公开(公告)号：US20240071797A1

公开(公告)日：2024-02-29

申请号：US17896374

申请日：2022-08-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Guancyun Li ,  Ching-Jung Chang ,  Chi-Feng Tung

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67715 ,  H01L21/67259 ,  H01L21/67706 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67733

Abstract: An apparatus in an overhead transport system is provided. The apparatus includes a hanger feature configured to be hung from a ceiling, a plate-like structure having a top surface and a bottom surface, the bottom surface being rotatably coupled to the hanger feature, and at least one pair of rail members mechanically coupled to the bottom surface of the plate-like structure by way of a plurality of yoke members.

公开(公告)号：US20240021456A1

公开(公告)日：2024-01-18

申请号：US18194428

申请日：2023-03-31

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chieh Hsu ,  Guancyun Li ,  Ching-Jung Chang ,  Chi-Feng Tung

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67733 ,  H01L21/67769 ,  H01L21/67766 ,  H01L21/68707

Abstract: System and method for cross-fab wafer transportation are provided. A method includes providing a first FAB building and a second FAB building connected via a bridging area, the second FAB building comprising fabrication tools configured to perform fabrication processes different than fabrication processes performed by fabrication tools in the first FAB building, after performing fabrication processes in the first FAB building, configuring a first vehicle of the first FAB building to travel along a first OHT track and take the wafer to the bridging area, configuring a second vehicle of the second FAB building to travel along a second OHT track and arrive at the bridging area, where a portion of the first OHT is in parallel with a portion of the second OHT track at the bridging area, when some predetermined conditions are met, configuring the first vehicle to transfer the wafer to the second vehicle.

公开(公告)号：US20240387214A1

公开(公告)日：2024-11-21

申请号：US18786057

申请日：2024-07-26

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chieh Hsu ,  Guancyun Li ,  Ching-Jung Chang ,  Chi-Feng Tung

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677

Abstract: An AMHS interface management system configured to facilitate the exchange of lot information between distinct AMHS systems. The AMHS interface management system receives lot information from a first AMHS system in a first format and translates the lot information into a format associated with a second AMHS system. The AMHS interface management system utilizes a handshake area located between the first and second AMHS systems. The handshake area includes one or more vehicles that facilitate the movement of a lot between the first AMHS system and the second AMHS system.

公开(公告)号：US12094741B2

公开(公告)日：2024-09-17

申请号：US17379734

申请日：2021-07-19

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chieh Hsu ,  Guancyun Li ,  Ching-Jung Chang ,  Chi-Feng Tung

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677

CPC classification number: H01L21/67276 ,  G05B19/4189 ,  H01L21/67724 ,  H01L21/67733

Abstract: An AMHS interface management system configured to facilitate the exchange of lot information between distinct AMHS systems. The AMHS interface management system receives lot information from a first AMHS system in a first format and translates the lot information into a format associated with a second AMHS system. The AMHS interface management system utilizes a handshake area located between the first and second AMHS systems. The handshake area includes one or more vehicles that facilitate the movement of a lot between the first AMHS system and the second AMHS system.

公开(公告)号：US11942342B2

公开(公告)日：2024-03-26

申请号：US17406006

申请日：2021-08-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Fu-Hsien Li ,  Chi-Feng Tung ,  Hsiang Yin Shen

IPC: H01L21/67 ,  B65G49/07 ,  B66C7/08 ,  B66C13/18 ,  G05B19/418 ,  H01L21/677

CPC classification number: H01L21/67242 ,  B65G49/07 ,  B66C7/08 ,  B66C13/18 ,  G05B19/41815 ,  H01L21/67727 ,  G05B2219/45031 ,  H01L21/67005

Abstract: A conveying unit includes a housing; a collision prevention mechanism disposed on a sidewall of the housing; a gripping member configured to hold a carrier for carrying a semiconductor structure; a sensor disposed on the gripping member and configured to measure and collect data associated with vibration of the gripping member; and an unit controller disposed on the gripping member and configured to analyze the data from the sensor and control a movement of the conveying unit.

公开(公告)号：US11380566B2

公开(公告)日：2022-07-05

申请号：US17134211

申请日：2020-12-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Fu-Hsien Li ,  Sheng-Kang Yu ,  Chi-Feng Tung ,  Hsiang Yin Shen ,  Guancyun Li

IPC: G05B19/19 ,  G05B19/4061 ,  H01L21/67 ,  B66C17/26 ,  B66C15/00 ,  B66C13/16 ,  B66C13/18 ,  H01L21/677 ,  G03F7/20

Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance crane, a rectangular zone overlapping with the load port of the manufacturing tool, a plurality of first sensors at corners of the rectangular zone, an OHT vehicle, a second sensor on the OHT vehicle, a third sensor on the load port, and a control unit. The first sensors are configured to detect a location of the maintenance crane and to generate a first location data. The second sensor is configured to generate a second location data. The control unit is configured to receive the first location data of the maintenance crane and the second location data of the OHT vehicle. The control unit further sends signals to the second sensor and the third sensor or to cut off the signal to the second sensor.

公开(公告)号：US11854846B2

公开(公告)日：2023-12-26

申请号：US17809582

申请日：2022-06-29

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Fu-Hsien Li ,  Sheng-Kang Yu ,  Chi-Feng Tung ,  Hsiang Yin Shen ,  Guancyun Li

IPC: G05B19/19 ,  G05B19/4061 ,  H01L21/67 ,  B66C17/26 ,  B66C15/00 ,  B66C13/16 ,  B66C13/18 ,  H01L21/677 ,  G03F7/00

CPC classification number: H01L21/67265 ,  B66C13/16 ,  B66C13/18 ,  B66C15/00 ,  B66C17/26 ,  G03F7/70033 ,  G03F7/7075 ,  G03F7/7085 ,  G03F7/70533 ,  G03F7/70741 ,  G03F7/70975 ,  G03F7/70991 ,  G05B19/19 ,  G05B19/4061 ,  H01L21/67259 ,  H01L21/67706 ,  H01L21/67721 ,  H01L21/67724 ,  H01L21/67733 ,  H01L21/67736 ,  G05B2219/40292 ,  G05B2219/45031

Abstract: A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.

公开(公告)号：US11107713B2

公开(公告)日：2021-08-31

申请号：US16425305

申请日：2019-05-29

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Fu-Hsien Li ,  Chi-Feng Tung ,  Hsiang Yin Shen

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677 ,  B66C13/18 ,  B65G49/07 ,  B66C7/08

Abstract: A method includes providing a rail, a first conveying unit movably mounted on the rail, and a central controller configured to control the first conveying unit; displacing the first conveying unit along the rail at a first speed; obtaining a first vibration measurement upon the displacement of the first conveying unit along the rail at the first speed; analyzing the first vibration measurement; transmitting a first signal based on the analysis of the first vibration measurement to the central controller; providing a second conveying unit movably mounted on the rail; transmitting a first feedback signal based on the first signal from the central controller to the second conveying unit; and displacing the second conveying unit along the rail at a second speed based on the first feedback signal.

公开(公告)号：US11011402B2

公开(公告)日：2021-05-18

申请号：US16390450

申请日：2019-04-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Fu-Hsien Li ,  Chi-Feng Tung ,  Hsiang Yin Shen

IPC: G06F7/00 ,  H01L21/677

Abstract: A transport system of a semiconductor fabrication facility, including: a rail for carrying vehicle, a sensor installed on the rail, a controller and a power panel. The sensor is arranged to determine a zone and send a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to adjust a current in accordance with the output signal, wherein the current is output to a cable extending along the rail.

公开(公告)号：US11854849B2

公开(公告)日：2023-12-26

申请号：US16900555

申请日：2020-06-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Yong-Jyu Lin ,  Fu-Hsien Li ,  Chen-Wei Lu ,  Chi-Feng Tung ,  Hsiang Yin Shen

IPC: H01L21/67 ,  H01L21/677 ,  B65G1/04 ,  B66F9/18 ,  B66C13/48 ,  B66C19/00 ,  B66C13/23 ,  B61B3/00

CPC classification number: H01L21/67733 ,  B65G1/0457 ,  B66C13/23 ,  B66C13/48 ,  B66C19/00 ,  B66F9/183 ,  H01L21/6773 ,  H01L21/67259 ,  H01L21/67724 ,  H01L21/67736 ,  B61B3/00 ,  B65G2201/0297

Abstract: A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.