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公开(公告)号：US4579755A
公开(公告)日：1986-04-01
申请号：US650539
申请日：1984-09-14
Applicant: Shinji Takeda , Nobutoshi Hase
Inventor： Shinji Takeda , Nobutoshi Hase
IPC: B29C35/12 , B29C65/00 , B29C65/04 , B29C65/46 , B29C67/00 , B29C69/00 , B29C70/68 , B60R13/04 , B60R13/00
CPC classification number: B29C69/001 , B29C35/12 , B29C47/003 , B29C65/04 , B29C65/46 , B29C66/474 , B29C66/731 , B29C66/73143 , B29C66/73921 , B29C66/8322 , B29C67/0044 , B29C70/68 , B60R13/04 , B29C2793/00 , B29C47/02 , B29C66/71 , B29C66/73115 , B29K2027/06 , B29K2059/00 , B29K2067/00 , B29K2067/006 , B29K2083/00 , B29K2995/0006 , B29K2995/0046 , B29L2007/007 , B29L2031/302 , B29L2031/3055 , Y10S264/46
Abstract: Decorative moldings with nonuniform sections made of thermoplastic resin is produced by remolding. The material to be remolded is formed by cutting an extruded rod or combining an extruded rod with other parts and placed in a mold. The material in the mold is heated and fused partially by high frequency dielectric heating. Then the fused portion of the material is cooled in the mold so that the material is partially remolded.
Abstract translation: 由热塑性树脂制成的具有不均匀部分的装饰模制品通过重塑制备。 要重新塑造的材料通过切割挤出的棒或将挤出的杆与其它部件组合并且放置在模具中而形成。 模具中的材料通过高频介电加热被部分加热和熔化。 然后将材料的熔融部分在模具中冷却，使得材料被部分重塑。
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2.发明授权
公开(公告)号：US4489019A
公开(公告)日：1984-12-18
申请号：US448343
申请日：1982-12-09
Applicant: Shinji Takeda , Nobutoshi Hase
Inventor： Shinji Takeda , Nobutoshi Hase
IPC: B29C35/12 , B29C65/00 , B29C65/04 , B29C65/46 , B29C67/00 , B29C69/00 , B29C70/68 , B60R13/04 , B29H5/26
CPC classification number: B29C69/001 , B29C35/12 , B29C47/003 , B29C65/04 , B29C65/46 , B29C66/474 , B29C66/731 , B29C66/73143 , B29C66/73921 , B29C66/8322 , B29C67/0044 , B29C70/68 , B60R13/04 , B29C2793/00 , B29C47/02 , B29C66/71 , B29C66/73115 , B29K2027/06 , B29K2059/00 , B29K2067/00 , B29K2067/006 , B29K2083/00 , B29K2995/0006 , B29K2995/0046 , B29L2007/007 , B29L2031/302 , B29L2031/3055 , Y10S264/46
Abstract: Decorative moldings with non-uniform sections made of thermoplastic resin are produced by remolding. The material to be remolded is formed by cutting an extruded rod or combining an extruded rod with other parts and being placed in a mold. The material in the mold is heated and partially fused by high frequency dielectric heating. Then the fused portion of the material is cooled in the mold so that the material is partially remolded.
Abstract translation: 由热塑性树脂制成的具有不均匀部分的装饰模制品通过重塑制造。 要重新塑造的材料通过切割挤出的棒或将挤出的杆与其它部件组合并且被放置在模具中而形成。 通过高频介电加热将模具中的材料加热并部分熔融。 然后将材料的熔融部分在模具中冷却，使得材料被部分重塑。
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公开(公告)号：US08835553B2
公开(公告)日：2014-09-16
申请号：US13266021
申请日：2010-06-30
Applicant: Shinji Takeda , Masafumi Achiwa , Hiroyuki Noguchi , Akemi Kouketsu , Katsunobu Mochizuki
Inventor： Shinji Takeda , Masafumi Achiwa , Hiroyuki Noguchi , Akemi Kouketsu , Katsunobu Mochizuki
IPC: C09D133/20 , C09D133/04 , C08K3/30 , C08K3/34 , C08K3/26 , C08F220/10 , C08F220/42 , C08F220/20 , C09D7/12 , C09D133/10 , C09D133/06 , C08K7/22 , C08F220/18
CPC classification number: C09D133/06 , C08F2220/185 , C08K7/22 , C09D7/61 , C09D7/70 , C09D133/10 , Y10T428/269 , C08F2220/1858 , C08F220/44 , C08F2220/302 , C08F220/06 , C08F212/08
Abstract: A coating composition has excellent application workability, facilitates thick coating, rarely causes cracks at an initial drying stage, and provides a dried film having excellent tensile properties and adhesiveness. The composition contains an aggregate and an emulsion with a polymer particle dispersed in an aqueous medium. The polymer particle includes 40% to 98% of a unit formed by polymerizing an alkyl(meth)acrylate monomer, the alkyl group having 4 to 14 carbon atoms, 0.1% to 5% of a unit formed by polymerizing an ethylenically unsaturated carboxylic acid monomer, 1% to 20% of a unit formed by polymerizing a vinyl monomer having a cyano group, 1% to 20% of a unit formed by polymerizing a reaction product of a (meth)acrylic acid and a monofunctional epoxy compound, and 0% to 50% of a unit formed by copolymerizing at least one of the above monomers with another monomer.
Abstract translation: 涂料组合物具有优异的应用可加工性，便于厚涂层，在初始干燥阶段很少引起裂纹，并提供具有优异的拉伸性能和粘合性的干燥膜。 该组合物含有聚集体和分散在水性介质中的聚合物颗粒的乳液。 聚合物颗粒包含通过聚合（甲基）丙烯酸烷基酯单体，具有4至14个碳原子的烷基，通过聚合烯键式不饱和羧酸单体形成的单元的0.1％至5％形成的单元的40％至98％ ，通过使具有氰基的乙烯基单体聚合形成的单元的1〜20％，通过聚合（甲基）丙烯酸和单官能环氧化合物的反应产物而形成的单元的1〜20％，以及0％ 至50％的单体与至少一种上述单体共聚形成的单元。
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公开(公告)号：US08233443B2
公开(公告)日：2012-07-31
申请号：US11908307
申请日：2006-03-03
Applicant: Hidenori Aoki , Kengo Yagyu , Shinji Takeda , Atsushi Fujiwara , Yoichi Matsumoto
Inventor： Hidenori Aoki , Kengo Yagyu , Shinji Takeda , Atsushi Fujiwara , Yoichi Matsumoto
IPC: H04W4/00
Abstract: A wireless communication apparatus is provided. The wireless communication apparatus includes: detection means that detects that there is another wireless communication apparatus around the wireless communication apparatus; comparison means that compares a first reference value managed in the wireless communication apparatus with a second reference value managed in the another wireless communication apparatus; means that corrects the first reference value based on the comparison result; and means that announces the first reference value to the another wireless communication apparatus. Frequencies are set such that a frequency of the wireless communication apparatus becomes same as a frequency of still another wireless communication apparatus to which a radio wave of the wireless communication apparatus does not reach but a radio wave of the another wireless communication apparatus reaches.
Abstract translation: 提供一种无线通信装置。 无线通信装置包括：检测装置，用于检测在无线通信装置周围有另一无线通信装置; 比较装置将在无线通信装置中管理的第一参考值与在另一无线通信装置中管理的第二参考值进行比较; 意味着根据比较结果校正第一个参考值; 以及向另一无线通信装置通知第一参考值的装置。 频率被设置为使得无线通信装置的频率变得与无线通信装置的无线电波未到达的另一无线通信装置的频率相同，但是另一无线通信装置的无线电波达到的频率相同。
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5.发明授权公开(公告)号：US07881660B2
公开(公告)日：2011-02-01
申请号：US11697481
申请日：2007-04-06
Applicant: Shinji Takeda , Atsushi Fujiwara , Hitoshi Yoshino , Toru Otsu , Yasushi Yamao
Inventor： Shinji Takeda , Atsushi Fujiwara , Hitoshi Yoshino , Toru Otsu , Yasushi Yamao
IPC: H04B7/15
CPC classification number: H04W40/12 , H04B7/2606 , H04L45/00 , H04L45/122 , H04L45/125 , H04L45/20 , H04L45/302 , H04W40/08 , H04W40/16 , H04W40/22 , H04W52/46 , H04W72/08 , H04W84/18 , H04W88/02 , Y02D70/324 , Y02D70/34 , Y02D70/39 , Y02D70/449
Abstract: A mobile communication system determines a communication path to implement fast communication by multihop connection. A mobile communication system includes a mobile station, at least one relay station, and a base station and implements packet transmission from the mobile station to the base station through a communication path with an intermediary of at least one relay station or through a communication path without an intermediary of a relay station. The mobile communication system is provided with a communication path determiner for determining a communication path with a largest communication speed or a communication path satisfying a required line quality, based on interference levels of respective signals received at a relay station constituting a communication path between the transmitting station and the receiving station, and at the base station.
Abstract translation: 移动通信系统确定通过多跳连接实现快速通信的通信路径。 移动通信系统包括移动站，至少一个中继站和基站，并且通过与至少一个中继站或通过通信路径的通信路径实现从移动站到基站的分组传输，而没有 中继站的中介。 移动通信系统具有通信路径确定器，用于基于在构成发送端之间的通信路径的中继站处接收到的各信号的干扰电平，确定具有最大通信速度的通信路径或满足所需线路质量的通信路径 站和接收站，并在基站。
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Patent Agency Ranking
公开(公告)号：US07876619B2
公开(公告)日：2011-01-25
申请号：US12368667
申请日：2009-02-10
Applicant: Shinji Takeda , Yoshiharu Hirata
Inventor： Shinji Takeda , Yoshiharu Hirata
CPC classification number: G11C16/0483 , G11C16/10
Abstract: A semiconductor memory device comprises: a write circuit including a latch circuit configured by two inverters having a positive side power supply terminal supplied with a first voltage and a negative side power supply terminal supplied with a second voltage; and a write state machine controlling the first and second voltages. When writing data to a memory cell, the first voltage is changed to a second value that is lower than a first value. When writing data to a memory cell, the second voltage is changed to a third value that is lower than the second value. The write state machine lowers the second voltage to an intermediate value between the second value and the third value and, while maintaining this intermediate value, lowers the first voltage from the first value to the second value.
Abstract translation: 一种半导体存储器件，包括：写入电路，包括由具有提供有第一电压的正侧电源端子和被提供有第二电压的负侧电源端子的两个反相器构成的锁存电路; 以及控制第一和第二电压的写状态机。 当将数据写入存储单元时，将第一电压改变为低于第一值的第二值。 当将数据写入存储单元时，第二电压被改变为低于第二值的第三值。 写状态机将第二电压降低到第二值和第三值之间的中间值，并且在保持该中间值的同时，将第一电压从第一值降低到第二值。
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公开(公告)号：US07586894B2
公开(公告)日：2009-09-08
申请号：US11059685
申请日：2005-02-17
Applicant: Hidenori Aoki , Shinji Takeda , Kengo Yagyu , Narumi Umeda
Inventor： Hidenori Aoki , Shinji Takeda , Kengo Yagyu , Narumi Umeda
IPC: H04J3/24
CPC classification number: H04W40/02
Abstract: A communication apparatus is disclosed, which includes an information collection unit, a storage unit, a selection unit, and a route control unit. The information collection unit is configured to collect route information and condition information. The storage unit is configured to store the route information and the connection information. The selection unit is configured to select a connection apparatuses for a terminal apparatus based on the route information and the connection information. The route control unit is configured to control routes from the communication apparatus to the connection apparatus.
Abstract translation: 公开了一种通信装置，其包括信息收集单元，存储单元，选择单元和路由控制单元。 信息收集单元被配置为收集路线信息和条件信息。 存储单元被配置为存储路由信息和连接信息。 选择单元被配置为基于路线信息和连接信息来选择终端装置的连接装置。 路由控制部被配置为控制从通信装置到连接装置的路径。
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公开(公告)号：US07057265B2
公开(公告)日：2006-06-06
申请号：US10428126
申请日：2003-05-02
Applicant: Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
Inventor： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC: H01L23/495 , H01L29/40
CPC classification number: H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
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公开(公告)号：US20060051762A1
公开(公告)日：2006-03-09
申请号：US10527805
申请日：2003-09-12
Applicant: Bunichirou Nakajima , Shinji Takeda , Takeshi Sawazaki , Baku Maekawa , Kunihiro Suto
Inventor： Bunichirou Nakajima , Shinji Takeda , Takeshi Sawazaki , Baku Maekawa , Kunihiro Suto
CPC classification number: G01N33/54366 , G01N33/54393
Abstract: The object of the present invention is to provide an immobilization support having an optimum support surface for immobilizing various types of materials having different properties with specificity, efficiency, and good reproducibility, and to provide a solid phase having improved characteristics by use of the above support. The immobilization support of the present invention is provided with an electrolyte thin film on the surface of the support. This immobilization support can be applied to the fabrication of a solid phase used in, for example, an antigen-antibody reaction, nucleic acid hybridization, a receptor assay, or a biosensor.
Abstract translation: 本发明的目的是提供具有最佳支撑表面的固定支撑件，用于固定具有不同特性，特异性，效率和良好再现性的各种类型的材料，并且通过使用上述支撑物提供具有改善特性的固相 。 本发明的固定支撑件在支撑体的表面上设置有电解质薄膜。 该固定化载体可用于制造用于例如抗原 - 抗体反应，核酸杂交，受体测定或生物传感器中的固相。
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公开(公告)号：US20060019673A1
公开(公告)日：2006-01-26
申请号：US11175318
申请日：2005-07-07
Applicant: Kengo Yagyu , Shinji Takeda , Koji Omae , Hidenori Aoki , Atsushi Fujiwara , Yoichi Matsumoto
Inventor： Kengo Yagyu , Shinji Takeda , Koji Omae , Hidenori Aoki , Atsushi Fujiwara , Yoichi Matsumoto
IPC: H04Q7/20
CPC classification number: H04W72/08 , H04L45/46 , H04W72/0426 , H04W88/08
Abstract: A channel allocation method for dynamically allocating channels of a plurality of radio interfaces at each access point included in a mesh network is provided. The method includes the steps of (a) acquiring, at each access point, in-node information about the access point itself, and (b) grouping high-traffic access points in a cluster using a same channel set based on the acquired information.
Abstract translation: 提供了一种用于在网状网络中包括的每个接入点动态分配多个无线电接口的信道的信道分配方法。 该方法包括以下步骤：（a）在每个接入点处获取关于接入点本身的节点内信息，以及（b）使用基于所获取的信息的相同信道集合对群中的高流量接入点进行分组。
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