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    Compact power semiconductor module having a connecting device
    4.
    发明申请
    Compact power semiconductor module having a connecting device 失效
    紧凑型功率半导体模块具有连接装置

    公开(公告)号：US20070222060A1

    公开(公告)日：2007-09-27

    申请号：US11726641

    申请日：2007-03-22

    申请人： Christian Gobl ,  Markus Knebel

    发明人： Christian Gobl ,  Markus Knebel

    IPC分类号： H01L23/52

    CPC分类号： H01L23/5389 ,  H01L23/053 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/00

    摘要： A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device comprises a film composite with first and second conductive layers, which are respectively patterned and thus form conductor tracks, and an insulating layer disposed between the two conductive layers. The first conductive layer has first contacts, formed as spot-welded joints, for power connecting areas of power semiconductor components, second contacts for control connecting areas of power semiconductor components and third contacts for the load connection to a printed circuit board. The second conductive layer connects to the first conductive layer and fourth contacts for providing control connection to an external printed circuit board. The film composite also has film sections between the first and second contacts and between the third and fourth contacts, which are arranged in guide sections of the housing.

    摘要翻译： 一种功率半导体模块，具有壳体，具有导体轨迹的基板和布置在导体轨道上的功率半导体部件，以及连接装置。 连接装置包括具有第一和第二导电层的膜复合体，其分别被图案化并因此形成导体轨道，以及设置在两个导电层之间的绝缘层。 第一导电层具有形成为点焊接头的第一触点，用于功率半导体部件的功率连接区域，用于功率半导体部件的控制连接区域的第二触点和用于到印刷电路板的负载连接的第三触点。 第二导电层连接到第一导电层和第四触点，用于提供到外部印刷电路板的控制连接。 薄膜复合材料还具有在第一和第二触点之间以及第三和第四触点之间的薄膜部分，它们布置在壳体的引导部分中。

    Method for producing a power semiconductor module, and power semiconductor module comprising a connection device
    5.
    发明授权
    Method for producing a power semiconductor module, and power semiconductor module comprising a connection device 有权
    功率半导体模块的制造方法以及包括连接装置的功率半导体模块

    公开(公告)号：US08283784B2

    公开(公告)日：2012-10-09

    申请号：US12797331

    申请日：2010-06-09

    申请人： Peter Beckedahl ,  Markus Knebel ,  Thomas Stockmeier

    发明人： Peter Beckedahl ,  Markus Knebel ,  Thomas Stockmeier

    IPC分类号： H01L23/52 ,  H01L21/768

    CPC分类号： H01L25/072 ,  H01L23/049 ,  H01L23/48 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/32 ,  H01L2224/32188 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/16195

    摘要： A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

    摘要翻译： 一种用于制造功率半导体模块和通过该方法制造的模块的方法，其中所述模块包括基板，连接装置和负载端子元件，其中功率半导体部件布置在所述基板的导体轨道上并连接到所述基板 通过连接装置加载终端元件。 功率半导体模块具有可连接到外部印刷电路板的辅助接触焊盘。 在这种情况下的主要生产步骤是将第一导体轨道的各个第一接触区域与功率半导体部件的至少一个第二接触区域和负载端子元件的至少一个第三接触区域内联连接; 之后，由连接装置的至少一个功率半导体部件和负载端子元件构成的组合被配置成形成功率半导体模块的壳体。

    Method for Producing a Power Semiconductor Module, and Power Semiconductor Module Comprising a Connection Device
    6.
    发明申请
    Method for Producing a Power Semiconductor Module, and Power Semiconductor Module Comprising a Connection Device 有权
    一种用于生产功率半导体模块的方法，以及包括连接装置的功率半导体模块

    公开(公告)号：US20110001244A1

    公开(公告)日：2011-01-06

    申请号：US12797331

    申请日：2010-06-09

    申请人： Peter BECKEDAHL ,  Markus Knebel ,  Thomas Stockmeier

    发明人： Peter BECKEDAHL ,  Markus Knebel ,  Thomas Stockmeier

    IPC分类号： H01L23/52 ,  H01L21/768

    CPC分类号： H01L25/072 ,  H01L23/049 ,  H01L23/48 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/32 ,  H01L2224/32188 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/16195

    摘要： A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

    摘要翻译： 一种用于制造功率半导体模块和通过该方法制造的模块的方法，其中所述模块包括基板，连接装置和负载端子元件，其中功率半导体部件布置在所述基板的导体轨道上并连接到所述基板 通过连接装置加载终端元件。 功率半导体模块具有可连接到外部印刷电路板的辅助接触焊盘。 在这种情况下的主要生产步骤是将第一导体轨道的各个第一接触区域与功率半导体部件的至少一个第二接触区域和负载端子元件的至少一个第三接触区域内联连接; 之后，由连接装置的至少一个功率半导体部件和负载端子元件构成的组合被配置成形成功率半导体模块的壳体。

    Modular liquid-cooled power semiconductor module, and arrangement therewith
    7.
    发明申请
    Modular liquid-cooled power semiconductor module, and arrangement therewith 有权
    模块化液冷功率半导体模块及其配置

    公开(公告)号：US20130271916A1

    公开(公告)日：2013-10-17

    申请号：US13865177

    申请日：2013-04-17

    申请人： Jürgen STEGER ,  Markus KNEBEL ,  Peter BECKEDAHL ,  Andreas MAUL ,  Susanne KALLA

    发明人： Jürgen STEGER ,  Markus KNEBEL ,  Peter BECKEDAHL ,  Andreas MAUL ,  Susanne KALLA

    IPC分类号： H01H9/52

    CPC分类号： H01H9/52 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/071 ,  H01L25/072 ,  H01L25/117 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

    摘要： A power semiconductor module, and an arrangement using the module. The module has a basic parallelepipedal shape with opposed pairs of main, longitudinal and narrow sides, a cooling device which is capable of carrying a flow of a cooling fluid, having a power electronics switch and a housing. The cooling device has a cooling volume with at least one cooling face and four connection devices which are arranged in pairs on the main sides. In addition, the connection devices carry the cooling fluid and are designed as a flow inflow and a flow outflow and as a return inflow and a return outflow, respectively. The power electronics switch has load input connection devices and load output connection devices which are arranged on one or both longitudinal sides and a control connection device which is arranged on a narrow side of the module.

    摘要翻译： 功率半导体模块和使用该模块的布置。 模块具有基本的平行六面体形状，具有相对的主纵向和窄边对，能够承载冷却流体流的冷却装置，具有电力电子开关和壳体。 冷却装置具有至少一个冷却面的冷却体积和在主侧成对设置的四个连接装置。 此外，连接装置携带冷却流体，分别被设计为流入流量和流量流出，以及作为回流流入和回流流出。 电力电子开关具有布置在一个或两个纵向侧上的负载输入连接装置和负载输出连接装置以及布置在模块的窄侧上的控制连接装置。

    Compact power semiconductor module having a connecting device
    9.
    发明授权
    Compact power semiconductor module having a connecting device 失效
    紧凑型功率半导体模块具有连接装置

    公开(公告)号：US07626256B2

    公开(公告)日：2009-12-01

    申请号：US11726641

    申请日：2007-03-22

    申请人： Christian Göbl ,  Markus Knebel

    发明人： Christian Göbl ,  Markus Knebel

    IPC分类号： H01L23/48

    CPC分类号： H01L23/5389 ,  H01L23/053 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/00

    摘要： A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device comprises a film composite with first and second conductive layers, which are respectively patterned and thus form conductor tracks, and an insulating layer disposed between the two conductive layers. The first conductive layer has first contacts, formed as spot-welded joints, for power connecting areas of power semiconductor components, second contacts for control connecting areas of power semiconductor components and third contacts for the load connection to a printed circuit board. The second conductive layer connects to the first conductive layer and fourth contacts for providing control connection to an external printed circuit board. The film composite also has film sections between the first and second contacts and between the third and fourth contacts, which are arranged in guide sections of the housing.

    摘要翻译： 一种功率半导体模块，具有壳体，具有导体轨迹的基板和布置在导体轨道上的功率半导体部件，以及连接装置。 连接装置包括具有第一和第二导电层的膜复合体，其分别被图案化并因此形成导体轨道，以及设置在两个导电层之间的绝缘层。 第一导电层具有形成为点焊接头的第一触点，用于功率半导体部件的功率连接区域，用于功率半导体部件的控制连接区域的第二触点和用于到印刷电路板的负载连接的第三触点。 第二导电层连接到第一导电层和第四触点，用于提供到外部印刷电路板的控制连接。 薄膜复合材料还具有在第一和第二触点之间以及第三和第四触点之间的薄膜部分，它们布置在壳体的引导部分中。