公开(公告)号：US12259709B2

公开(公告)日：2025-03-25

申请号：US18518464

申请日：2023-11-23

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Kai-Ting Yang ,  Li-Jen Ko ,  Hsiang Yin Shen

IPC: G05B19/4099 ,  H01L21/67

Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.

公开(公告)号：US10403532B2

公开(公告)日：2019-09-03

申请号：US13623814

申请日：2012-09-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Jason Shen ,  Wen-Yu Huang ,  Li-Jen Ko ,  Hsiang Yin Shen

IPC: H01L21/67 ,  H01L21/677

Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.

公开(公告)号：US11860607B2

公开(公告)日：2024-01-02

申请号：US16996832

申请日：2020-08-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Kai-Ting Yang ,  Li-Jen Ko ,  Hsiang Yin Shen

IPC: G05B19/4099 ,  H01L21/06 ,  H01L21/67

CPC classification number: G05B19/4099 ,  G05B2219/45031 ,  H01L21/67155 ,  H01L21/67276

Abstract: A behavior recognition device for recognizing behaviors of a semiconductor manufacturing apparatus includes a storage device and a control unit. The storage device is configured to store log data of the semiconductor manufacturing apparatus. The control unit is cooperatively connected to the storage device, and configured to build a transition state model based on the log data to analyze behaviors related to wafer transfer sequences and manufacturing operations of the semiconductor manufacturing apparatus.

公开(公告)号：US11062931B2

公开(公告)日：2021-07-13

申请号：US16548449

申请日：2019-08-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jason Shen ,  Wen-Yu Huang ,  Li-Jen Ko ,  Hsiang Yin Shen

IPC: H01L21/677 ,  H01L21/67

Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.