公开(公告)号：US20100092001A1

公开(公告)日：2010-04-15

申请号：US12329692

申请日：2008-12-08

Applicant: Oleg Saltykov ,  Anton Gebert ,  Ottmar Ruschig ,  Marco Lederer

Inventor： Oleg Saltykov ,  Anton Gebert ,  Ottmar Ruschig ,  Marco Lederer

IPC: H04R29/00

CPC classification number: H04R25/70

Abstract: In a system and method for open fitting hearing aid frequency response sound measurements, a test space is provided having located therein a sound source, a hearing aid with a microphone, and an open fit receiver. An acoustic shield is provided and within the acoustic shield an ear simulator coupler is provided having an ear extension attached thereto, the ear extension having mounted thereto at least a portion of the open fit receiver. A measurement unit receives sound signals from the ear simulator coupler.

Abstract translation: 在用于开放式助听器频率响应声音测量的系统和方法中，提供了测试空间，其中设置有声源，具有麦克风的助听器和开放式接收器。 提供了一种声屏蔽，并且在该声屏蔽之内，提供了具有附接到其上的耳部延伸部的耳模拟器耦合器，该耳部延伸部已安装在该开口配合接收器的至少一部分上。 测量单元接收来自耳模拟器耦合器的声音信号。

公开(公告)号：US20080007918A1

公开(公告)日：2008-01-10

申请号：US11818288

申请日：2007-06-14

Applicant: Marco Lederer ,  Rainer Popp

Inventor： Marco Lederer ,  Rainer Popp

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H01L24/72 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19043 ,  H05K1/0263 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A power semiconductor module, for placement on a cooling component. The module includes a substrate, at least two power semiconductor components arranged on the substrate, a housing and outwardly routed load and control connections. The substrate has an insulator body with a first main area that faces the interior of the power semiconductor module, and has interconnects at load potential arranged thereon. Each load connection is formed as a shaped metal body with outer contacts, a strip-like section and with inner contacts extending from the strip-like section to the substrate and making circuit-compliant contact therewith. In addition, the load connections are substantially completely encased by insulation except in the vicinity of the outer and inner contacts and accordingly are electrically insulated from one another.

Abstract translation: 功率半导体模块，用于放置在冷却部件上。 模块包括衬底，布置在衬底上的至少两个功率半导体组件，壳体和向外布局的负载和控制连接。 衬底具有绝缘体，其具有面向功率半导体模块内部的第一主区域，并且在其上布置有负载电位的互连。 每个负载连接形成为具有外部触点，带状部分和内部触点的成形金属体，该触点从带状部分延伸到基板并且与其形成电路兼容的接触。 此外，负载连接基本上完全被绝缘包围，除了外部和内部触点附近，并且因此彼此电绝缘。

公开(公告)号：US20070194443A1

公开(公告)日：2007-08-23

申请号：US11705729

申请日：2007-02-13

Applicant: Marco Lederer ,  Rainer Popp

Inventor： Marco Lederer ,  Rainer Popp

IPC: H01L23/34

CPC classification number: H05K7/2049 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0263 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal molded bodies with a flat portion and a contact device originating at the flat portion, disposed within a housing. Each flat portion is disposed parallel to, and spaced from, the surface of the substrate. Contact feet extend from the flat portions to conductor tracks on the substrate. A pressure plate exerts pressure on the load terminals to hold them in place and establish electrical contact between the contact feet and the conductor tracks, while also establishing thermal contact between the load terminals and the cooling component. The cooling component, the housing, and the pressure plate form a first unit, which is mechanically decoupled from a second unit comprising the substrate and the load terminals.

Abstract translation: 具有相关制造方法的装置，压力接触实施例中的功率半导体模块和冷却部件。 模块包括实施为具有扁平部分的金属模制体的负载端子和始终位于平坦部分的接触装置，该接触装置设置在壳体内。 每个平坦部分平行于衬底的表面设置并与其间隔开。 接触脚从平坦部分延伸到基板上的导体轨迹。 压力板对负载端子施加压力以将其保持在适当位置，并且在接触脚和导体轨道之间建立电接触，同时还在负载端子和冷却部件之间建立热接触。 冷却部件，壳体和压力板形成第一单元，其与包括基板和负载端子的第二单元机械地分离。

公开(公告)号：US20130148832A1

公开(公告)日：2013-06-13

申请号：US13817998

申请日：2010-08-20

Applicant: Anton Gebert ,  Marco Lederer

Inventor： Anton Gebert ,  Marco Lederer

IPC: H04R1/04 ,  H04R25/00

CPC classification number: H04R1/04 ,  H04R25/604 ,  H04R25/65 ,  H04R25/654

Abstract: In order to protect a microphone from moisture and/or dirt, there is provided a microphone protective device that needs only relatively little space for installation into an electroacoustic device for a relatively large effective surface area. For this purpose, the novel microphone protective device has an at least partially cylindrical-shell-shaped membrane, for preventing dirt and/or moisture from entering a sound inlet opening of the microphone.

Abstract translation: 为了保护麦克风免受湿气和/或污物的影响，提供了一种麦克风保护装置，该麦克风保护装置仅需相对较小的空间来安装到电声器件中以达到较大的有效表面积。 为此目的，新颖的麦克风保护装置具有至少部分圆柱形的壳形膜，用于防止灰尘和/或湿气进入麦克风的声音入口。

公开(公告)号：US20110188691A1

公开(公告)日：2011-08-04

申请号：US13018762

申请日：2011-02-01

Applicant: ULI GOMMEL ,  MARCO LEDERER ,  OTTMAR RUSCHIG ,  FRIEDRICH ZENK

Inventor： ULI GOMMEL ,  MARCO LEDERER ,  OTTMAR RUSCHIG ,  FRIEDRICH ZENK

IPC: H04R25/00

CPC classification number: H04R25/608 ,  H04R25/604 ,  H04R2460/17

Abstract: A tool is provided with which a receiver of a hearing aid can be easily fitted into an earpiece or an ear mold and removed therefrom. The tool has an elongate main body, a first tool part for removing the receiver from a first earpiece, a second tool part for removing the receiver from a second earpiece, and a third tool part for fitting the receiver into the first or second earpiece. The elongate main body is divided into a first subsidiary body and a second subsidiary body). The two subsidiary bodies can be plugged at least partially one inside the other in the direction of the longitudinal axis of the main body. In addition, two of the three tool parts are arranged on one of the two subsidiary bodies, and the remaining tool part is arranged on the other of the two subsidiary bodies.

Abstract translation: 提供了一种工具，其中助听器的接收器可以容易地装配到耳机或耳模中并从中移除。 该工具具有细长主体，用于从第一听筒移除接收器的第一工具部件，用于从第二听筒移除接收器的第二工具部件和用于将接收器装配到第一或第二听筒中的第三工具部件。 细长主体分为第一辅助体和第二辅助体）。 两个附属体可以在主体的纵向轴线的方向上至少部分地彼此插入。 另外，三个工具部件中的两个安置在两个附属体中的一个上，其余的工具部分布置在两个附属体的另一个上。

公开(公告)号：US20080212302A1

公开(公告)日：2008-09-04

申请号：US12069777

申请日：2008-02-13

Applicant: Rainer Popp ,  Marco Lederer

Inventor： Rainer Popp ,  Marco Lederer

IPC: H05K7/18

CPC classification number: H01L25/072 ,  H01L23/10 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A housing for a power semiconductor module in which load-connecting elements having contact devices are arranged. The contact devices are arranged in housing troughs on the exterior of the housing. The housing troughs are formed at an associated lateral wall of the housing. The housing is closed off by a cover. The housing is preferably formed as a unitary piece of material having a circumferential sealing frame and the cover includes an outer rim that extends over the circumferential sealing frame, to prevent the penetration of fluid or moisture into the power semiconductor module when the cover is closed. On its inner rim, each housing trough includes a sealing rib formed of a section of the sealing frame. The associated load-connecting element is crimped about the sealing rib, so that the contact device is disposed within the trough.

Abstract translation: 一种用于功率半导体模块的壳体，其中布置有具有接触装置的负载连接元件。 接触装置布置在壳体外部的壳体槽中。 壳体槽形成在壳体的相关侧壁处。 外壳由盖子封闭。 壳体优选地形成为具有周向密封框架的整体材料，并且盖包括在周向密封框架上延伸的外边缘，以防止当盖关闭时流体或湿气渗透到功率半导体模块中。 在其内缘上，每个壳体槽包括由密封框架的一部分形成的密封肋。 相关联的负载连接元件围绕密封肋压接，使得接触装置设置在槽内。

公开(公告)号：US08644541B2

公开(公告)日：2014-02-04

申请号：US13569346

申请日：2012-08-08

Applicant: Sebastian Lackert ,  Marco Lederer ,  Hartmut Ritter ,  Friedrich Zenk

Inventor： Sebastian Lackert ,  Marco Lederer ,  Hartmut Ritter ,  Friedrich Zenk

IPC: H04R25/00

CPC classification number: H04R25/45 ,  H04R1/086 ,  H04R25/405 ,  H04R25/456 ,  H04R25/608

Abstract: A hearing apparatus and in particular a hearing aid are to be optimized as regards the risk of feedback. The hearing apparatus contains a housing, having a first opening and a second opening, and with a frame, in or on which a signal processing component is attached, and which can be inserted into the first opening of the housing as far as an end position. A ramp is disposed in the housing which interacts with the frame such that the frame is also moved perpendicular to the direction of insertion toward the second opening during insertion into the housing along a direction of insertion only in one section as far as the end position, which is less than 30% of the insertion path from the first opening to the end position.

Abstract translation: 对于反馈的风险，要优化听力仪器，特别是助听器。 听力设备包括具有第一开口和第二开口的框架，以及附接有信号处理部件的框架，并且可以将其插入到壳体的第一开口中，直到端部位置 。 在外壳中设置有与框架相互作用的斜面，使得框架在插入壳体期间也沿着插入方向垂直于插入方向移动，仅在一个部分中直到最终位置， 其小于从第一开口到结束位置的插入路径的30％。

公开(公告)号：US08355519B2

公开(公告)日：2013-01-15

申请号：US13018762

申请日：2011-02-01

Applicant: Uli Gommel ,  Marco Lederer ,  Ottmar Ruschig ,  Friedrich Zenk

Inventor： Uli Gommel ,  Marco Lederer ,  Ottmar Ruschig ,  Friedrich Zenk

IPC: H04R25/00

CPC classification number: H04R25/608 ,  H04R25/604 ,  H04R2460/17

Abstract: A tool is provided with which a receiver of a hearing aid can be easily fitted into an earpiece or an ear mold and removed therefrom. The tool has an elongate main body, a first tool part for removing the receiver from a first earpiece, a second tool part for removing the receiver from a second earpiece, and a third tool part for fitting the receiver into the first or second earpiece. The elongate main body is divided into a first subsidiary body and a second subsidiary body). The two subsidiary bodies can be plugged at least partially one inside the other in the direction of the longitudinal axis of the main body. In addition, two of the three tool parts are arranged on one of the two subsidiary bodies, and the remaining tool part is arranged on the other of the two subsidiary bodies.

Abstract translation: 提供了一种工具，其中助听器的接收器可以容易地装配到耳机或耳模中并从中移除。 该工具具有细长主体，用于从第一听筒移除接收器的第一工具部件，用于从第二听筒移除接收器的第二工具部件和用于将接收器装配到第一或第二听筒中的第三工具部件。 细长主体分为第一辅助体和第二辅助体）。 两个附属体可以在主体的纵向轴线的方向上至少部分地彼此插入。 另外，三个工具部件中的两个安置在两个附属体中的一个上，其余的工具部分布置在两个附属体的另一个上。

公开(公告)号：US08182273B2

公开(公告)日：2012-05-22

申请号：US12622244

申请日：2009-11-19

Applicant: Marco Lederer

Inventor： Marco Lederer

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K7/1432 ,  H01L23/34 ,  H01L23/48 ,  H01L23/49534 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01R13/2421 ,  H01L2924/00

Abstract: A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient section and a second contact device. The pressure member has two stop elements. The first contact device is electrically conductively connected to the contact surfaces of the substrate. The second contact device is arcuate in shape and has at least one deformation at the beginning and at the end of the arc, wherein, as a result of the deformations of the second contact device co-operating with the two stop elements of the pressure member, the connection element is prestressed.

Abstract translation: 一种功率半导体模块，具有壳体，压力构件，包括至少一个接触表面的基板以及朝向壳体外部的至少一个连接元件。 连接元件具有第一接触装置，弹性部分和第二接触装置。 压力构件具有两个止动元件。 第一接触器件与衬底的接触表面导电连接。 第二接触装置的形状为弧形，并且在电弧的开始和结束处具有至少一个变形，其中，作为与压力构件的两个止动元件配合的第二接触装置的变形的结果 ，连接元件是预应力的。

公开(公告)号：US07944701B2

公开(公告)日：2011-05-17

申请号：US12069777

申请日：2008-02-13

Applicant: Rainer Popp ,  Marco Lederer

Inventor： Rainer Popp ,  Marco Lederer

IPC: H05K5/00

CPC classification number: H01L25/072 ,  H01L23/10 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A housing for a power semiconductor module in which load-connecting elements having contact devices are arranged. The contact devices are arranged in housing troughs on the exterior of the housing. The housing troughs are formed at an associated lateral wall of the housing. The housing is closed off by a cover. The housing is preferably formed as a unitary piece of material having a circumferential sealing frame and the cover includes an outer rim that extends over the circumferential sealing frame, to prevent the penetration of fluid or moisture into the power semiconductor module when the cover is closed. On its inner rim, each housing trough includes a sealing rib formed of a section of the sealing frame. The associated load-connecting element is crimped about the sealing rib, so that the contact device is disposed within the trough.

Abstract translation: 一种用于功率半导体模块的壳体，其中布置有具有接触装置的负载连接元件。 接触装置布置在壳体外部的壳体槽中。 壳体槽形成在壳体的相关侧壁处。 外壳由盖子封闭。 壳体优选地形成为具有周向密封框架的整体材料，并且盖包括在周向密封框架上延伸的外边缘，以防止当盖关闭时流体或湿气渗透到功率半导体模块中。 在其内缘上，每个壳体槽包括由密封框架的一部分形成的密封肋。 相关联的负载连接元件围绕密封肋压接，使得接触装置设置在槽内。