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公开(公告)号：US10125931B2
公开(公告)日：2018-11-13
申请号：US14071636
申请日：2013-11-04
IPC分类号： F21V29/00 , F21S8/02 , F21V7/00 , F21V29/506 , H01L33/64 , H01L23/00 , F21V29/70 , F21V29/503 , E04B9/04 , F21V25/12 , E04B9/00 , E04B9/18 , E04B9/24 , H01L33/50 , F21V33/00 , F21Y115/10
摘要： An integrated barrier or partition (e.g. suspended ceiling, wall, etc.) containing lightweight solid state light sources wherein the light emitting surface of the light sources are the primary heat dissipating surfaces of the light sources. The light sources consisting of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting surfaces, eliminating the need for external appended heat sinks. Seismically safe suspended ceilings contain integrated lighting where the lighting adds less than one gram per square foot to the structure. The lighting, integrated into but without penetrating the barrier (suspended ceiling, ceiling, wall, floor, etc.), is nonflammable and does not promote flame spread or smoke generation. The lighting is easily incorporated into ceiling tiles, sheetrock, grid elements, painted and/or wallpapered surfaces.
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公开(公告)号：US09243782B2
公开(公告)日：2016-01-26
申请号：US14052567
申请日：2013-10-11
IPC分类号： H01L33/50 , F21V13/08 , F21K99/00 , F21S9/03 , F21V9/08 , F21V21/096 , F21S9/02 , F21V29/505 , F21V29/83 , H01L33/64 , H01L33/60 , F21V29/00 , F21V29/54
CPC分类号： F21V13/08 , F21K9/00 , F21K9/64 , F21K9/68 , F21S9/02 , F21S9/03 , F21V9/08 , F21V21/096 , F21V29/505 , F21V29/51 , F21V29/54 , F21V29/83 , H01L33/507 , H01L33/60 , H01L33/642 , H01L33/648 , H01L2924/0002 , Y02B10/10 , H01L2924/00
摘要： Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.
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3.发明授权公开(公告)号：US09214616B2
公开(公告)日：2015-12-15
申请号：US14472993
申请日：2014-08-29
IPC分类号： H01L31/0232 , H01L33/64 , H01L33/08 , H01L33/50 , H01L23/00 , H01L27/15 , H01L33/32 , H01L33/58 , H01L33/60
CPC分类号： H01L33/642 , H01L24/73 , H01L27/15 , H01L33/08 , H01L33/32 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/58 , H01L33/60 , H01L33/64 , H01L33/641 , H01L33/644 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/8592 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.
摘要翻译： 基于安装在导热发光元件上或内部的LED的固态光源提供对流和辐射冷却。 低成本自冷固体光源可以集成LED和其他半导体器件的电气互连。 导热发光元件可以完全或部分地消除对任何额外的散热装置的需要，通过在足够大的区域上有效地传输和展开在LED和发光元件本身中产生的热量，使得可以使用对流和辐射装置来冷却 设备。
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公开(公告)号：US20150329988A1
公开(公告)日：2015-11-19
申请号：US14814440
申请日：2015-07-30
IPC分类号： C30B25/18 , C30B25/06 , C30B23/08 , C30B23/02 , C30B19/12 , C30B29/40 , C30B29/06 , C30B29/08 , C30B29/52 , C30B29/42 , C30B29/16 , H01L31/0304 , H01L31/028 , H01L31/0296 , H01L31/036 , H01L31/0693 , H01L31/0687 , H01L31/0735 , H01L31/074 , H01L31/0725 , H01L31/18 , H01L33/00 , C30B25/10
CPC分类号： C30B25/186 , C30B19/12 , C30B23/025 , C30B23/08 , C30B25/02 , C30B25/06 , C30B25/105 , C30B29/06 , C30B29/08 , C30B29/16 , C30B29/40 , C30B29/403 , C30B29/406 , C30B29/42 , C30B29/52 , H01L31/028 , H01L31/0296 , H01L31/0304 , H01L31/03044 , H01L31/036 , H01L31/0547 , H01L31/0687 , H01L31/0693 , H01L31/0725 , H01L31/0735 , H01L31/074 , H01L31/18 , H01L31/1804 , H01L31/1808 , H01L31/1812 , H01L31/184 , H01L31/1844 , H01L31/1848 , H01L31/1856 , H01L31/1892 , H01L33/0054 , H01L33/0062 , H01L33/0075 , H01L33/0083 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T428/31678
摘要： Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging.
摘要翻译： 薄的独立氮化物薄板可用于制造半导体器件。 这些单板通常小于100微米厚。 使用薄的单板也消除了随后的晶片变薄以改善热性能和3D封装的需要。
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5.发明申请公开(公告)号：US20140061707A1
公开(公告)日：2014-03-06
申请号：US14071609
申请日：2013-11-04
CPC分类号： H01L33/642 , H01L24/73 , H01L27/15 , H01L33/08 , H01L33/32 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/58 , H01L33/60 , H01L33/64 , H01L33/641 , H01L33/644 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/8592 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.
摘要翻译： 基于安装在导热发光元件上或内部的LED的固态光源提供对流和辐射冷却。 低成本自冷固体光源可以集成LED和其他半导体器件的电气互连。 导热发光元件可以完全或部分地消除对任何额外的散热装置的需要，通过在足够大的区域上有效地传输和展开在LED和发光元件本身中产生的热量，使得可以使用对流和辐射装置来冷却 设备。
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公开(公告)号：US20130019927A1
公开(公告)日：2013-01-24
申请号：US13555082
申请日：2012-07-21
CPC分类号： C30B25/186 , C30B19/12 , C30B23/025 , C30B23/08 , C30B25/02 , C30B25/06 , C30B25/105 , C30B29/06 , C30B29/08 , C30B29/16 , C30B29/40 , C30B29/403 , C30B29/406 , C30B29/42 , C30B29/52 , H01L31/028 , H01L31/0296 , H01L31/0304 , H01L31/03044 , H01L31/036 , H01L31/0547 , H01L31/0687 , H01L31/0693 , H01L31/0725 , H01L31/0735 , H01L31/074 , H01L31/18 , H01L31/1804 , H01L31/1808 , H01L31/1812 , H01L31/184 , H01L31/1844 , H01L31/1848 , H01L31/1856 , H01L31/1892 , H01L33/0054 , H01L33/0062 , H01L33/0075 , H01L33/0083 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T428/31678
摘要： Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging.
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公开(公告)号：US20120261703A1
公开(公告)日：2012-10-18
申请号：US13506015
申请日：2012-03-21
CPC分类号： H01L33/502 , F21V23/0471 , H01L33/507 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A self-cooling emitter is a light emitting element embedded within a thermally conductive luminescent element which functions as a thermal cooling means and wavelength conversion of the light emitting element. The thermally conductive luminescent element exhibits a bulk thermal conductivity greater than 1 W/m/K such that there is sufficient thermal spreading of the heat generated by the light emitting element.
摘要翻译： 自冷却发射器是嵌入在导热发光元件内的发光元件，其用作发热元件的热冷却装置和波长转换。 导热发光元件表现出大于1W / m / K的体热导率，使得由发光元件产生的热量具有足够的热扩散。
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公开(公告)号：US20120063137A1
公开(公告)日：2012-03-15
申请号：US13200896
申请日：2011-10-03
CPC分类号： H01L25/075 , H01L33/483 , H01L2924/0002 , H01L2924/00
摘要： LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity.
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公开(公告)号：US20090173954A1
公开(公告)日：2009-07-09
申请号：US12317635
申请日：2008-12-23
CPC分类号： H01L25/0753 , H01L31/042 , H01L33/54 , H01L33/62 , H01L2224/48091 , Y02E10/50 , H01L2924/00014
摘要： A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.
摘要翻译： 无衬底的半导体片材具有分散在基体材料中的半导体元件阵列。 基体材料结合到半导体元件的边缘表面，并且无衬底的半导体片材具有与半导体元件基本相同的厚度。
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10.发明授权Flexible semiconductor devices based on flexible freestanding epitaxial elements 有权基于柔性独立外延元件的柔性半导体器件公开(公告)号：US09171909B2
公开(公告)日：2015-10-27
申请号：US14159430
申请日：2014-01-20
CPC分类号： H01L29/2003 , C30B25/18 , H01L21/2007 , H01L31/0392 , H01L31/03926 , H01L31/1836 , H01L31/1852 , H01L33/007 , H01L33/32 , H01L2224/48091 , H01L2924/00014 , Y02E10/544 , H01L2224/45099
摘要： Flexible semiconductor devices based on flexible freestanding epitaxial elements are disclosed. The flexible freestanding epitaxial elements provide a virgin as grown epitaxy ready surface for additional growth layers. These flexible semiconductor devices have reduced stress due to the ability to flex with a radius of curvature less than 100 meters. Low radius of curvature flexing enables higher quality epitaxial growth and enables 3D device structures. Uniformity of layer formation is maintained by direct absorption of actinic radiation by the flexible freestanding epitaxial element within a reactor. In addition, standard post processing steps like lithography are enabled by the ability of the devices and elements to be flattened using a secondary support element or vacuum. Finished flexible semiconductor devices can be flexed to a radius of curvature of less than 100 meters. Nitrides, Zinc Oxides, and their alloys are preferred materials for the flexible freestanding epitaxial elements.
摘要翻译： 公开了基于柔性独立外延元件的柔性半导体器件。 灵活的独立外延元件为另外的生长层提供了作为生长的外延准备表面的处女。 这些柔性半导体器件由于曲率半径小于100米的弯曲能力而具有减小的应力。 曲率半径弯曲可实现更高质量的外延生长，并可实现3D器件结构。 通过在反应器内由柔性独立外延元件直接吸收光化辐射来保持层形成的均匀性。 此外，通过使用次要支撑元件或真空将装置和元件平坦化的能力实现如光刻的标准后处理步骤。 成品的柔性半导体器件可以弯曲到小于100米的曲率半径。 氮化物，氧化锌及其合金是用于柔性独立外延元件的优选材料。
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