公开(公告)号：US20210088208A1

公开(公告)日：2021-03-25

申请号：US17000194

申请日：2020-08-21

申请人： XIAMEN LEEDARSON LIGHTING CO.,LTD

发明人： Shouqiang Hou ,  Xiaoliang Wen ,  Zhenkun Huang

IPC分类号： F21V29/80 ,  F21V29/506

摘要： A cabinet light includes a heat dissipation shell; a light emitting component disposed in the heat dissipation shell; a driving component disposed in the heat dissipation shell and electrically connected to the light emitting component; a sealing end cover disposed on an open at a side of the heat dissipation shell by insertion and comprising a cavity; a cover element detachably disposed on an open at a top of the heat dissipation shell and comprising a light transmission area for light to pass through; a fixing structure disposed between the sealing end cover and the cover element; a piercing conductor disposed in the cavity and configured to pierce insulation layers of wires wherein the wires are placed in the cavity; and a press element disposed on a mouth of the cavity and configured to press the piercing conductor.

公开(公告)号：US10677397B2

公开(公告)日：2020-06-09

申请号：US16032674

申请日：2018-07-11

申请人： Argo Import-Export Ltd.

发明人： Zhang Yingchun

IPC分类号： F21K9/27 ,  F21S4/20 ,  H01R33/96 ,  F21V15/01 ,  F21K9/90 ,  F21V23/00 ,  F21V23/06 ,  H05B45/00 ,  F21V29/506 ,  F21Y103/10 ,  F21Y115/10 ,  F21K9/278 ,  F21V3/06 ,  F21V25/04

摘要： An LED lighting tube including a heat-dissipating tubular envelope having an LED assembly directly affixed to an inner surface of the heat-dissipating tubular envelope. A method of making an LED lighting tube by providing a heat-dissipating tubular envelope, and affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer. A method of providing heat-dissipation without a heat sink in an LED lighting tube by providing a heat-dissipating tubular envelope, affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer, and dissipating heat through the heat-dissipating tubular envelope.

公开(公告)号：US20190316768A1

公开(公告)日：2019-10-17

申请号：US16379171

申请日：2019-04-09

申请人： CANON KABUSHIKI KAISHA

发明人： Keiichiro Saito ,  Yutaka Yamamoto ,  Toshiki Miyakawa

IPC分类号： F21V29/67 ,  F21V5/04 ,  F21V13/02 ,  F21V14/02 ,  F21V29/503 ,  F21V29/504 ,  F21V29/506

摘要： A lighting device that protects a member related to light emission from heat associated with light emission includes a light source, a first optical member configured to transmit light emitted by the light source, a second optical member, arranged between the light source and the first optical member, configured to transmit light emitted by the light source, and an air-sending mechanism configured to send air suctioned from a first space that is an inner space on a side nearer to the light source than the second optical member and includes the light source to a second space that is a space between the first optical member and the second optical member.

公开(公告)号：US10208896B2

公开(公告)日：2019-02-19

申请号：US15114831

申请日：2015-01-27

申请人： SHANGHAI SANSI ELECTRONIC ENGINEERING CO., LTD ,  SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD ,  JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO., LTD

发明人： Bishou Chen ,  Li Xu ,  Peng Wang ,  Xiaoliang He ,  Sheng Li ,  Haibo Liu

IPC分类号： F21K9/232 ,  F21V29/85 ,  F21V29/506 ,  F21V3/02 ,  F21V23/00 ,  F21K9/238 ,  F21K9/235 ,  F21K9/237 ,  B05D3/02 ,  F21V19/00 ,  F21V3/10 ,  F21Y113/00 ,  F21K9/20 ,  F21V29/74 ,  F21V29/83 ,  F21Y115/10 ,  F21V17/10 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  F21V3/06

摘要： An LED light device and a circuit preparation method thereof are provided. The LED light device includes a base, an LED light unit, and a lamp shade. The LED light-emitting unit and the lamp shade are arranged on the base. The lamp shade covers the LED light-emitting unit inside. The circuit preparation method includes following steps of: providing a base which is a physical entity having a three-dimensional structure on the surface thereof; coating a circuit layer on the base surface through a programmable coating equipment, manual coating or the combined mode, wherein the circuit layer is a liquid or powder coating containing metal materials, and the thickness of the circuit layer is 20 μm or more; baking the base coated with the circuit layer at the high temperature of 100-1,000° C. until the circuit layer is dried; and obtaining a base having a three-dimensional circuit after cooling.

公开(公告)号：US10066826B2

公开(公告)日：2018-09-04

申请号：US15014523

申请日：2016-02-03

申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD.

发明人： Tao Jiang

IPC分类号： F21V29/83 ,  F21K9/232 ,  F21V29/506 ,  F21V29/77 ,  F21V23/00 ,  F21V29/503 ,  F21V3/00 ,  F21Y115/10 ,  F21Y107/40

摘要： The LED light bulb comprises an outer case, a heatsink, an LED light module, a power driver and a metallic bulb base. The LED light module includes a circuit board and an LED light source. The outer case includes a plurality of vent apertures. An interior surface of the heatsink defines a heatsinking pathway. The heatsinking pathway and the vent apertures are disposed and configured to provide a convection airflow pathway.

公开(公告)号：US10001249B2

公开(公告)日：2018-06-19

申请号：US15299485

申请日：2016-10-21

申请人： Guan-Jie Luo

发明人： Guan-Jie Luo

IPC分类号： H01L33/64 ,  F21K9/232 ,  F21V29/85 ,  F21K9/238 ,  F21K9/235 ,  B29C39/12 ,  B29C39/26 ,  C09K11/02 ,  C09K11/08 ,  F21V3/02 ,  F21V23/00 ,  F21V23/06 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  F21K9/90 ,  F21K9/64 ,  F21Y115/10 ,  B29L31/34 ,  F21V19/00 ,  H01L25/075 ,  H01L33/48 ,  F21V29/506

CPC分类号： F21K9/232 ,  B29C39/12 ,  B29C39/26 ,  B29K2863/00 ,  B29K2995/0013 ,  B29K2995/0035 ,  B29L2031/34 ,  C08K3/013 ,  C08K2201/001 ,  C09K11/02 ,  C09K11/08 ,  F21K9/235 ,  F21K9/238 ,  F21K9/64 ,  F21K9/90 ,  F21V3/02 ,  F21V3/062 ,  F21V3/08 ,  F21V9/30 ,  F21V19/0045 ,  F21V23/001 ,  F21V23/003 ,  F21V23/06 ,  F21V29/506 ,  F21V29/85 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/501 ,  H01L33/502 ,  H01L33/54 ,  H01L33/62 ,  H01L33/641

摘要： The invention provides a shell integrated light-emitting diode assembly, which includes: a plurality of light-emitting units, each of the light-emitting units including at least one light-emitting chip and an external wiring which is coupled to the light-emitting chip; and a shell structure, formed as a consolidation structure by a molding material for enclosing the light-emitting units to be inside the molding material; wherein the light-emitting units emit light through the molding material into an outside of the shell structure. The present invention also provides a shell integrated light-emitting diode lamp with the shell integrated light-emitting diode assembly, and a manufacturing method for the shell integrated light-emitting diode assembly.

公开(公告)号：US09995437B2

公开(公告)日：2018-06-12

申请号：US15114200

申请日：2015-01-26

申请人： PHILIPS LIGHTING HOLDING B.V.

发明人： Marcellinus Petrus Carolus Michael Krijn ,  Siebe Tjerk De Zwart ,  Tim Dekker ,  Alexander Jacobus Mariette Van Neer ,  Jochen Renaat Van Gheluwe ,  Hendrikus Hubertus Petrus Gommans

IPC分类号： F21K9/235 ,  F21V29/506 ,  F21V29/83 ,  F21K9/232 ,  F21K9/238 ,  F21Y115/10 ,  F21V23/00 ,  F21V3/06 ,  F21V19/00 ,  F21Y107/30

CPC分类号： F21K9/235 ,  F21K9/232 ,  F21K9/238 ,  F21V3/061 ,  F21V19/005 ,  F21V23/005 ,  F21V29/506 ,  F21V29/83 ,  F21Y2107/30 ,  F21Y2115/10

摘要： An LED light bulb has a light emitting bulb part 22 which comprises a central core 24 running from the top towards the bottom and which provides an open passageway at least at the top. The LEDs are mounted in thermal contact around the central core 24. This design provides an air flow to promote cooling of the LEDs. This in turn enables a reduced size and cost of the heat sink, or avoids the need for a heat sink altogether.

公开(公告)号：US09951938B2

公开(公告)日：2018-04-24

申请号：US14062317

申请日：2013-10-24

申请人： David C. Dudik ,  Joshua I. Rintamaki ,  Gary R. Allen ,  Glenn H. Kuenzler

发明人： David C. Dudik ,  Joshua I. Rintamaki ,  Gary R. Allen ,  Glenn H. Kuenzler

IPC分类号： F21V29/00 ,  F21V29/74 ,  F21V29/506 ,  F21V29/75 ,  F21V29/76 ,  F21V29/77 ,  F21V29/80 ,  F21K9/232 ,  F21V29/85 ,  F21V29/87 ,  F21Y115/10

CPC分类号： F21V29/74 ,  F21K9/135 ,  F21K9/232 ,  F21V29/506 ,  F21V29/75 ,  F21V29/76 ,  F21V29/77 ,  F21V29/80 ,  F21V29/86 ,  F21V29/87 ,  F21Y2115/10

摘要： A light emitting apparatus comprising an at least substantially omnidirectional light assembly including an LED-based light source within a light-transmissive envelope. Electronics configured to drive the LED-based light source, the electronics being disposed within a base having a blocking angle no larger than 45°. A plurality of heat dissipation elements (such as fins) in thermal communication with the base and extending adjacent the envelope.

公开(公告)号：US09709259B2

公开(公告)日：2017-07-18

申请号：US14646534

申请日：2013-09-18

申请人： PHILIPS LIGHTING HOLDING B.V.

发明人： Reinier Imre Anton Den Boer ,  Peter Johannes Martinus Bukkems ,  Johannes Petrus Maria Ansems

IPC分类号： F21V29/00 ,  F21V29/70 ,  F21K9/90 ,  F21V29/507 ,  F21V29/503 ,  F21K9/23 ,  F21V14/02 ,  F21V19/00 ,  F21V23/00 ,  F21V29/506 ,  F21V3/02 ,  H05K1/18 ,  F21Y101/00 ,  F21Y115/10 ,  F21Y107/40

CPC分类号： F21V29/70 ,  F21K9/23 ,  F21K9/238 ,  F21K9/90 ,  F21V3/02 ,  F21V14/02 ,  F21V19/004 ,  F21V23/005 ,  F21V29/004 ,  F21V29/20 ,  F21V29/503 ,  F21V29/506 ,  F21V29/507 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10106

摘要： The present invention relates to a lighting device (100) (100), comprising at least one light emitting element (102) configured to emit light, a housing (300) having an elongated hollow base portion (302) and a light exit portion (304), wherein the elongated hollow base portion (302) has a polygonal cross section, and a heat transferring arrangement (200) formed from a folded sheet of a thermo conducting material inserted into and fixed inside of the housing (300), the heat transferring arrangement (200) comprising a first section (202) onto which the light emitting element (102) is arranged and adapted to receive heat generated from the at least one light emitting element (102) when emitting light, and a second section (204) having an outer surface which once fixed inside of the housing (300) is formed to be in abutment with an inner surface of the elongated hollow base portion (302) of the housing (300), so that the generated heat is thermally transferred to the housing (300). The present invention also relates to a corresponding method for forming a lighting device (100).

公开(公告)号：US09541274B2

公开(公告)日：2017-01-10

申请号：US13322579

申请日：2010-05-11

申请人： Ralph Bertram ,  Tobias Frost ,  Christian Herbold ,  Steffen Strauss

发明人： Ralph Bertram ,  Tobias Frost ,  Christian Herbold ,  Steffen Strauss

IPC分类号： F21V21/00 ,  F21V29/70 ,  F21S4/00 ,  F21V23/02 ,  F21V29/00 ,  F21V7/00 ,  F21V29/74 ,  H05K1/18 ,  F21V3/04 ,  F21V7/22 ,  F21V29/506 ,  F21Y101/00

CPC分类号： F21V29/70 ,  F21S4/20 ,  F21V3/061 ,  F21V3/062 ,  F21V7/005 ,  F21V7/22 ,  F21V23/02 ,  F21V29/004 ,  F21V29/20 ,  F21V29/506 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10106

摘要： An illumination module may include at least one flexible carrier for a plurality of heat sources, including light sources, wherein the carrier is provided for being bent over at least part of its width.

摘要翻译： 照明模块可以包括用于多个热源的至少一个柔性载体，包括光源，其中所述载体设置成在其宽度的至少一部分上弯曲。