公开(公告)号：US20160093586A1

公开(公告)日：2016-03-31

申请号：US14619736

申请日：2015-02-11

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Kazuhiko YASUHARA ,  Nanako MAEDA ,  Junichi OKAZAKI ,  Jun CHIBA ,  Wei CHEN ,  Yuki ANTOKU

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/43 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/456 ,  H01L2224/48247 ,  H01L2224/78601 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/01079 ,  H01L2924/01204 ,  H01L2924/01008 ,  H01L2924/00015 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2924/20105 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01004

Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.

Abstract translation: 本发明的银 - 金合金接合线包括由金（Au）的10％以上且30％以下且不低于30ppm且不高于90ppm的钙（Ca）组成的合金， 相对于除元素Au和Ca之外的金属元素的银（Ag）的剩余部分为99.99％以上，以质量％计; 在合金表面上形成有作为表面层的氧（O）和钙（Ca）的富集层; 以及形成在表面层正下方的金富集层。

公开(公告)号：US20140302317A1

公开(公告)日：2014-10-09

申请号：US14142152

申请日：2013-12-27

Applicant: TANAKA DENSHI KOGYO K.K.

Inventor： Yuki ANTOKU ,  Kazuhiko YASUHARA ,  Jun CHIBA ,  Wei CHEN ,  Junichi OKAZAKI ,  Nanako MAEDA

IPC: H01L23/00

CPC classification number: H01L24/45 ,  H01L24/05 ,  H01L24/43 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2924/00011 ,  Y10T428/2958 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01204 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01044 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01012 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01004 ,  H01L2924/01083 ,  H01L2924/01034 ,  H01L2924/01058 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2924/01022 ,  H01L2924/01052 ,  H01L2224/45644 ,  H01L2924/00015 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/01048

Abstract: An object is to provide a bonding wire for a high-speed signal line, formed by an Ag—Pd—Pt three-element alloy or an Ag—Pd—Pt ternary alloy, that is able to transmit a stable super-high frequency signal in a several GHz band, and that does not have a strong silver sulfide (Ag2S) film even when an unstable silver sulfide layer is formed on the surface of the bonding wire. Provided is the bonding wire for the high-speed signal line formed by a three-element alloy containing 0.8 to 2.5 mass % of palladium (Pd), 0.1 to 0.7 mass % of platinum (Pt), and a balance being silver (Ag) with purity of 99.99 mass % or more, or a ternary alloy obtained by adding a trace element to the three-element alloy, in which cross section of the bonding wire is formed by a skin film and a core, and in which a surface segregation layer containing highly-concentrated silver (Ag) is present in the skin film of the silver alloy.

Abstract translation: 目的是提供一种由Ag-Pd-Pt三元素合金或Ag-Pd-Pt三元合金形成的用于高速信号线的接合线，其能够传输稳定的超高频信号 即使在接合线的表面上形成不稳定的硫化银层，也不具有强硫化银（Ag 2 S）膜。 提供了由含有钯（Pd）0.8〜2.5质量％，铂（Pt）0.1〜0.7质量％，余量为银（Ag））的三元素合金形成的高速信号线用接合线， 纯度为99.99质量％以上的三元合金，或通过在三元素合金中添加微量元素而获得的三元合金，其中，接合线的截面通过皮膜和芯形成，并且其中表面偏析 含有高浓度银（Ag）的层存在于银合金的皮膜中。