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公开(公告)号:US11942342B2
公开(公告)日:2024-03-26
申请号:US17406006
申请日:2021-08-18
Inventor: Fu-Hsien Li , Chi-Feng Tung , Hsiang Yin Shen
IPC: H01L21/67 , B65G49/07 , B66C7/08 , B66C13/18 , G05B19/418 , H01L21/677
CPC classification number: H01L21/67242 , B65G49/07 , B66C7/08 , B66C13/18 , G05B19/41815 , H01L21/67727 , G05B2219/45031 , H01L21/67005
Abstract: A conveying unit includes a housing; a collision prevention mechanism disposed on a sidewall of the housing; a gripping member configured to hold a carrier for carrying a semiconductor structure; a sensor disposed on the gripping member and configured to measure and collect data associated with vibration of the gripping member; and an unit controller disposed on the gripping member and configured to analyze the data from the sensor and control a movement of the conveying unit.
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公开(公告)号:US11380566B2
公开(公告)日:2022-07-05
申请号:US17134211
申请日:2020-12-25
Inventor: Fu-Hsien Li , Sheng-Kang Yu , Chi-Feng Tung , Hsiang Yin Shen , Guancyun Li
IPC: G05B19/19 , G05B19/4061 , H01L21/67 , B66C17/26 , B66C15/00 , B66C13/16 , B66C13/18 , H01L21/677 , G03F7/20
Abstract: A system for a semiconductor fabrication facility includes a manufacturing tool including a load port, a maintenance crane, a rectangular zone overlapping with the load port of the manufacturing tool, a plurality of first sensors at corners of the rectangular zone, an OHT vehicle, a second sensor on the OHT vehicle, a third sensor on the load port, and a control unit. The first sensors are configured to detect a location of the maintenance crane and to generate a first location data. The second sensor is configured to generate a second location data. The control unit is configured to receive the first location data of the maintenance crane and the second location data of the OHT vehicle. The control unit further sends signals to the second sensor and the third sensor or to cut off the signal to the second sensor.
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公开(公告)号:US10403532B2
公开(公告)日:2019-09-03
申请号:US13623814
申请日:2012-09-20
Inventor: Jason Shen , Wen-Yu Huang , Li-Jen Ko , Hsiang Yin Shen
IPC: H01L21/67 , H01L21/677
Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.
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公开(公告)号:US11854846B2
公开(公告)日:2023-12-26
申请号:US17809582
申请日:2022-06-29
Inventor: Fu-Hsien Li , Sheng-Kang Yu , Chi-Feng Tung , Hsiang Yin Shen , Guancyun Li
IPC: G05B19/19 , G05B19/4061 , H01L21/67 , B66C17/26 , B66C15/00 , B66C13/16 , B66C13/18 , H01L21/677 , G03F7/00
CPC classification number: H01L21/67265 , B66C13/16 , B66C13/18 , B66C15/00 , B66C17/26 , G03F7/70033 , G03F7/7075 , G03F7/7085 , G03F7/70533 , G03F7/70741 , G03F7/70975 , G03F7/70991 , G05B19/19 , G05B19/4061 , H01L21/67259 , H01L21/67706 , H01L21/67721 , H01L21/67724 , H01L21/67733 , H01L21/67736 , G05B2219/40292 , G05B2219/45031
Abstract: A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.
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公开(公告)号:US11107713B2
公开(公告)日:2021-08-31
申请号:US16425305
申请日:2019-05-29
Inventor: Fu-Hsien Li , Chi-Feng Tung , Hsiang Yin Shen
IPC: H01L21/67 , G05B19/418 , H01L21/677 , B66C13/18 , B65G49/07 , B66C7/08
Abstract: A method includes providing a rail, a first conveying unit movably mounted on the rail, and a central controller configured to control the first conveying unit; displacing the first conveying unit along the rail at a first speed; obtaining a first vibration measurement upon the displacement of the first conveying unit along the rail at the first speed; analyzing the first vibration measurement; transmitting a first signal based on the analysis of the first vibration measurement to the central controller; providing a second conveying unit movably mounted on the rail; transmitting a first feedback signal based on the first signal from the central controller to the second conveying unit; and displacing the second conveying unit along the rail at a second speed based on the first feedback signal.
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公开(公告)号:US11011402B2
公开(公告)日:2021-05-18
申请号:US16390450
申请日:2019-04-22
Inventor: Fu-Hsien Li , Chi-Feng Tung , Hsiang Yin Shen
IPC: G06F7/00 , H01L21/677
Abstract: A transport system of a semiconductor fabrication facility, including: a rail for carrying vehicle, a sensor installed on the rail, a controller and a power panel. The sensor is arranged to determine a zone and send a quantity information in response to a quantity of vehicles in the zone. The controller is arranged to send an output signal in accordance with the quantity information. The power panel is arranged to adjust a current in accordance with the output signal, wherein the current is output to a cable extending along the rail.
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公开(公告)号:US12174528B2
公开(公告)日:2024-12-24
申请号:US17214367
申请日:2021-03-26
Inventor: Chen-Wei Lu , Chuan Wei Lin , Chun-Hau Chen , Kuan Yu Lai , Fu-Hsien Li , Chi-Feng Tung , Hsiang Yin Shen
IPC: G05B19/418 , G03F1/66 , G03F1/84 , G03F7/00 , G06N20/00
Abstract: A storage environment monitoring device is capable of measuring and/or monitoring various parameters of an environment inside a storage area, such as airflow, temperature, and humidity, to increase the storage quality of semiconductor components stored in the storage area. The storage environment monitoring device is capable of measuring and/or monitoring the parameters of the environment inside the storage area without having to open an enclosure that is storing the semiconductor components in the storage area. This reduces exposure of the semiconductor components to contamination and other environmental factors. In addition, the storage environment monitoring device may perform automatic measurements inside the storage area based on usage schedules of the semiconductor components that are to be stored in the storage area, which decreases downtime of the storage area and/or the semiconductor components, and increases productivity in a semiconductor processing environment in which the semiconductor components are used.
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公开(公告)号:US12094745B2
公开(公告)日:2024-09-17
申请号:US17818370
申请日:2022-08-09
Inventor: Yong-Jyu Lin , Fu-Hsien Li , Chen-Wei Lu , Chi-Feng Tung , Hsiang Yin Shen
CPC classification number: H01L21/67733 , B65G1/0457 , B66C13/23 , B66C13/48 , B66C19/00 , B66F9/183 , H01L21/67259 , H01L21/67724 , H01L21/6773 , H01L21/67736 , B61B3/00 , B65G2201/0297
Abstract: A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.
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公开(公告)号:US12094744B2
公开(公告)日:2024-09-17
申请号:US18310187
申请日:2023-05-01
Inventor: Chuan Wei Lin , Fu-Hsien Li , Chi-Feng Tung , Hsiang Yin Shen
IPC: H01L21/677
CPC classification number: H01L21/67724 , H01L21/67706 , H01L21/67733
Abstract: Some implementations described herein provide a method that includes loading, from a load port and into a first buffer of a multiple-buffer overhead hoist transport (OHT) vehicle, a first transport carrier storing one or more processed wafers. The method includes unloading to the load port, while the first buffer retains the first transport carrier, and from a second buffer of the multiple-buffer OHT vehicle, a second transport carrier storing one or more wafers for processing. In other implementations, the method includes loading, into a first buffer of the multiple-buffer OHT vehicle, a first transport carrier storing one or more wafers for processing, while a semiconductor processing tool, associated with a load port, is processing one or more wafers associated with a second transport carrier. The method includes positioning the multiple-buffer OHT vehicle above the load port while the multiple-buffer OHT vehicle retains the first transport carrier in the first buffer.
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公开(公告)号:US12085953B2
公开(公告)日:2024-09-10
申请号:US17304912
申请日:2021-06-28
Inventor: Rong Syuan Fan , Ching-Jung Chang , Chi-Feng Tung , Hsiang Yin Shen
IPC: G05D1/00 , G06Q10/087 , B65G1/137
CPC classification number: G05D1/0278 , G06Q10/087 , B65G1/1371
Abstract: A mobile stocker described herein is configured to be easily installed and relocated to various locations in a semiconductor fabrication facility. The mobile stocker is capable of being programmed with, and/or autonomously learning, the layout of a semiconductor fabrication facility, and automatically relocating to a new location based on the layout using a navigation system. Accordingly, the mobile stocker is capable of being flexibly relocated in the semiconductor fabrication facility to dynamically support changes in demand and production capacity. Moreover, the capability to quickly assign a location identifier to the mobile stocker and to automatically interface with transport systems in the semiconductor fabrication facility reduces downtime of the mobile stocker, which increases productivity in the semiconductor fabrication facility.
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