公开(公告)号：US08252166B2

公开(公告)日：2012-08-28

申请号：US13243187

申请日：2011-09-23

Applicant: Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

Inventor： Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

IPC: C25D3/38 ,  C25D5/00

CPC classification number: H05K3/384 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C25D3/38 ,  C25D5/10 ,  C25D7/0614 ,  C25D7/0692 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12014 ,  Y10T428/12063 ,  Y10T428/12181 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993

Abstract: A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.

Abstract translation: 通过使用含有硫酸铜（Cu当量1〜50g / L），1〜150g / L的电镀液对轧制箔进行粗糙化处理，得到具有由细铜颗粒形成的粗糙面的轧制铜或铜合金箔， L的硫酸，以及一种或多种选自辛基硫酸钠，癸基硫酸钠和十二烷基硫酸钠的添加剂，其温度为20〜50℃，电流密度为10〜100A / dm 2。 箔具有减少的凹坑，这是具有粗糙表面的轧制箔特有的缺陷，具有高强度，与树脂层的粘合强度，耐酸性和抗锡电镀溶液性能，高剥离强度，良好的蚀刻性能和光泽度， 并且适合于制造能够承受精细布线图案的柔性印刷线路板。 还提供了粗糙化轧制箔的方法。

公开(公告)号：US08449987B2

公开(公告)日：2013-05-28

申请号：US12303899

申请日：2007-06-11

Applicant: Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

Inventor： Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

IPC: B22F1/02

CPC classification number: H05K3/384 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C25D3/38 ,  C25D5/10 ,  C25D7/0614 ,  C25D7/0692 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12014 ,  Y10T428/12063 ,  Y10T428/12181 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993

Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern. Additionally provided is a method of roughening the rolled copper or copper alloy foil.

Abstract translation: 本发明提供一种具有由细铜颗粒形成的粗糙表面的粗铜或铜合金箔，其通过用含有硫酸铜（Cu当量为1至50g / L）的电镀液对轧制的铜或铜合金箔进行粗糙化处理而获得， ，1〜150g / L硫酸，以及一种或多种选自辛基硫酸钠，癸基硫酸钠和十二烷基硫酸钠的添加剂，其温度为20〜50℃，电流密度为10〜 100A / dm2。 经粗糙化的轧制铜或铜合金箔在具有粗糙表面的轧制铜或铜合金箔特有的明显缺陷的凹坑中减少，具有高强度，与树脂层的粘合强度，耐酸性和抗锡镀层 溶液性能，高剥离强度，良好的蚀刻性能和光泽度，并且也适用于制造能够承载精细布线图案的柔性印刷线路板。 另外提供一种粗糙化轧制的铜或铜合金箔的方法。

公开(公告)号：US20090162685A1

公开(公告)日：2009-06-25

申请号：US12303899

申请日：2007-06-11

Applicant: Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

Inventor： Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

IPC: B32B15/02 ,  C22C9/00 ,  C25D7/00 ,  C25D5/00

CPC classification number: H05K3/384 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C25D3/38 ,  C25D5/10 ,  C25D7/0614 ,  C25D7/0692 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12014 ,  Y10T428/12063 ,  Y10T428/12181 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993

Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern. Additionally provided is a method of roughening the rolled copper or copper alloy foil.

Abstract translation: 本发明提供一种具有由细铜颗粒形成的粗糙表面的粗铜或铜合金箔，其通过用含有硫酸铜（Cu当量为1至50g / L）的镀浴对轧制的铜或铜合金箔进行粗糙化处理而获得， ，1〜150g / L硫酸，以及一种或多种选自辛基硫酸钠，癸基硫酸钠和十二烷基硫酸钠的添加剂，其温度为20〜50℃，电流密度为10〜 100A / dm2。 经粗糙化的轧制铜或铜合金箔在具有粗糙表面的轧制铜或铜合金箔特有的明显缺陷的凹坑中减少，具有高强度，与树脂层的粘合强度，耐酸性和抗锡镀层 溶液性能，高剥离强度，良好的蚀刻性能和光泽度，并且也适用于制造能够承载精细布线图案的柔性印刷线路板。 另外提供一种粗糙化轧制的铜或铜合金箔的方法。

公开(公告)号：US20120012463A1

公开(公告)日：2012-01-19

申请号：US13243187

申请日：2011-09-23

Applicant: Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

Inventor： Yousuke Kobayashi ,  Atsushi Miki ,  Keisuke Yamanishi

IPC: C25D15/00

CPC classification number: H05K3/384 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  C25D3/38 ,  C25D5/10 ,  C25D7/0614 ,  C25D7/0692 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12014 ,  Y10T428/12063 ,  Y10T428/12181 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12993

Abstract: A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.

Abstract translation: 通过使用含有硫酸铜（Cu当量1〜50g / L），1〜150g / L的电镀液对轧制箔进行粗糙化处理，得到具有由细铜颗粒形成的粗糙面的轧制铜或铜合金箔， L的硫酸，以及一种或多种选自辛基硫酸钠，癸基硫酸钠和十二烷基硫酸钠的添加剂，其温度为20〜50℃，电流密度为10〜100A / dm 2。 箔具有减少的凹坑，这是具有粗糙表面的轧制箔特有的缺陷，具有高强度，与树脂层的粘合强度，耐酸性和抗锡电镀溶液性能，高剥离强度，良好的蚀刻性能和光泽度， 并且适合于制造能够承受精细布线图案的柔性印刷线路板。 还提供了粗糙化轧制箔的方法。

公开(公告)号：US20130071652A1

公开(公告)日：2013-03-21

申请号：US13643626

申请日：2011-04-18

Applicant: Keisuke Yamanishi ,  Hideta Arai ,  Atsushi Miki

Inventor： Keisuke Yamanishi ,  Hideta Arai ,  Atsushi Miki

IPC: B32B15/08 ,  B32B5/00

CPC classification number: B32B15/08 ,  B32B5/00 ,  B32B15/20 ,  C22C9/00 ,  C25D5/02 ,  C25D7/0607 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/265 ,  Y10T428/31678

Abstract: A laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil that is cladded on an insulating resin substrate, characterized in that a ratio A=[(200)/{(111)+(200)+(220)+(311)}]×100, i.e. a ratio of an area intensity of a peak in the X-ray diffraction of the copper plating surface is more than 90. The present invention can provide the laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil cladded on an insulating resin substrate, characterized in having particularly high bendability and enables the formation of fine patterns, namely, high dense patterns of wiring.

Abstract translation: 一种用于柔性布线的层压板，其中铜镀层完全或局部施加在包覆在绝缘树脂基板上的铜箔上，其特征在于：A = [（200）/ {（111）+（200）+（220） ）+（311）}]×100，即镀铜表面的X射线衍射中的峰面积强度比大于90.本发明可以提供用于柔性布线的层压体，其中镀铜 完全或局部施加在包覆在绝缘树脂基板上的铜箔上，其特征在于具有特别高的弯曲性，并且能够形成精细图案，即高密集布线图案。

公开(公告)号：US09580829B2

公开(公告)日：2017-02-28

申请号：US13635147

申请日：2011-02-03

Applicant: Hideta Arai ,  Atsushi Miki

Inventor： Hideta Arai ,  Atsushi Miki

IPC: B21C37/00 ,  C25D7/06 ,  C25D5/12 ,  H05K3/38 ,  C25D1/04 ,  C25D3/38 ,  C25D3/56 ,  C25D3/58 ,  C25D9/04

CPC classification number: C25D7/0614 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D3/58 ,  C25D5/12 ,  C25D5/16 ,  C25D9/04 ,  C25D15/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/384 ,  H05K2203/0307 ,  Y10T428/12028

Abstract: Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

Abstract translation: 公开了一种印刷电路用铜箔，其通过在铜箔的表面上形成铜的一次粒子层，然后在一次粒子层上形成基于由铜，钴和镍构成的三元合金的二次粒子层， 一次粒子层的平均粒径为0.25〜0.45μm，由铜，钴，镍构成的三元合金的二次粒子层的平均粒径为0.05〜0.25μm。 提供一种用于印刷电路的铜箔，其中可以减少从铜箔掉落的粉末，并且可以通过在铜箔的表面上形成铜的一次粒子层来改善剥离强度和耐热性，然后形成 在一次粒子层上基于铜 - 钴 - 镍合金电镀的二次粒子层。

公开(公告)号：US20140093743A1

公开(公告)日：2014-04-03

申请号：US13824478

申请日：2012-03-12

Applicant: Hideta Arai ,  Kengo Kaminaga ,  Atsushi Miki ,  Ryo Fukuchi

Inventor： Hideta Arai ,  Kengo Kaminaga ,  Atsushi Miki ,  Ryo Fukuchi

IPC: H05K1/02

CPC classification number: H05K1/0274 ,  C25D3/38 ,  C25D3/58 ,  C25D5/10 ,  C25D5/12 ,  C25D5/48 ,  C25D7/0614 ,  C25D11/38 ,  H05K1/09 ,  H05K3/384 ,  H05K2201/0141 ,  H05K2201/0355 ,  Y10T428/12049

Abstract: Provided is a copper-clad laminate obtainable by bonding a copper foil on which roughening treatment including copper-cobalt-nickel alloy plating is performed and a liquid crystal polymer to each other, wherein the copper-clad laminate is free from a roughening particle residue on a surface of the liquid crystal polymer resin after copper foil circuit etching. The copper-clad laminate obtainable by bonding a copper foil and a liquid crystal polymer to each other, wherein the copper foil includes a copper primary particle layer formed on a surface bonded to the liquid crystal polymer and a secondary particle layer formed on the primary particle layer and made from a ternary alloy including copper, cobalt, and nickel; the primary particle layer has an average particle size of 0.25 to 0.45 μm; and the secondary particle layer has an average particle size of 0.05 to 0.25 μm.

Abstract translation: 提供一种覆铜层压板，其通过将进行包括铜 - 钴 - 镍合金电镀的粗化处理的铜箔和液晶聚合物彼此接合而制成，其中覆铜层压板不含粗糙化颗粒残渣 在铜箔电路蚀刻后的液晶聚合物树脂的表面。 通过将铜箔和液晶聚合物彼此接合而获得的覆铜层压板，其中，所述铜箔包括在与所述液晶聚合物接合的表面上形成的铜一次粒子层，和形成在所述一次粒子上的二次粒子层 并由包括铜，钴和镍的三元合金制成; 初级粒子层的平均粒径为0.25〜0.45μm; 二次粒子层的平均粒径为0.05〜0.25μm。

公开(公告)号：US08395673B2

公开(公告)日：2013-03-12

申请号：US10784776

申请日：2004-02-24

Applicant: Mitsuaki Fukuda ,  Toshio Endoh ,  Takahiro Aoki ,  Masaki Watanabe ,  Takayuki Sugiura ,  Naoyuki Fujimoto ,  Kiyoshi Chinzei ,  Mieko Nakano ,  Satoshi Fukui ,  Atsushi Miki ,  Shuji Kimura ,  Mitsuhiro Gotoh

Inventor： Mitsuaki Fukuda ,  Toshio Endoh ,  Takahiro Aoki ,  Masaki Watanabe ,  Takayuki Sugiura ,  Naoyuki Fujimoto ,  Kiyoshi Chinzei ,  Mieko Nakano ,  Satoshi Fukui ,  Atsushi Miki ,  Shuji Kimura ,  Mitsuhiro Gotoh

IPC: H04N5/232

CPC classification number: H04N5/23222 ,  H04N5/232

Abstract: An image shot by a shooting unit is stored in a shot image storing unit. An expected shooting state storing unit stores expected shooting state information which represents an expected shooting state of an object to be shot. A guide direction determining unit references the image stored in the shot image storing unit and the expected shooting state information, and determines in which direction the object to be shot, which is shot by the shooting unit, is to be guided. A guide direction instruction outputting unit notifies a user of a result of the determination made by the guide direction determining unit.

Abstract translation: 由拍摄单元拍摄的图像被存储在拍摄图像存储单元中。 预期拍摄状态存储单元存储表示要拍摄对象的预期拍摄状态的预期拍摄状态信息。 引导方向确定单元参考存储在拍摄图像存储单元中的图像和预期拍摄状态信息，并且确定由拍摄单元拍摄的被拍摄对象将被引导到哪个方向。 引导方向指示输出单元向用户通知由导向方向确定单元做出的确定结果。

公开(公告)号：US5298460A

公开(公告)日：1994-03-29

申请号：US993006

申请日：1992-12-18

Applicant: Masanori Nishiguchi ,  Atsushi Miki

Inventor： Masanori Nishiguchi ,  Atsushi Miki

IPC: H01L21/60 ,  H01L23/13 ,  H01L23/467 ,  H05K1/00 ,  H05K3/34 ,  H05K3/40 ,  H01L21/44

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/14 ,  H05K1/0284 ,  H05K3/3436 ,  H05K3/4007

Abstract: A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, the electrode terminal has a recess formed thereon to the receive at least a top of the bump, and at least a top of the surface of the electrode terminal is covered by a metal layer having a lower melting point than that of the bump.

Abstract translation: 根据本发明的用于封装其上具有凸块的半导体器件的衬底的特征在于，衬底具有连接凸块的电极端子，电极端子具有形成在其上的凹部至接收至少一个顶部 并且电极端子的表面的至少顶部被熔点低于凸点熔点的金属层覆盖。

公开(公告)号：US5244142A

公开(公告)日：1993-09-14

申请号：US794869

申请日：1991-11-19

Applicant: Masanori Nishiguchi ,  Atsushi Miki

Inventor： Masanori Nishiguchi ,  Atsushi Miki

IPC: H01L21/60

CPC classification number: H01L24/81 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/73253 ,  H01L2224/8014 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  Y10T29/49146

Abstract: A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.

Abstract translation: 一种在将电极对准并加热结构的同时，通过将半导体元件按压到布线板而将多个具有凸块电极的半导体元件安装在布线板上的方法。 在安装方法中，一个或多个散热器预先与形成有半导体元件的凸起电极的表面相对的背面接合。