-
公开(公告)号：US12142842B2
公开(公告)日：2024-11-12
申请号：US17653694
申请日：2022-03-07
Applicant: Skyworks Solutions, Inc.
Inventor： Weimin Sun
Abstract: Antenna arrays with separate resonances and termination networks for multiple millimeter wave frequency bands are provided herein. In certain embodiments, an antenna array includes a first antenna element that receives the first radio frequency transmit signal at an input. The first antenna element has a first resonant mode and a second resonant mode. The antenna array further includes a first termination network connected to the input of the first antenna element and a second termination network connected to the input of the first antenna element.
-
公开(公告)号：US20230318568A1
公开(公告)日：2023-10-05
申请号：US18125280
申请日：2023-03-23
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Hai H. Ta , Shihan Qin , Nicholas Quinn Muhlmeyer , Weimin Sun
CPC classification number: H03H9/542 , H04B1/0057
Abstract: An acoustic wave filter assembly having reduced on-die capacitance and improved isolation for high-frequency applications. The acoustic wave filter assembly includes a filter port, an antenna port, an acoustic wave filter connected between the filter port and the antenna port, one or more ground pins connected between the filter port and the antenna port, and a metallic guard ring extending around the acoustic wave filter assembly. At least one of the one or more ground pins is connected to the metallic guard ring. A diplexer, multiplexer, radio-frequency module and wireless device are also provided.
-
公开(公告)号：US11652453B2
公开(公告)日：2023-05-16
申请号：US17114394
申请日：2020-12-07
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Hanseung Lee , Dongjin Jung , Weimin Sun
CPC classification number: H03F3/245 , H03F1/0288 , H03F3/195 , H03F3/72 , H03F2200/09 , H03F2200/451
Abstract: Systems, methods, and devices relate to tunable baluns for multimode power amplification. For example, a variable-gain amplification system can include a power amplifier configured to provide an amplified signal and to selectively operate in at least a first gain mode and a second gain mode. The variable-gain amplification system can also include a tunable balun circuit configured to receive the amplified signal from the power amplifier and to provide an output signal. The tunable balun circuit can be configured to implement a first turn ratio for the first gain mode and a second turn ratio for the second gain mode.
-
公开(公告)号：US20220255524A1
公开(公告)日：2022-08-11
申请号：US17660715
申请日：2022-04-26
Applicant: Skyworks Solutions, Inc.
Inventor： Hai H. Ta , Weimin Sun
Abstract: Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.
-
公开(公告)号：US20210058051A1
公开(公告)日：2021-02-25
申请号：US16984666
申请日：2020-08-04
Applicant: Skyworks Solutions, Inc.
Inventor： Hai H. Ta , Weimin Sun
Abstract: Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.
-
Patent Agency Ranking
公开(公告)号：US10892715B2
公开(公告)日：2021-01-12
申请号：US16874397
申请日：2020-05-14
Applicant: Skyworks Solutions, Inc.
Inventor： Bo Pan , Aleksey A. Lyalin , Weimin Sun , Philip John Lehtola
Abstract: Wideband power combiners and splitters are provided herein. In certain embodiments, a power combiner/splitter is implemented with a first coil connecting a first port and a second port, and a second coil connecting a third port and a fourth port. The first coil and the second coil are inductively coupled to one another. For example, the first coil and the second coil can be formed using adjacent conductive layers of a semiconductor chip, an integrated passive device, or a laminate. The power combiner/splitter further includes a fifth port tapping a center of the first coil and a sixth port tapping a center of the second coil. The fifth port and the sixth port serve to connect capacitors and/or other impedance to the center of the coils to thereby provide wideband operation.
-
公开(公告)号：US20200228085A1
公开(公告)日：2020-07-16
申请号：US16742345
申请日：2020-01-14
Applicant: SKYWORKS SOLUTIONS, INC.
Inventor： Dongjin Jung , Hanseung Lee , Weimin Sun
Abstract: Examples of a capacitive-coupled bandpass filter include a plurality of coupling capacitors connected in series along a signal path extending between an input contact and an output contact, a first harmonic suppression notch circuit configured to provide a first harmonic suppression notch in a frequency response of the capacitive-coupled bandpass filter, and a second harmonic suppression notch circuit configured to provide a second harmonic suppression notch in the frequency response of the capacitive-coupled bandpass filter. The first harmonic suppression notch circuit includes a first pair of series L/C resonators connected in shunt between the signal path and a reference potential, and the second harmonic suppression notch circuit includes a second pair of series L/C resonators connected in shunt between the signal path and the reference potential.
-
公开(公告)号：US10553570B2
公开(公告)日：2020-02-04
申请号：US15960199
申请日：2018-04-23
Applicant: Skyworks Solutions, Inc.
Inventor： David Penunuri , Weimin Sun , Russ Alan Reisner
Abstract: In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.
-
公开(公告)号：US20190165752A1
公开(公告)日：2019-05-30
申请号：US16201246
申请日：2018-11-27
Applicant: Skyworks Solutions, Inc.
Inventor： Hai H. Ta , Weimin Sun
Abstract: Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.
-
公开(公告)号：US10090812B2
公开(公告)日：2018-10-02
申请号：US15482321
申请日：2017-04-07
Applicant: Skyworks Solutions, Inc.
Inventor： Hardik Bhupendra Modi , Sandra Louise Petty-Weeks , Hongxiao Shao , Weimin Sun , Peter J. Zampardi, Jr. , Guohao Zhang
IPC: H03F3/14 , H03F3/213 , H01L29/20 , H01L23/498 , H01L21/48 , H01L29/08 , H01L23/31 , H01L21/8249 , H01L21/78 , H01L21/56 , H01L21/66 , H01L23/48 , H01L21/768 , H03F3/19 , H03F3/24 , H01L29/36 , H01L29/66 , H01L29/812 , H01L29/205 , H01L21/8252 , H01L27/06 , H01L23/552 , H01L23/66 , H01L23/00 , H01L23/50 , H03F3/195 , H03F3/60 , H03F1/02 , H03F3/21 , H03F3/45 , H01L29/737 , H01L29/06 , H01L29/10 , H01L29/8605 , H01L27/092 , H03F3/187 , H03F3/347
Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier die, a first bonding pad on a conductive trace, and a second bonding pad on a conductive trace. The die includes an on-die passive device and a power amplifier. The first bonding pad is electrically connected to the on-die passive device by a first wire bond. The second bonding pad is in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module. The second bonding pad includes a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to a second wire bond that is electrically connected to an output of the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.
-
-
-
-
-
-
-
-
-
Search Results
87
records
(took 0.032 seconds)
