Invention Grant
- Patent Title: System for a semiconductor fabrication facility and method for operating the same
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Application No.: US17809582Application Date: 2022-06-29
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Publication No.: US11854846B2Publication Date: 2023-12-26
- Inventor: Fu-Hsien Li , Sheng-Kang Yu , Chi-Feng Tung , Hsiang Yin Shen , Guancyun Li
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: G05B19/19
- IPC: G05B19/19 ; G05B19/4061 ; H01L21/67 ; B66C17/26 ; B66C15/00 ; B66C13/16 ; B66C13/18 ; H01L21/677 ; G03F7/00

Abstract:
A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.
Public/Granted literature
- US20220328331A1 SYSTEM FOR A SEMICONDUCTOR FABRICATION FACILITY AND METHOD FOR OPERATING THE SAME Public/Granted day:2022-10-13
Information query
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