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    Stacked wafer-level packaging devices
    2.
    发明授权
    Stacked wafer-level packaging devices 有权

    公开(公告)号：US10396753B2

    公开(公告)日：2019-08-27

    申请号：US15602008

    申请日：2017-05-22

    Applicant: SKYWORKS SOLUTIONS, INC.

    Inventor： Russ Alan Reisner ,  John C. Baldwin

    IPC: H01L23/31 ,  H03H9/05 ,  H01L23/552 ,  H01L25/065 ,  H01L23/66 ,  H01L23/498 ,  H03H9/46 ,  H01L23/00 ,  H04B1/48 ,  H04B1/04 ,  H04B1/16 ,  H03H9/70 ,  H03H9/72 ,  H01L25/16

    Abstract: Stacked wafer-level packaging devices. In some embodiments, a wireless device includes a transceiver configured to generate a radio-frequency (RF) signal. The wireless device also includes a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device. The wireless devices further includes an antenna in communication with the front-end module, the antenna configured to transmit the amplified radio-frequency signal.

    Apparatus for minimizing electromagnetic coupling between surface mount device inductors
    3.
    发明授权
    Apparatus for minimizing electromagnetic coupling between surface mount device inductors 有权

    公开(公告)号：US12191932B2

    公开(公告)日：2025-01-07

    申请号：US18146213

    申请日：2022-12-23

    Applicant: Skyworks Solutions, Inc.

    Inventor： John C. Baldwin ,  Weimin Sun

    IPC: H04B5/26 ,  H01F27/28 ,  H01F27/32 ,  H01F27/36 ,  H05K1/02

    Abstract: A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The surface mount device inductor includes an inductor coil, an anode structure disposed over a first end of the inductor coil and a cathode structure disposed over a second end of the inductor coil opposite the first end, the cathode structure being spaced apart from the anode structure. One or both of the anode structure and the cathode structure comprise a shield portion disposed at least partially over the inductor coil to thereby reduce electromagnetic coupling between adjacent surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.

    Circuits and methods related to radio-frequency power couplers
    10.
    发明授权
    Circuits and methods related to radio-frequency power couplers 有权

    公开(公告)号：US09954562B2

    公开(公告)日：2018-04-24

    申请号：US14967715

    申请日：2015-12-14

    Applicant: SKYWORKS SOLUTIONS, INC.

    Inventor： Russ Alan Reisner ,  John C. Baldwin

    IPC: H04B1/04 ,  H04B1/00

    CPC classification number: H04B1/04 ,  H04B1/006 ,  H04B1/0458

    Abstract: Circuits and methods related to radio-frequency (RF) power couplers. In some embodiments, an RF circuit can include a first circuit having a frequency response that includes a feature within a selected frequency range, and a second circuit coupled to the first circuit such that the feature of the frequency response is at least in part due to the coupling. The RF circuit can further include an adjustment circuit configured to move the feature away from the selected frequency range. In some embodiments, such an RF circuit can be implemented in a packaged module which in turn can be included in a wireless device.

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