公开(公告)号：US20120001627A1

公开(公告)日：2012-01-05

申请号：US13255994

申请日：2010-03-05

申请人： Stefan Flock ,  Uwe Krella ,  Jürgen Steger

发明人： Stefan Flock ,  Uwe Krella ,  Jürgen Steger

IPC分类号： G01R33/02 ,  H05K3/30

CPC分类号： G01R33/0047 ,  G01R33/0052 ,  G01R33/091 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface-mountable magnetic field sensor (1) with a semiconductor chip (4), a magnetic field measuring device (30), and in a method for producing and populating a circuit board (24) having a magnetic field sensor (1), the magnetic field sensor (1) has a semiconductor chip (4), which is arranged on a flat-conductor substrate (5). At least three flat-conductor electrodes (6 to 9), which protrude out of a plastic housing side (10), are electrically connected to the semiconductor chip (4). The flat-conductor substrate (5) and the semiconductor chip (4) are embedded in a plastic housing (11). The plastic housing (11) can be inserted with the embedded semiconductor chip (4) into a magnetic field gap (12), with the flat-conductor electrodes (6 to 9) protruding, wherein the flat-conductor electrodes (6 to 9) have bends (13 to 16) at a distance from the plastic housing side (10), the bends being surface-mountable on a circuit board.

摘要翻译： 一种具有半导体芯片（4）的表面安装磁场传感器（1），磁场测量装置（30），以及用于制造和安装具有磁场传感器（1）的电路板（24）的方法， 磁场传感器（1）具有设置在扁平导体基板（5）上的半导体芯片（4）。 从塑料外壳侧（10）突出的至少三个扁平导体电极（6〜9）与半导体芯片（4）电连接。 扁平导体基板（5）和半导体芯片（4）嵌入塑料外壳（11）中。 塑料外壳（11）可以将嵌入式半导体芯片（4）插入到磁场间隙（12）中，扁平导体电极（6至9）突出，其中平面导体电极（6至9） 在塑料外壳侧（10）的一定距离处具有弯曲部（13至16），弯曲部可以表面安装在电路板上。

公开(公告)号：US08847590B2

公开(公告)日：2014-09-30

申请号：US13255994

申请日：2010-03-05

申请人： Stefan Flock ,  Uwe Krella ,  Jürgen Steger

发明人： Stefan Flock ,  Uwe Krella ,  Jürgen Steger

IPC分类号： G01R33/07 ,  G01R33/00 ,  G01R33/09

CPC分类号： G01R33/0047 ,  G01R33/0052 ,  G01R33/091 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface-mountable magnetic field sensor (1) with a semiconductor chip (4), a magnetic field measuring device (30), and in a method for producing and populating a circuit board (24) having a magnetic field sensor (1), the magnetic field sensor (1) has a semiconductor chip (4), which is arranged on a flat-conductor substrate (5). At least three flat-conductor electrodes (6 to 9), which protrude out of a plastic housing side (10), are electrically connected to the semiconductor chip (4). The flat-conductor substrate (5) and the semiconductor chip (4) are embedded in a plastic housing (11). The plastic housing (11) can be inserted with the embedded semiconductor chip (4) into a magnetic field gap (12), with the flat-conductor electrodes (6 to 9) protruding, wherein the flat-conductor electrodes (6 to 9) have bends (13 to 16) at a distance from the plastic housing side (10), the bends being surface-mountable on a circuit board.

摘要翻译： 一种具有半导体芯片（4）的表面安装磁场传感器（1），磁场测量装置（30），以及用于制造和安装具有磁场传感器（1）的电路板（24）的方法， 磁场传感器（1）具有设置在扁平导体基板（5）上的半导体芯片（4）。 从塑料外壳侧（10）突出的至少三个扁平导体电极（6〜9）与半导体芯片（4）电连接。 扁平导体基板（5）和半导体芯片（4）嵌入塑料外壳（11）中。 塑料外壳（11）可以将嵌入式半导体芯片（4）插入到磁场间隙（12）中，扁平导体电极（6至9）突出，其中平面导体电极（6至9） 在塑料外壳侧（10）的一定距离处具有弯曲部（13至16），弯曲部可以表面安装在电路板上。

公开(公告)号：US09159639B2

公开(公告)日：2015-10-13

申请号：US13544630

申请日：2012-07-09

申请人： Kurt-Georg Besendörfer ,  Nadja Erdner ,  Jürgen Steger

发明人： Kurt-Georg Besendörfer ,  Nadja Erdner ,  Jürgen Steger

IPC分类号： H05K7/20 ,  H01L23/34 ,  H01L23/18 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H01L25/07 ,  H01L23/00

CPC分类号： H01L23/34 ,  H01L23/18 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2924/01068 ,  H05K7/2039

摘要： A power electronic system with a cooling device, and a method for producing the system, comprising a plurality of submodules, each submodule having a first planar insulating material body, one first conductor track cohesively connected thereto, one power switch arranged on the conductor track, at least one internal connecting device composed of an alternate layer sequence of at least one electrically conductive film and at least one electrically insulating film, wherein at least one electrically conductive layer forms at least one second conductor track, and comprising external connection elements. In this case, the submodules are arranged cohesively or in a force-locking manner and in a manner spaced apart from one another with their first main surface on the cooling device. At least one second conductor track at least partially covers first conductor tracks of two submodules, electrically connects them to one another and covers an interspace between the submodules.

摘要翻译： 一种具有冷却装置的电力电子系统及其制造方法，包括多个子模块，每个子模块具有第一平面绝缘材料体，一个内部连接到其上的一个第一导体轨道，布置在导体轨道上的一个电力开关， 至少一个内部连接装置，其由至少一个导电膜和至少一个电绝缘膜的交替层序列组成，其中至少一个导电层形成至少一个第二导体轨道，并且包括外部连接元件。 在这种情况下，子模块以冷却装置的内部和第二主表面彼此间隔开的方式以强力锁定的方式并排设置。 至少一个第二导体轨道至少部分地覆盖两个子模块的第一导体轨道，将它们彼此电连接并覆盖子模块之间的间隙。

公开(公告)号：US07965516B2

公开(公告)日：2011-06-21

申请号：US12505950

申请日：2009-07-20

申请人： Jürgen Steger ,  Marco Lederer

发明人： Jürgen Steger ,  Marco Lederer

IPC分类号： H05K7/20

CPC分类号： H01L23/10 ,  H01L23/053 ,  H01L23/3735 ,  H01L23/4093 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/166 ,  H01L2924/00

摘要： A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing.

摘要翻译： 一种功率半导体模块，包括具有至少一个功率半导体元件的衬底; 用于从所述至少一个功率半导体元件散热的散热器和具有切口的壳体，所述切口布置在所述壳体的面对所述散热器的下表面并保持所述基板; 以及用于生产这种功率半导体模块的方法。 所述功率半导体模块具有至少一个保持元件，该保持元件在壳体的下表面上接合在与所述至少一个保持元件相关联的凹部中，并且被设计成使得其限制所述基板在所述方向上的任何移动 的外壳的下面。

公开(公告)号：US09165858B2

公开(公告)日：2015-10-20

申请号：US13865184

申请日：2013-04-17

申请人： Jürgen Steger ,  Markus Knebel ,  Andreas Maul ,  Susanne Kalla

发明人： Jürgen Steger ,  Markus Knebel ,  Andreas Maul ,  Susanne Kalla

IPC分类号： G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  H01L23/34 ,  F25B21/02 ,  H05K1/00 ,  H01R13/46 ,  H01L23/473 ,  H01H9/52 ,  H01L23/06 ,  H01L25/07 ,  H01L25/11 ,  H01L23/36

CPC分类号： H01L23/473 ,  H01H9/52 ,  H01L23/06 ,  H01L23/34 ,  H01L23/36 ,  H01L23/40 ,  H01L23/4012 ,  H01L25/074 ,  H01L25/117 ,  H01L2924/0002 ,  H05K7/20 ,  H05K7/20927 ,  H01L2924/00

摘要： An arrangement having a cooling circulation, a plurality of modular power semiconductor modules and at least one capacitor, wherein a power semiconductor module has a power electronics switch and a cooling device, which is capable of carrying a flow of a cooling fluid, for cooling the switch, the cooling device having at least one cooling face, and four connection devices for the cooling fluid. The connection devices are arranged in pairs on main sides of the power semiconductor module. The power semiconductor modules have their main sides strung together modularly by connecting corresponding connection devices on successive power semiconductor modules. To this end, at least two successive power semiconductor modules have a capacitor arranged between them which, for its part, is cooled by means of the cooling circulation of the cooling fluid as provided by the arrangement.

摘要翻译： 具有冷却循环的装置，多个模块化功率半导体模块和至少一个电容器，其中功率半导体模块具有电力电子开关和冷却装置，其能够承载冷却流体流，以冷却 开关，具有至少一个冷却面的冷却装置和用于冷却流体的四个连接装置。 连接装置成对地配置在功率半导体模块的主侧。 功率半导体模块通过连接功率半导体模块上的相应连接装置将它们的主要侧面组合在一起。 为此，至少两个连续的功率半导体模块具有布置在它们之间的电容器，它们通过由该装置提供的冷却流体的冷却循环来冷却。

公开(公告)号：US09196572B2

公开(公告)日：2015-11-24

申请号：US14056830

申请日：2013-10-17

申请人： Jürgen Steger ,  Peter Beckedahl

发明人： Jürgen Steger ,  Peter Beckedahl

IPC分类号： H01L23/52 ,  H01L23/482 ,  H01L25/07 ,  H01L23/373 ,  H01L23/538

CPC分类号： H01L23/482 ,  H01L23/3735 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A power semiconductor module comprising a substrate. The power semiconductor module has first and second DC voltage load current connection elements and first and second power semiconductor components. The first and second power semiconductor components are arranged along a lateral first direction of the substrate. The power semiconductor module has a foil composite having a first metallic foil layer and a structured second metallic foil layer and an electrically insulating foil layer arranged between the first and second metallic foil layers. The first power semiconductor component and the second power semiconductor component are electrically conductively connected to the foil composite and to the substrate. The first and second power semiconductor components are arranged on a common side in relation to the first and second DC voltage load current connection elements. The invention provides a power semiconductor module having a particularly low-inductance construction.

摘要翻译： 一种功率半导体模块，包括基板。 功率半导体模块具有第一和第二直流电压负载电流连接元件以及第一和第二功率半导体元件。 第一和第二功率半导体部件沿着衬底的横向第一方向布置。 功率半导体模块具有箔复合体，其具有第一金属箔层和结构化的第二金属箔层以及布置在第一和第二金属箔层之间的电绝缘箔层。 第一功率半导体部件和第二功率半导体部件与箔复合体和基板导电连接。 第一和第二功率半导体元件相对于第一和第二DC电压负载电流连接元件布置在公共侧。 本发明提供了具有特别低电感结构的功率半导体模块。

公开(公告)号：US07948007B2

公开(公告)日：2011-05-24

申请号：US11403169

申请日：2006-04-12

申请人： Jürgen Steger ,  Yvonne Manz

发明人： Jürgen Steger ,  Yvonne Manz

IPC分类号： H01L23/02

CPC分类号： H01L25/072 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/0061 ,  H05K3/222 ,  H05K3/3426 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being comprised of an insulating body and having on the first main face facing away from the base plate a plurality of connecting tracks electrically insulated from each other. The terminal and connecting elements are arranged on a connecting track in with contact faces contacting connecting tracks or power semiconductor components, with the individual contact faces having a plurality of partial contact faces. In one optional embodiment, each partial contact face has a maximum area of 20 mm2. In another embodiment, partial contact faces each are arranged at a distance of approximately 5 mm with regard to each other and the connection of the partial faces to the connecting tracks or the power semiconductor components is flush.

摘要翻译： 功率半导体模块包括壳体，通向壳体外部的端子元件，布置在壳体内部的电绝缘基板，其中基板由绝缘体构成，并且在第一主面上背离基板a 多个连接轨道彼此电绝缘。 端子和连接元件布置在连接轨道上，接触面接触连接轨道或功率半导体部件，各个接触面具有多个部分接触面。 在一个可选实施例中，每个部分接触面的最大面积为20mm 2。 在另一个实施例中，部分接触面各自相对于彼此以大约5mm的距离布置，并且部分面与连接轨道或功率半导体部件的连接是齐平的。

公开(公告)号：US07164201B2

公开(公告)日：2007-01-16

申请号：US10897720

申请日：2004-07-23

申请人： Yvonne Manz ,  Jürgen Steger ,  Thomas Stockmeier

发明人： Yvonne Manz ,  Jürgen Steger ,  Thomas Stockmeier

IPC分类号： H01L23/34

CPC分类号： H01L25/072 ,  H01L23/34 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2924/00

摘要： A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary contacts. The module having at least two electrically insulating substrates disposed inside the housing, which in turn each comprise one insulating body and a plurality of metal conducting tracks, located on the first main face of the insulating body, which first main face is remote from the base plate or the heat sink. The metal connecting tracks are electrically insulated from one another, and power semiconductor components are located on and electrically connected to these connecting tracks. The substrates (50) are identical, and electrically connected to one another, and have the same type and number of power semiconductor components disposed thereon.

摘要翻译： 具有可扩展结构的功率半导体模块，具有底板或用于直接安装在散热器上。 模块具有框架式外壳，盖子，端子元件，延伸到外壳的外部用于负载触点和辅助触点。 所述模块具有设置在所述壳体内的至少两个电绝缘基板，所述绝缘基板又包括位于所述绝缘体的所述第一主面上的一个绝缘体和多个金属导电轨道，所述第一主面远离所述基座 板或散热器。 金属连接轨道彼此电绝缘，并且功率半导体部件位于并且电连接到这些连接轨道。 基板（50）相同并且彼此电连接，并且具有设置在其上的相同类型和数量的功率半导体部件。

公开(公告)号：US06958534B2

公开(公告)日：2005-10-25

申请号：US10821290

申请日：2004-04-09

申请人： Thomas Stockmeier ,  Jürgen Steger

发明人： Thomas Stockmeier ,  Jürgen Steger

IPC分类号： H01L23/373 ,  H01L23/48 ,  H01L25/07 ,  H01L25/18 ,  H01L23/10 ,  H01L23/34 ,  H01L23/04 ,  H01L23/12

CPC分类号： H01L23/3735 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K1/144 ,  H05K3/325 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor module has a base plate comprising a framelike housing, a cap, and at least one electrically insulated substrate disposed inside the housing. The substrate comprises an insulation body with a plurality of metal connection tracks located thereon and insulated from one another, power semiconductor components located on the connection tracks, and terminal elements leading to the outside of the power semiconductor module for load and auxiliary contacts. Some of these terminal elements in the interior of the power semiconductor module comprise contact springs, which are disposed between the connection tracks and contact points on a printed circuit board. The printed circuit board has conductor tracks, which connect the contact points to contact elements that lead to the outside of the power semiconductor module.

摘要翻译： 功率半导体模块具有基板，该基板包括框架壳体，盖子，以及设置在壳体内部的至少一个电绝缘基板。 基板包括绝缘体，其具有位于其上并彼此绝缘的多个金属连接轨道，位于连接轨道上的功率半导体部件以及通向用于负载和辅助触点的功率半导体模块外部的端子元件。 功率半导体模块内部的这些端子元件中的一些包括接触弹簧，其设置在印刷电路板上的连接轨道和接触点之间。 印刷电路板具有导体轨道，其将接触点连接到通向功率半导体模块外部的接触元件。

公开(公告)号：US06654249B2

公开(公告)日：2003-11-25

申请号：US10138023

申请日：2002-05-02

申请人： Christian Göbl ,  Werner Trusky ,  Jürgen Steger ,  Peter Beckedahl ,  Paul Mourick

发明人： Christian Göbl ,  Werner Trusky ,  Jürgen Steger ,  Peter Beckedahl ,  Paul Mourick

IPC分类号： H05K720

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary connections. Components such as power transistors, are in contact with the conductive strips and the auxiliary connections. The intermediate-circuit board includes a positive-pole DC connection and negative-pole DC connection and electrical capacitors connected between them. An AC connection element that must be cooled is assigned to each substrate. The positive-pole DC connection and the negative-pole DC connection include contacts for direct low-inductance connection with the corresponding conductive strips of the one or more substrates. The equivalent applies to the one or more AC connection elements. The compression device electrically connects the contacts of the positive-pole and negative-pole DC connections and the contacts of the one or more AC connection elements.