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公开(公告)号：US10125931B2
公开(公告)日：2018-11-13
申请号：US14071636
申请日：2013-11-04
IPC分类号： F21V29/00 , F21S8/02 , F21V7/00 , F21V29/506 , H01L33/64 , H01L23/00 , F21V29/70 , F21V29/503 , E04B9/04 , F21V25/12 , E04B9/00 , E04B9/18 , E04B9/24 , H01L33/50 , F21V33/00 , F21Y115/10
摘要： An integrated barrier or partition (e.g. suspended ceiling, wall, etc.) containing lightweight solid state light sources wherein the light emitting surface of the light sources are the primary heat dissipating surfaces of the light sources. The light sources consisting of light emitting diodes (LED) in thermal contact to light transmitting thermally conductive elements and combined with a reflector element to form a light recycling cavity, provide both convective and radiative cooling from their light emitting surfaces, eliminating the need for external appended heat sinks. Seismically safe suspended ceilings contain integrated lighting where the lighting adds less than one gram per square foot to the structure. The lighting, integrated into but without penetrating the barrier (suspended ceiling, ceiling, wall, floor, etc.), is nonflammable and does not promote flame spread or smoke generation. The lighting is easily incorporated into ceiling tiles, sheetrock, grid elements, painted and/or wallpapered surfaces.
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公开(公告)号：US09243782B2
公开(公告)日：2016-01-26
申请号：US14052567
申请日：2013-10-11
IPC分类号： H01L33/50 , F21V13/08 , F21K99/00 , F21S9/03 , F21V9/08 , F21V21/096 , F21S9/02 , F21V29/505 , F21V29/83 , H01L33/64 , H01L33/60 , F21V29/00 , F21V29/54
CPC分类号： F21V13/08 , F21K9/00 , F21K9/64 , F21K9/68 , F21S9/02 , F21S9/03 , F21V9/08 , F21V21/096 , F21V29/505 , F21V29/51 , F21V29/54 , F21V29/83 , H01L33/507 , H01L33/60 , H01L33/642 , H01L33/648 , H01L2924/0002 , Y02B10/10 , H01L2924/00
摘要： Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.
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3.发明授权公开(公告)号：US09214616B2
公开(公告)日：2015-12-15
申请号：US14472993
申请日：2014-08-29
IPC分类号： H01L31/0232 , H01L33/64 , H01L33/08 , H01L33/50 , H01L23/00 , H01L27/15 , H01L33/32 , H01L33/58 , H01L33/60
CPC分类号： H01L33/642 , H01L24/73 , H01L27/15 , H01L33/08 , H01L33/32 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/58 , H01L33/60 , H01L33/64 , H01L33/641 , H01L33/644 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/8592 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.
摘要翻译： 基于安装在导热发光元件上或内部的LED的固态光源提供对流和辐射冷却。 低成本自冷固体光源可以集成LED和其他半导体器件的电气互连。 导热发光元件可以完全或部分地消除对任何额外的散热装置的需要，通过在足够大的区域上有效地传输和展开在LED和发光元件本身中产生的热量，使得可以使用对流和辐射装置来冷却 设备。
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公开(公告)号：US20150329988A1
公开(公告)日：2015-11-19
申请号：US14814440
申请日：2015-07-30
IPC分类号： C30B25/18 , C30B25/06 , C30B23/08 , C30B23/02 , C30B19/12 , C30B29/40 , C30B29/06 , C30B29/08 , C30B29/52 , C30B29/42 , C30B29/16 , H01L31/0304 , H01L31/028 , H01L31/0296 , H01L31/036 , H01L31/0693 , H01L31/0687 , H01L31/0735 , H01L31/074 , H01L31/0725 , H01L31/18 , H01L33/00 , C30B25/10
CPC分类号： C30B25/186 , C30B19/12 , C30B23/025 , C30B23/08 , C30B25/02 , C30B25/06 , C30B25/105 , C30B29/06 , C30B29/08 , C30B29/16 , C30B29/40 , C30B29/403 , C30B29/406 , C30B29/42 , C30B29/52 , H01L31/028 , H01L31/0296 , H01L31/0304 , H01L31/03044 , H01L31/036 , H01L31/0547 , H01L31/0687 , H01L31/0693 , H01L31/0725 , H01L31/0735 , H01L31/074 , H01L31/18 , H01L31/1804 , H01L31/1808 , H01L31/1812 , H01L31/184 , H01L31/1844 , H01L31/1848 , H01L31/1856 , H01L31/1892 , H01L33/0054 , H01L33/0062 , H01L33/0075 , H01L33/0083 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T428/31678
摘要： Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging.
摘要翻译： 薄的独立氮化物薄板可用于制造半导体器件。 这些单板通常小于100微米厚。 使用薄的单板也消除了随后的晶片变薄以改善热性能和3D封装的需要。
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5.发明申请公开(公告)号：US20140061707A1
公开(公告)日：2014-03-06
申请号：US14071609
申请日：2013-11-04
CPC分类号： H01L33/642 , H01L24/73 , H01L27/15 , H01L33/08 , H01L33/32 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/58 , H01L33/60 , H01L33/64 , H01L33/641 , H01L33/644 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/8592 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.
摘要翻译： 基于安装在导热发光元件上或内部的LED的固态光源提供对流和辐射冷却。 低成本自冷固体光源可以集成LED和其他半导体器件的电气互连。 导热发光元件可以完全或部分地消除对任何额外的散热装置的需要，通过在足够大的区域上有效地传输和展开在LED和发光元件本身中产生的热量，使得可以使用对流和辐射装置来冷却 设备。
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6.发明申请公开(公告)号：US20140042467A1
公开(公告)日：2014-02-13
申请号：US14042569
申请日：2013-09-30
IPC分类号： H01L33/64
CPC分类号： F21V7/22 , F21K9/20 , F21K9/60 , F21S8/04 , F21S8/046 , F21V23/02 , F21V29/505 , F21Y2115/10 , H01L24/73 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/641 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49107 , H01L2224/8592 , H01L2924/0002 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A solid state light source with LEDs in thermal contact to thermally conductive translucent elements where light emitted from the LEDs is directed to emerge from the heat dissipating surfaces of the elements. The thermally conductive translucent elements are arranged or combined with a reflector to form a light recycling cavity. The outside surfaces of the thermally conductive translucent elements forming the cavity become luminescent as the light emitted by the LEDs on the inside of the cavity is continually reflected and recycled until a very high percentage of the light emitted by the LEDs is eventually transmitted through and emitted uniformly and omnidirectionally. Simultaneously, the heat from the LEDs conducts through and to the luminescent outside surfaces of the elements of the cavity, which radiatively and convectively cool the light source thereby eliminating the need for bulky appended heat sinks.
摘要翻译： 一种固态光源，其具有与导热半透明元件热接触的LED，其中从LED发射的光被引导从元件的散热表面出射。 导热半导体元件与反射器配置或组合以形成光循环腔。 形成空腔的导热半导体元件的外表面变得发光，因为在空腔内部的LED发出的光被连续地反射和再循环，直到由LED发射的光的很大百分比最终被透射并发射 均匀和全方位。 同时，来自LED的热量传导通过空腔的元件的发光外表面，其辐射和对流地冷却光源，从而消除了对大体积的附加散热器的需要。
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公开(公告)号：US20130019927A1
公开(公告)日：2013-01-24
申请号：US13555082
申请日：2012-07-21
CPC分类号： C30B25/186 , C30B19/12 , C30B23/025 , C30B23/08 , C30B25/02 , C30B25/06 , C30B25/105 , C30B29/06 , C30B29/08 , C30B29/16 , C30B29/40 , C30B29/403 , C30B29/406 , C30B29/42 , C30B29/52 , H01L31/028 , H01L31/0296 , H01L31/0304 , H01L31/03044 , H01L31/036 , H01L31/0547 , H01L31/0687 , H01L31/0693 , H01L31/0725 , H01L31/0735 , H01L31/074 , H01L31/18 , H01L31/1804 , H01L31/1808 , H01L31/1812 , H01L31/184 , H01L31/1844 , H01L31/1848 , H01L31/1856 , H01L31/1892 , H01L33/0054 , H01L33/0062 , H01L33/0075 , H01L33/0083 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T428/31678
摘要： Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging.
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公开(公告)号：US20120261703A1
公开(公告)日：2012-10-18
申请号：US13506015
申请日：2012-03-21
CPC分类号： H01L33/502 , F21V23/0471 , H01L33/507 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A self-cooling emitter is a light emitting element embedded within a thermally conductive luminescent element which functions as a thermal cooling means and wavelength conversion of the light emitting element. The thermally conductive luminescent element exhibits a bulk thermal conductivity greater than 1 W/m/K such that there is sufficient thermal spreading of the heat generated by the light emitting element.
摘要翻译： 自冷却发射器是嵌入在导热发光元件内的发光元件，其用作发热元件的热冷却装置和波长转换。 导热发光元件表现出大于1W / m / K的体热导率，使得由发光元件产生的热量具有足够的热扩散。
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公开(公告)号：US08232534B2
公开(公告)日：2012-07-31
申请号：US12806484
申请日：2010-08-12
IPC分类号： H05B33/00
CPC分类号： H05B33/10 , H01L33/508 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.
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10.发明申请Wavelength conversion chip for use with light emitting diodes and method for making same 有权用于发光二极管的波长转换芯片及其制造方法公开(公告)号：US20120086028A1
公开(公告)日：2012-04-12
申请号：US12807770
申请日：2010-09-13
IPC分类号： H01L33/50
CPC分类号： H05B33/14 , H01L33/501 , H01L33/504 , H01L33/505 , H01L33/508 , H01L33/641 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.
摘要翻译： 通过在衬底上沉积波长转换材料以形成层，从衬底去除所得到的波长转换层，然后将波长转换层分割成多个波长转换芯片，形成波长转换芯片。 波长转换材料可以通过热退火或辐射退火进行退火，以提高芯片的波长转换效率或烧结波长转换材料以形成陶瓷材料。 可以在波长转换芯片上制造光学涂层，通孔，光提取元件，电连接或电接合焊盘。
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