
摘要： The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.
摘要翻译： 本发明的银 - 金合金接合线包括由金（Au）的10％以上且30％以下且不低于30ppm且不高于90ppm的钙（Ca）组成的合金， 相对于除元素Au和Ca之外的金属元素的银（Ag）的剩余部分为99.99％以上，以质量％计; 在合金表面上形成有作为表面层的氧（O）和钙（Ca）的富集层; 以及形成在表面层正下方的金富集层。
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公开(公告)号：US11456271B2
公开(公告)日：2022-09-27
申请号：US16969357
申请日：2018-04-19
发明人： Jun Chiba , Yuki Antoku , Shota Kawano
IPC分类号： H01L23/00
摘要： A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.
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公开(公告)号：US11251153B2
公开(公告)日：2022-02-15
申请号：US16975218
申请日：2018-04-19
发明人： Jun Chiba , Yuki Antoku , Shota Kawano
IPC分类号： H01L23/00 , H01L23/495
摘要： A noble metal-coated silver bonding wire for ball bonding wire includes a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes at least one palladium layer, the total palladium content relative to the entire wire is not less than 0.01 mass % and not more than 5.0 mass %, and the total sulfur group element content relative to the entire wire is not less than 0.1 mass ppm and not more than 100 mass ppm.
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公开(公告)号：US20170057020A1
公开(公告)日：2017-03-02
申请号：US15248196
申请日：2016-08-26
发明人： Hiroyuki AMANO , Somei YARITA , Yusuke SAKITA , Yuki ANTOKU , Wei CHEN
IPC分类号： B23K35/02 , C22C9/00 , C22C5/04 , C22C5/02 , B23K35/30 , B21C1/02 , C22F1/14 , C25D3/50 , C23C14/16 , C23C14/35 , C23C26/00 , B32B15/01 , C22C9/06 , C22F1/08
CPC分类号： B23K35/0227 , B21C1/02 , B23K35/302 , B32B15/018 , C22C5/02 , C22C5/04 , C22C9/00 , C22C9/06 , C22F1/08 , C22F1/14 , C23C14/165 , C23C14/35 , C23C26/00 , C25D3/50 , H01L2224/05624 , H01L2224/45 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2924/00011 , H01L2924/10253 , H01L2924/01201 , H01L2924/00012 , H01L2924/01016 , H01L2924/01005 , H01L2924/01015 , H01L2924/01006 , H01L2924/20751 , H01L2924/20752 , H01L2924/01004 , H01L2924/013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01028 , H01L2924/01078 , H01L2924/01203 , H01L2924/01206
摘要： A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 μm, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.
摘要翻译： 用于球接的钯包铜线包括由纯度为98质量％以上的纯铜或铜合金形成的芯和涂覆在芯上的钯吸附涂层。 铜线的直径为10〜25μm，钯拉伸层含有硫，磷，硼或碳。
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8.发明申请公开(公告)号：US20200350273A1
公开(公告)日：2020-11-05
申请号：US16869694
申请日：2020-05-08
发明人： Yuki ANTOKU , Shota KAWANO , Yusuke SAKITA
IPC分类号： H01L23/00 , H01L23/495 , H01L23/31 , H01L25/065 , H01L25/00
摘要： A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.
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公开(公告)号：US20240105667A1
公开(公告)日：2024-03-28
申请号：US18263000
申请日：2022-01-25
CPC分类号： H01L24/45 , C22C21/00 , C22F1/002 , C22F1/04 , H01L24/05 , H01L24/48 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/85 , H01L2224/05073 , H01L2224/05124 , H01L2224/05138 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/05663 , H01L2224/05666 , H01L2224/05684 , H01L2224/06181 , H01L2224/29139 , H01L2224/32225 , H01L2224/32245 , H01L2224/45105 , H01L2224/45124 , H01L2224/45138 , H01L2224/4516 , H01L2224/45172 , H01L2224/4801 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48245 , H01L2224/73265 , H01L2224/85205 , H01L2924/01005 , H01L2924/01014 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/13055 , H01L2924/13091
摘要： An aluminum wire with which, at the time of bonding a bonding wire for a power semiconductor, the wire is not detached from a wedge tool, and a long life is achieved in a power cycle test. The aluminum wire is made of an aluminum alloy having an aluminum purity of 99 mass % or more and contains, relative to a total amount of all elements of the aluminum alloy, a total of 0.01 mass % or more and 1 mass % or less of iron and silicon. In a lateral cross-section in a direction perpendicular to a wire axis of the aluminum wire, an orientation index of is 1 or more, an orientation index of is 1 or less, and an area ratio of precipitated particles is in a range of 0.02% or more to 2% or less.
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公开(公告)号：US10195697B2
公开(公告)日：2019-02-05
申请号：US15248196
申请日：2016-08-26
发明人： Hiroyuki Amano , Somei Yarita , Yusuke Sakita , Yuki Antoku , Wei Chen
IPC分类号： B21C1/02 , B23K35/02 , C22C9/00 , C22C9/06 , B23K35/30 , B32B15/01 , C22C5/02 , C22C5/04 , C22F1/08 , C22F1/14 , C23C14/16 , C23C14/35 , C23C26/00 , C25D3/50
摘要： A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 μm, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.
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