公开(公告)号：US20110189835A1

公开(公告)日：2011-08-04

申请号：US13017218

申请日：2011-01-31

申请人： Yuki Sugo ,  Shumpei Tanaka ,  Takeshi Matsumura ,  Yasushi Inoue

发明人： Yuki Sugo ,  Shumpei Tanaka ,  Takeshi Matsumura ,  Yasushi Inoue

IPC分类号： H01L21/78 ,  B32B7/12

CPC分类号： B32B7/12 ,  H01L21/6836 ,  H01L21/78 ,  Y10T428/263 ,  Y10T428/2809

摘要： There is provided a new film for manufacturing a semiconductor device that is superior to prevent contamination of a semiconductor chip having an excellent balance of holding power during dicing a semiconductor wafer even where the semiconductor wafer is thin, peeling property when peeling the semiconductor chip that is obtained by dicing together with its adhesive layer, and low contamination property in which there is no attachment of cutting debris to the semiconductor chip. A film for manufacturing a semiconductor device that is used when manufacturing a semiconductor device has a base layer, a first pressure-sensitive adhesive layer that is provided on the base layer, a radiation curing-type second pressure-sensitive adhesive layer that is provided on the first pressure-sensitive adhesive layer and cured by radiation irradiation in advance, and an adhesive layer that is provided on the second pressure-sensitive adhesive layer.

摘要翻译： 提供了一种用于制造半导体器件的新膜，即使在半导体晶片较薄时也能够防止在半导体晶片切割期间具有优异的保持平衡的半导体芯片的污染，并且剥离半导体芯片时的剥离性 通过与其粘合剂层一起切割获得的低污染特性，其中没有将切屑附着到半导体芯片。 制造半导体器件时使用的半导体器件用薄膜，具有基底层，设置在基底层上的第一粘合剂层，设置在基底层上的辐射固化型第二压敏粘合剂层 预先通过辐射照射固化的第一粘合剂层和设置在第二压敏粘合剂层上的粘合剂层。

公开(公告)号：US20100029059A1

公开(公告)日：2010-02-04

申请号：US12533262

申请日：2009-07-31

申请人： Takeshi Matsumura ,  Katsuhiko Kamiya ,  Shuuhei Murata ,  Yuki Sugo

发明人： Takeshi Matsumura ,  Katsuhiko Kamiya ,  Shuuhei Murata ,  Yuki Sugo

IPC分类号： H01L21/78 ,  B32B27/38 ,  B32B27/30 ,  B32B38/00

CPC分类号： H01L21/6836 ,  C08F220/18 ,  C08F2220/1808 ,  C08F2220/1833 ,  C08F2220/281 ,  C09J7/22 ,  C09J7/30 ,  C09J133/08 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention is a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on an ultraviolet-ray transmitting base and a die-bonding film provided on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is formed by laminating the die-bonding film onto a pressure-sensitive adhesive layer precursor formed from an acrylic polymer comprising an acrylic ester as a main monomer, a hydroxyl group-containing monomer at a ratio in the range of 10 to 40 mol % with respect to 100 mol % of the acrylic ester, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecular at a ratio in the range of 70 to 90 mol % with respect to 100 mol % of the hydroxyl group-containing monomer, and then curing by irradiating with an ultraviolet ray from the base side, and the die-bonding film is formed from an epoxy resin.

摘要翻译： 本发明是一种切割片接合膜，其具有在紫外线透射基底上具有压敏粘合剂层的切割膜和设置在压敏粘合剂层上的芯片接合膜，其中压敏粘合剂层 通过将芯片接合膜层压在由丙烯酸酯作为主要单体的丙烯酸类聚合物形成的压敏粘合剂层前体上，以10〜40摩尔％的比例含有羟基的单体与 相对于100摩尔％的丙烯酸酯，以及分子内具有自由基反应性碳 - 碳双键的异氰酸酯化合物的比例相对于100摩尔％的含羟基的比例为70〜90摩尔％ 单体，然后通过从基底侧照射紫外线而固化，并且芯片接合膜由环氧树脂形成。

公开(公告)号：US20100055842A1

公开(公告)日：2010-03-04

申请号：US12549739

申请日：2009-08-28

申请人： Yuki Sugo ,  Sedahito Misumi ,  Takeshi Matsumura

发明人： Yuki Sugo ,  Sedahito Misumi ,  Takeshi Matsumura

IPC分类号： H01L21/60 ,  C08L63/00 ,  B32B27/38

CPC分类号： H01L21/6836 ,  C08G59/621 ,  C08L33/06 ,  C08L2666/04 ,  C09J163/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29084 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

摘要翻译： 本发明的热固性芯片接合薄膜用于制造半导体器件，至少具有环氧树脂，酚醛树脂和丙烯酸共聚物，当X表示总重量时，X / Y的比率为0.7〜5 的环氧树脂和酚醛树脂，Y表示丙烯酸共聚物的重量。

公开(公告)号：US08143106B2

公开(公告)日：2012-03-27

申请号：US12549739

申请日：2009-08-28

申请人： Yuki Sugo ,  Sadahito Misumi ,  Takeshi Matsumura

发明人： Yuki Sugo ,  Sadahito Misumi ,  Takeshi Matsumura

IPC分类号： H01L21/44

CPC分类号： H01L21/6836 ,  C08G59/621 ,  C08L33/06 ,  C08L2666/04 ,  C09J163/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29084 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

摘要翻译： 本发明的热固性芯片接合薄膜用于制造半导体器件，至少具有环氧树脂，酚醛树脂和丙烯酸共聚物，当X表示总重量时，X / Y的比率为0.7〜5 的环氧树脂和酚醛树脂，Y表示丙烯酸共聚物的重量。

公开(公告)号：US08580617B2

公开(公告)日：2013-11-12

申请号：US13365071

申请日：2012-02-02

申请人： Yuki Sugo ,  Sadahito Misumi ,  Takeshi Matsumura

发明人： Yuki Sugo ,  Sadahito Misumi ,  Takeshi Matsumura

IPC分类号： B32B27/38 ,  B32B37/00 ,  C08L63/00

CPC分类号： H01L21/6836 ,  C08G59/621 ,  C08L33/06 ,  C08L2666/04 ,  C09J163/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29084 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/3025 ,  Y10T428/31511 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

摘要翻译： 本发明的热固性芯片接合薄膜用于制造半导体器件，至少具有环氧树脂，酚醛树脂和丙烯酸共聚物，当X表示总重量时，X / Y的比率为0.7〜5 的环氧树脂和酚醛树脂，Y表示丙烯酸共聚物的重量。

公开(公告)号：US20110120614A1

公开(公告)日：2011-05-26

申请号：US12948992

申请日：2010-11-18

申请人： Yuki Sugo ,  Kouichi Inoue ,  Kenji Oonishi

发明人： Yuki Sugo ,  Kouichi Inoue ,  Kenji Oonishi

IPC分类号： H01L21/50 ,  B32B5/00 ,  B32B3/00 ,  C09J7/00 ,  C09J7/02

CPC分类号： C08G59/621 ,  C08L33/00 ,  C08L33/08 ,  C08L61/04 ,  C08L63/00 ,  C08L63/08 ,  C08L71/00 ,  C08L2205/03 ,  C08L2666/02 ,  C09J7/10 ,  C09J133/08 ,  C09J161/06 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/29023 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/85097 ,  H01L2224/85205 ,  H01L2224/9205 ,  H01L2224/92165 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/265 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/85399

摘要： The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 μm.

摘要翻译： 本发明提供一种热固性粘合剂膜，其能够通过防止由于在具有未充分填充填料的构造的膜的芯片接合期间的压力导致的半导体芯片的损坏而提高封装可靠性，防止了拉伸储能模量的降低 并且防止由于热固化期间的热收缩而产生翘曲。 作为制造半导体装置时使用的热固性粘合膜，该膜在2×105〜5×107Pa的热固化后的拉伸储能模量为260℃，填料的含量为0.1重量％ 或更低，基于整个热固性粘合剂膜，厚度为1至10μm。

公开(公告)号：US20100323151A1

公开(公告)日：2010-12-23

申请号：US12526126

申请日：2008-01-24

申请人： Yoshio Terada ,  Yuki Sugo ,  Toshiki Kouno

发明人： Yoshio Terada ,  Yuki Sugo ,  Toshiki Kouno

IPC分类号： B32B7/12

CPC分类号： C09J133/062 ,  C08K3/346 ,  C08K9/04 ,  C09J7/38 ,  C09J11/04 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2483/00 ,  G02F2202/28 ,  H01L21/6835 ,  Y10T428/24174

摘要： Disclosed is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a base material sheet, a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the pressure-sensitive adhesive composition, in which pieces of the layered clay mineral are arranged substantially perpendicular to the base material sheet.

摘要翻译： 公开了一种对于被粘物具有足够的压敏粘合强度的粘合带，耐热性优异，并且可以容易地剥离，而不会在剥离后特别是被粘物上留下压敏粘合剂残留物。 粘合带在基材片上包括分散在压敏粘合剂组合物中的压敏粘合剂组合物和亲油层状粘土矿物的粘合剂层，其中层状粘土矿物 基本上垂直于基材片布置。

公开(公告)号：US20100170533A1

公开(公告)日：2010-07-08

申请号：US12377052

申请日：2007-06-26

申请人： Yoshio Terada ,  Yuki Sugo ,  Yoshinori Yoshida ,  Youhei Maeno

发明人： Yoshio Terada ,  Yuki Sugo ,  Yoshinori Yoshida ,  Youhei Maeno

IPC分类号： B08B7/00 ,  A46B5/00

CPC分类号： B08B1/00 ,  B08B7/0028 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B2202/08 ,  C01B2202/34 ,  C01B2202/36

摘要： Provided is a cleaning member capable of removing minute foreign matter, in particular foreign matter of a submicron level simply, exactly, and sufficiently without contaminating a cleaning site. Further provided is a carrying member provided with a cleaning function having the cleaning member and a method of cleaning a substrate processing equipment with the use of the cleaning member or the carrying member provided with a cleaning function. The cleaning member includes a layer member having a plurality of protrusions of a columnar structure on a surface, in which each of the protrusions of a columnar structure has a carbon-based nanostructure.

摘要翻译： 本发明提供一种清洁部件，其能够简单，准确，充分地除去微小的异物，特别是亚微米级的异物，而不污染清洁部位。 还提供了具有清洁功能的承载构件，其具有清洁构件，以及使用具有清洁功能的清洁构件或承载构件来清洁衬底处理设备的方法。 清洁部件包括在表面上具有多个柱状结构的突起的层部件，其中柱状结构的每个突起具有碳基纳米结构。

公开(公告)号：US20100323191A1

公开(公告)日：2010-12-23

申请号：US12526142

申请日：2008-01-24

申请人： Yuki Sugo ,  Yoshio Terada ,  Hiroyuki Kondou ,  Hitoshi Takano

发明人： Yuki Sugo ,  Yoshio Terada ,  Hiroyuki Kondou ,  Hitoshi Takano

IPC分类号： B32B7/12 ,  B32B5/00

CPC分类号： H01L23/296 ,  C08K3/346 ,  C09J7/22 ,  C09J7/38 ,  C09J11/04 ,  C09J183/04 ,  C09J2203/326 ,  C09J2483/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/83855 ,  H01L2224/85001 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/15747 ,  H01L2924/20305 ,  H01L2924/20752 ,  Y10T428/26 ,  Y10T428/2857 ,  H01L2924/00014 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512

摘要： A pressure-sensitive adhesive tape, which has a pressure-sensitive adhesive layer with its storage modulus controlled within an adequate range, and which suitably prevents resin leakage during a sealing step in the production of a semiconductor device using a metal lead frame. The pressure-sensitive adhesive tape includes, on a base sheet, a pressure-sensitive adhesive layer containing a silicone-based pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the silicone-based pressure-sensitive adhesive composition.

摘要翻译： 将具有其储能模量的压敏粘合剂层控制在适当范围内的压敏粘合带，并且在使用金属引线框的半导体器件的制造中的密封步骤期间适当地防止树脂泄漏。 该压敏粘合带在基片上包括分散在硅氧烷类压敏粘合剂组合物中的含有硅氧烷类压敏粘合剂组合物和亲油层状粘土矿物的压敏粘合剂层。

公开(公告)号：US20100175716A1

公开(公告)日：2010-07-15

申请号：US12377063

申请日：2007-06-28

申请人： Yuki Sugo ,  Yoshio Terada ,  Daisuke Uenda ,  Makoto Namikawa ,  Yoshinori Yoshida ,  Youhei Maeno

发明人： Yuki Sugo ,  Yoshio Terada ,  Daisuke Uenda ,  Makoto Namikawa ,  Yoshinori Yoshida ,  Youhei Maeno

IPC分类号： B08B7/02 ,  A46D1/00

CPC分类号： H01L21/67046 ,  B08B1/00 ,  B08B7/0028 ,  C23C16/4407

摘要： Provided is a cleaning member, which is capable of removing minute foreign matter, preferably foreign matter of a submicron level simply, exactly, and sufficiently, without contaminating a cleaning site. Further provided is a delivery member with a cleaning function having the cleaning member and a method of cleaning a substrate processing apparatus using the delivery member with a cleaning function. The cleaning member of the present invention includes a cleaning layer having a plurality of protrusions of a columnar structure on the surface, in which an aspect ratio of the protrusions of a columnar structure is 5 or more.

摘要翻译： 本发明提供一种清洁部件，其能够简单，准确且充分地除去微小的异物，优选亚微米级的异物，而不会污染清洁部位。 还提供具有清洁功能的传送部件，其具有清洁部件，以及使用具有清洁功能的传送部件清洁基板处理设备的方法。 本发明的清洁部件具有在柱面结构的突起长宽比为5以上的表面上具有多个柱状结构的突起的清洗层。