公开(公告)号：US11765814B2

公开(公告)日：2023-09-19

申请号：US16558056

申请日：2019-08-31

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis Darveaux ,  Ki Wook Lee ,  Takeshi Furusawa ,  Sundeep Nand Nangalia ,  Russ Alan Reisner ,  John C. Baldwin

IPC: H05K1/02 ,  H05K1/18 ,  H01Q1/22 ,  H05K1/11 ,  H04B1/10

CPC classification number: H05K1/0243 ,  H01Q1/2283 ,  H04B1/10 ,  H05K1/113 ,  H05K1/183 ,  H05K2201/10098

Abstract: Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

公开(公告)号：US20230245985A1

公开(公告)日：2023-08-03

申请号：US18162419

申请日：2023-01-31

Applicant: Skyworks Solutions, Inc.

Inventor： Sundeep Nand Nangalia ,  Reza Kasnavi ,  William Gerard Vaillancourt ,  Gregory Edward Babcock

IPC: H01L23/60 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/60 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838

Abstract: An electronics package for use in a module of an electronic device has a die, and a substrate disposed under and attached to the die. The substrate includes one or more redistribution layers. A plurality of interconnect members are disposed under and attached to the substrate, the interconnect members electrically connected to the die via the redistribution layers in the substrate. A metal shield is disposed over and enclosing the die, the metal shield in contact with a peripheral boundary of the substrate and connected to ground via the redistribution layers and plurality of interconnect members, the metal shield configured to shield the die from stray power and electromagnetic radiation.

公开(公告)号：US20230245979A1

公开(公告)日：2023-08-03

申请号：US18162493

申请日：2023-01-31

Applicant: Skyworks Solutions, Inc.

Inventor： Sundeep Nand Nangalia ,  Reza Kasnavi ,  William Gerard Vaillancourt ,  Gregory Edward Babcock

IPC: H01L23/552 ,  H01L23/538 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/5389 ,  H01L23/66 ,  H01L2223/6677

Abstract: An electronics package for use in a module of an electronic device has a die, and a plurality of interconnect members disposed under the die. A seal ring extends along an outer boundary of the die. A metal shield is disposed over the die, the metal shield in contact with a peripheral boundary of the die and connected to ground via the seal ring and the plurality of interconnect members. The metal shield shields the die from stray power and electromagnetic radiation.

公开(公告)号：US20230245978A1

公开(公告)日：2023-08-03

申请号：US18162481

申请日：2023-01-31

Applicant: Skyworks Solutions, Inc.

Inventor： Sundeep Nand Nangalia ,  Reza Kasnavi ,  William Gerard Vaillancourt ,  Gregory Edward Babcock

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/498 ,  H01L23/36

CPC classification number: H01L23/552 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49816 ,  H01L23/36

Abstract: An electronics package for use in a module of an electronic device has a die, and a plurality of interconnect members disposed under the die. One or more vias extend through the die and electrically connect to the interconnect members. A metal shield is disposed over the die. The metal shield is in contact with a peripheral boundary of the die and connected to ground with the vias and the interconnect members. The metal shield shields the die from stray power and electromagnetic radiation.